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TI and Industry Leaders Strategize Future of Mobile Internet at OMAP™ Technology Summit in Taipei
TI Chief Operating Officer, Rich Templeton, Addresses Taiwan's Senior Electronics Executives
TAIWAN (August 28, 2001) -- Top executives from Texas Instruments (NYSE:TXN) (TI) and leading Taiwanese electronics companies gathered together today to strategize the future of the mobile Internet at the TI OMAP(tm) Technology Summit in Taipei. Leading wireless device and equipment manufacturers, third parties and applications developers participated in a summit on TI's OMAP platform and gave their support for it as the optimal solution for driving real-time communications and system performance for their upcoming handsets and Internet appliances.
Rich Templeton, TI's chief operating officer (COO) and executive vice president delivered the keynote at today's event, praising Taiwan manufacturers' effort in moving beyond concepts to actual design and development of new wireless handheld information appliances.
"In the past 10 years, we've seen beyond doubt that the Internet is the future of information technology, and looking forward, mobility is the future of the Internet," said Rich Templeton, TI COO. "Wireless phones outsold PCs for the first time last year, and virtually all analysts agree that within the next few years, portable Internet appliances will become the preferred tools for Internet access on a global basis. Leading companies in Taiwan and worldwide have recognized TI's power to enable their next-generation wireless devices."
During today's event, TI disclosed its OMAP platform of advanced silicon and software has won more than 10 new designs in Asia, further reinforcing the OMAP platform position as the de facto standard for 2.5 and 3G. These companies join other manufacturers such as Nokia, Ericsson, Sendo, Sony and several other industry leaders worldwide, who have already chosen to integrate TI's OMAP technology in their 2.5 and 3G designs.
Among the Asian companies who have selected TI's OMAP platform for their mobile Internet devices include industry leaders such as Acer Communications & Multimedia Inc., ASUSTek Computer Inc., Chi Mei Communication Systems, Inc., Compal Communications Inc., Compal Electronics Inc., GVC Corporation, High Tech Computer Corporation, Quanta Computer, LG and ZTE, just to name a few. With today's announcement, TI continues its leadership with design wins and endorsements from Taiwanese manufacturers.
In a concurrent technical symposium, more than 500 Taiwan-based design engineers, software developers and electronics company managers met with TI to discuss the requirements of next-generation handheld devices and the OMAP platform's ability to meet those demands. Microsoft Embedded Systems Group vice president, Phillip Swan, addressed a roundtable of senior executives, sharing his views of the mobile Internet.
"The next generation of wireless communications will bring a variety of new and exciting services, enabling an enhanced mobile experience for both corporate customers and consumers," said Phillip Swan, vice president Embedded Systems Group at Microsoft. "TI's proven OMAP architecture combined with products like Microsoft's smart phone software platform, codename "Stinger," will drive innovation in next generation wireless communications ultimately enabling customers to truly access their critical information anytime, anywhere."
The OMAP platform is a scalable, open architecture that supports real-time communications and multimedia processing in handheld devices. The open platform supports all major wireless operating systems, including Windows® CE, Symbian, Palm and Sun's Java™. It also supports the primary multimedia enablers such as Windows Media, Java, PacketVideo and Real Networks. TI's platform is a family of processors that are optimized to provide high-performance real-time signal processing as well as extended battery life, both of which are essential for new wireless communications devices.
OMAP development tools make it easy for applications developers to take advantage of the real-time processing power of TI's DSPs. Once developed, these applications can be ported to any device that contains an OMAP processor, including smart phones, PDA/communicators and wireless devices yet to be developed.
"TI's OMAP processors are available today, which has allowed Taiwan's electronics industry to quickly jump into the new world of wireless communications," said Dr. Yuan-Shian Shu, director-general of Taiwan's Industrial Development Bureau (IDB). "Taiwan companies establishing their own design and development capabilities for the mobile Internet era is very important as we transition from the PC era to a communications-centric world."
Top executives from a wide variety of major Taiwanese equipment manufacturers, third parties and applications developers endorsed the OMAP platform during the summit. In addition the many companies across Asia supporting OMAP, the Taiwan-based companies include:
Device and equipment manufacturers: Acer Communications & Multimedia Inc., Arima Communication Corp., ASUSTeK Computer Inc., Compal Communications Inc., DBTel Incorporated, GVC Corporation, High Tech Computer, Corp., Quanta Computer Inc., Inventec Corp., Tecom Co., Ltd., Chi Mei Communication Systems, Inc., Ares Communications Tech. Inc., Inventec Multimedia & Telecom Corporation, Inventec Appliances Corp., TelePaq Technology Inc., Inventec Besta Co., Ltd., FIC Inc., Mitac-Synnex Grou,p, and Universal Scientific Industrial Co., Ltd., Application and middleware developers: AM ROAD Electronics Co., Ltd., Ultima Electronics Corp., ProSense Technology Corp. and Chanceux Co.; Research Institute: Embedded System Lab, Institute for Information Industry
TI introduced OMAP technology to Taiwan manufacturers last August when the company signed a Memorandum of Understanding (MOU) with the IDB to collaborate in promoting the effective usage of TI's DSP technology in Taiwan. In March this year, TI opened an Information Appliance (IA) Design Center in Taiwan to strengthen applications engineering support for local original equipment manufacturers (OEMs).
For manufacturers and developers creating wireless communications solutions, only TI's advanced silicon and software platforms deliver the optimal performance, lower power consumption and system level integration required to rapidly deploy differentiated next-generation wireless devices and software applications.
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Trademarks:
OMAP is a trademark of Texas Instruments Incorporated.
Java is a trademark of Sun Microsystems.
Windows is a registered trademark of Microsoft Corp.
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