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>> Semiconductor Home > Products > Packaging Information >

Package Selection Guide:    > by Package Type    > by JEDEC Code    > by Package Pitch    > by Package Max Height    > by TI Package Designator > Devices by Package    Designator > Related Documents Packaging Terminology    > BGA    > CBGA    > CDIP    > CDIP SB    > CFP    > CPGA    > CZIP    > Description    > DFP    > DIMM*    > FC/CSP    > HLQFP    > HQFP    > HSOP    > HSSOP*    > HTQFP    > HTSSOP    > HVQFP    > JEDEC    > JLCC    > LCCC    > Length*    > LGA    > LPCC*    > LQFP    > Maximum Height*    > MCM*    > MQFP*    > OPTO*    > PDIP    > PFM    > Pins    > Pitch    > Pkg    > PLCC*    > PPGA*    > Preference Code    > QFP    > SDIP*    > SIMM*    > SIP    > SODIMM*    > SOJ    > SOP    > SSOP    > TFP    > Thickness    > TO/SOT    > TQFP    > TSOP*    > TSSOP    > TVFLGA    > TVSOP    > Type    > VQFP    > VSOP*    > Width*    > XCEPT* * Additional types used in   Package Designator Tables -   These all are marked "DO   NOT USE." > Lead-Free Process Solutions

Package Terminology BGA Ball Grid Array CBGA Ceramic Ball Grid Array CDIP Glass-Sealed Ceramic Dual In-Line Package CDIP SB Side-Braze Ceramic Dual In-Line Package CFP Both Formed and Unformed CFP CPGA Ceramic Pin Grid Array CZIP Ceramic Zig-Zag Package Description Description of package type. DFP Dual Flat Package FC/CSP Flip Chip / Chip Scale Package HLQFP Thermally Enhanced Low Profile QFP HQFP Thermally Enhanced Quad Flat Package HSOP Thermally Enhanced Small-Outline Package HTQFP Thermally Enhanced Thin Quad Flat Pack HTSSOP Thermally Enhanced Thin Shrink Small-Outline Package HVQFP Thermally Enhanced Very Thin Quad Flat Package JEDEC The JEDEC Standard for this package type. JLCC J-Leaded Ceramic or Metal Chip Carrier LCCC Leadless Ceramic Chip Carrier Length The length of the device (in millimeters). LGA Land Grid Array LQFP Low Profile Quad Flat Pack Maximum Height The maximum height above board surface form (in millimeters). PDIP Plastic Dual-In-Line Package PFM Plastic Flange Mount Package Pkg Package designator code used in Texas Instruments part numbers. The link from the Pkg code goes to the package mechanical drawing in PDF format. Each of the PDF files is between 30K and 50K Bytes. Pins The number of pins or terminals on the package. Pitch The distance between the centers of adjacent pins (in millimeters). Preference Code P - Preferred Package. Package is qualified and orderable. OK - Use if a preferred package is not available A - Requires department/business unit approval. N - Not recommended for new designs. X - Do not use. No longer supported. Not qualified. No longer tooled. QFP Quad Flat Package SIP Single-In-Line Package SOJ J-Leaded Small-Outline Package SOP Small-Outline Package (Japan) SSOP Shrink Small-Outline Package TFP Triple Flat Pack TO/SOT Cylindrical Package TQFP Thin Quad Flat Package TSSOP Thin Shrink Small-Outline Package TVFLGA Thin Very-Fine Land Grid Array TVSOP Very Thin Small-Outline Package Thickness The maximum thickness of the package body (in millimeters). Type The abbreviated acronymn for this type of package. VQFP Very Thin Quad Flat Package Width The width of the device (in millimeters). *Additional types used in Package Designator Tables - These all are marked "DO NOT USE." DIMM* Dual-In-Line Memory Module HSSOP* Thermally Enhanced Shrink Small-Outline Package LPCC* Leadless Plastic Chip Carrier MCM* Multi-Chip Module MQFP* Metal Quad Flat Package OPTO* Light Sensor Package PLCC* Plastic Leaded Chip Carrier PPGA* Plastic Pin Grid Array SDIP* Shrink Dual-In-Line Package SIMM* Single-In-Line Memory Module SODIMM* Small Outline Dual-In-Line Memory Module TSOP* Thin Small-Outline Package VSOP* Very Small Outline Package XCEPT* Exceptions - May not be a real Package Note: In the event of a conflict in dimensions this selection guide and the mechanical drawing, the mechanical drawing shall govern.