Packaging terminology

Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.

Common package types

  • BGA - Ball Grid Array
  • CFP - Both Formed and Unformed CFP = Ceramic Flat Pack
  • CGA - Column Grid Array
  • COF - Chip on Flex
  • COG - Chip on Glass
  • DIP - Dual In-Line Package or Dual Row Package
  • DLP - Digital Light Processing
  • DSBGA - Die Size Ball Grid Array, also referred to as WCSP = Wafer Chip Scale Package
  • FCBGA - Flip Chip Ball Grid Array
  • FCCSP - Flip Chip Chip Scale Package
  • LCC - Leaded Chip Carrier
  • LGA - Land Grid Array
  • Module - Module
  • nFBGA - New Fine Pitch Ball Grid Array
  • NFMCA-LID - Substrate Metal Cavity with Lid
  • OPTO - Light Sensor Package = optical
  • PBGA - Plastic Ball Grid Array
  • PFM - Plastic Flange Mount Package
  • PGA - Pin Grid Array
  • POS - Package on Substrate
  • QFN - Quad Flatpack No Lead
  • QFP - Quad Flat Package
  • SIP Modules - System in Package Modules
  • SIPP - Single-In-Line Pin Package
  • SO - Small Outline
  • SON - Small Outline No Lead, also referred as DFN = Dual Flatpack No Lead
  • TO - Transistor Outlines, also referred to as I2PAC or D2PAC
  • uCSP - Micro Chip Scale Package
  • WCSP - Wafer Chip Scale Package, also referred to as DSBGA
  • ZIP - Zig-Zag In-Line

Package families

  • CBGA - Ceramic Ball Grid Array
  • CDIP - Glass-Sealed Ceramic Dual In-Line Package
  • CDIP SB - Side-Braze Ceramic Dual In-Line Package
  • CPGA - Ceramic Pin Grid Array
  • CZIP - Ceramic Zig-Zag Package
  • DFP - Dual Flat Package
  • DIMM - Dual-In-Line Memory Module
  • FC/CSP - Flip Chip / Chip Scale Package
  • HLQFP - Thermally Enhanced Low Profile Quad Flat Package
  • HQFP - Thermally Enhanced Quad Flat Package
  • HSOP - Thermally Enhanced Small-Outline Package
  • HSSOP - Thermally Enhanced Shrink Small-Outline Package
  • HTQFP - Thermally Enhanced Thin Quad Flat Pack
  • HTSSOP - Thermally Enhanced Thin Shrink Small-Outline Package
  • HVQFP - Thermally Enhanced Very Thin Quad Flat Package
  • JLCC - J-Leaded Ceramic or Metal Chip Carrier
  • LCCC - Leadless Ceramic Chip Carrier
  • LPCC - Leadless Plastic Chip Carrier
  • LQFP - Low Profile Quad Flat Pack
  • MCM - Multi-Chip Module
  • MQFP - Metal Quad Flat Package
  • PDIP - Plastic Dual-In-Line Package
  • PLCC - Plastic Leaded Chip Carrier
  • PPGA - Plastic Pin Grid Array
  • SDIP - Shrink Dual-In-Line Package
  • SIMM - Single-In-Line Memory Module
  • SODIMM - Small Outline Dual-In-Line Memory Module
  • SOJ - J-Leaded Small-Outline Package
  • SOP - Small-Outline Package (Japan)
  • SSOP - Shrink Small-Outline Package
  • TQFP - Thin Quad Flat Package
  • TSOP - Thin Small-Outline Package
  • TSSOP - Thin Shrink Small-Outline Package
  • TVFLGA - Thin Very-Fine Land Grid Array
  • TVSOP - Very Thin Small-Outline Package
  • VQFP - Very Thin Quad Flat Package
  • VSOP - Very Small Outline Package
  • VSSOP - Very Thin Shrink Small Outline Package, also referred as MSOP = Micro Small Outline Package
  • XCEPT - Exceptions - May not be a real Package

Terms

  • Assembly site - The plant location(s) where a TI device is assembled.
  • Coplanarity - The bottom surface of the package is parallel to the landing surface of the PCB.
  • Eligibility - The device can be added to the ESL list immediately.
  • ePOD - Enhanced Package Outline Drawing (Typically includes package outline, land pattern, and stencil design).
  • Extended shelf life - TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.
  • Footprint - The periphery leads and thermal pad of a "no-lead" package.
  • JEDEC - The JEDEC Standard for this package type.
  • Land pattern - The pattern of solderable area on the PCB where a "no-lead" package may rest.
  • Lead finish/Ball material - The current metal finish on the leads or solder balls of a device.
  • Length - The length of the device (in millimeters).
  • Mass (mg) - Representative device weight (per part) in milligrams.
  • Maximum height - The maximum height above board surface form (in millimeters).
  • MSL rating/Peak reflow - The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL rating/Peak reflow are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.
  • Package | Pins - The TI package designator or package name for a device, or the number of pins for a device.
  • Pins - The number of pins or terminals on the package.
  • Pitch - The distance between the centers of adjacent pins (in millimeters).
  • Pkg - Package designator code or package name used in TI part numbers.
  • PN type - Indicates whether the part number is Pb-Free or standard.
  • PPM to Mass Percentage conversion table - Parts per million (PPM) to mass % table:
    • 1 ppm = 0.0001 %
    • 10 ppm = 0.001 %
    • 100 ppm = 0.01 %
    • 1000 ppm = 0.1 %
    • 10000ppm = 1.0 %
  • Recyclable metals - ppm - The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. TI reports values at the mass (mg) and ppm level. For WEEE, ppm calculations are at the component level. An example for calculating the ppm gold content follows.
    • Example: ppm = 1,000,000 * total amount of gold in component (mg) / total component weight (mg).
    • Gold mass = 0.23mg & Component mass = 128mg.
    • 1,000,0000 * 0.23 mg gold / 128mg component = 1,797 ppm
  • RoHS restricted substances – ppm calculation. The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance.
    • PPM = (mass of substance / mass of material) * 1,000,000 * total amount of each RoHS substance contained in the material.
    • EXAMPLE: Lead (Pb) in leadframe example: (mass of Lead: 0.006273 mg / total mass of leadframe: 62.730001mg) * 1,000,000 = 100 ppm
  • Search part number - The TI or customer part number entered on the initial Search page.
  • Thermal pad = Exposed pad = Power pad - The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements.
  • Thickness - The maximum thickness of the package body (in millimeters).
  • TI part number - The part number to use when placing orders.
  • Total device mass (mg) - Weight of the component in milligrams.
  • Type - The abbreviated acronymn for this type of package, also referred as Package Family.
  • Width - The width of the device (in millimeters).
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