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   TI Unpackaged Die Products

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   Die Solutions from Texas Instruments
Wafers Electronic products and systems designed today are smaller and lighter, yet offer ever increasing functionality. Integrated circuit (IC) enhancements enable Multichip Module (MCM) designers to improve performance and incorporate more features without trade offs in power consumption and interconnect parasitics.
The continuing drive for technology enhancements in automotive, computing, communication, defense and entertainment products places significant demand for utilization of bare die (unpackaged IC's) without sacrificing functionality, ease-of-use and cost.
Texas Instruments (TI) leadership in IC technology, extraordinary quality initiatives, and alliance with strategic partners illustrates TI's capability to fulfill this demand and meet the needs for systems designers, today and tomorrow. Due to the diversity in processing technologies, product life cycles and circuit complexity, there is no single solution for meeting all the processing and testing requirements of bare die. Leveraging technology and quality as TI's core competencies and aligning the expertise in die handling and testing of Chip Supply, our master die distributor, we have a complete set of products to offer in die form that meet the expectations of system designers.
TI provides additional value to its existing IC technology and wafer fabrication processes by employing various screening methodologies based on the maturity and complexity of the product, as well as customer requirements. Processes employed by TI include DC probe, AC/DC probe at temperature, and full package-level screening including burn-in through the use of special carrier technologies or temporary packages.
TI die products are available for commercial, industrial, automotive, and military applications. For customer convenience, all FlexSi™ Die options are available through all authorized TI sales channels. Die availability, Data sheet information and die maps are also available through all authorized TI sales channels.
TI is a member of the Die Products Consortium (DPC), which is a cooperative effort among several leading microelectronics companies to advance the development of a support infrastructure that will accelerate the adoption of die products by electronic system manufacturers worldwide. The consortium is being managed by MCC, recognized as a global leader in KGD technology. The DPC mission is to provide leadership to the IC industry for developing methods that promote improved die product (including flip chip) quality, reliability, handling, shipping, and associated infrastructure at lowest cost to meet the needs of users for smaller form factor, higher performance, lower cost products.