Application Reports:
Electrostatis Discharge (ESD) - (ssya008.pdf)
12 mm Tape-and-Reel Component - Delivery System - (slza001.pdf)
K-Factor Test-Board Design Impact on Thermal Impedance Measurements - (scaa022a.pdf)
Recent Advancements in Bus-Interface Packing and Processing - (scza001a.pdf)
Shelf-life Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits - (szza002.pdf)
Steam-age Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits - (szza004.pdf)
Package Thermal Characterization Methodologies - (szza003.pdf)
Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs - (szza017a.pdf)
Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices - (scza005b.pdf)
Thermal Derating Curves for Logic-Products Packages - (szza013a)
Thin Very Small Outline Packages (TVSOP) Application Brief - (scza009c.pdf)
PowerPad Thermally Enhanced Package Application Report - (slma002.pdf)
Palladium Lead Finish User's Manual - (pallead.pdf)
TMS320C6x Thermal Design Considerations - (spra432.pdf)
Calculation of TMS320C2xx Power Dissipation - (spra088.pdf)
32-Bit Logic Families in LFBGA Packages - (scea014.pdf)
Semiconductor Packing Methodology - (szza021a)
Other Semiconductor Application Reports
Reference Guides:
MicroStar BGA Packaging Reference Guide - (ssyz015b.pdf)
Low-Profile, Fine-Pitch Ball Grid Array (LFBGA)
PowerFLEX™ Surface Mount Power Packaging - (slit115a.pdf)
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