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The TI Advantage

It's important for PCs and video displays manufacturers to be able to rely upon silicon suppliers who have the versatility and depth of technology to provide leadership solutions, no matter which standards prove successful in the market.

Texas Instruments recognizes this need. In early 2000, TI announced the newly created Display Solutions Business Unit (DSBU), an organization formed specifically to address the growing market for digital video display solutions. The DSBU has responded by offering product families that support PCs and digital displays.

TI's DSBU leverages their extensive knowledge of the display market, system-level display expertise, leading-edge analog and high-speed digital design, strength in silicon process technology, and worldwide support and manufacturing, to bring leadership solutions to TI display customers.

The company is already the world leader for supplying LCD drivers and other display components. In addition, TI's FlatLink™ product family supplies solutions for the low-voltage differential signaling (LVDS) video interfaces that serve as a de facto standard for notebook PCs today.

TI technology is well suited to the needs of the display business. For example, the logic in the new mini-LVDS timing controllers and PanelBus™ products are implemented in 0.18-micron CMOS technology, with a core running at just 1.8 volts -- a leading-edge technology among mixed-signal processes. The resulting savings in silicon size and power consumption add value for manufacturers, just as the high performance of the process enables extremely high-speed, high-definition displays.

And TI continues to push the performance of digital signal processing and transmission to previously unreachable levels. With the increase in processing speeds comes a dramatic decrease in power consumption and per-unit pricing. To continue innovating at this incredible pace, a leading-edge silicon producer like TI must invest hundreds of millions of dollars in fundamental silicon technology.

We use those investments to push the envelope on process technology - the lithography processes that make it possible to pack more and more transistors into less and less space. In fact, by 2010, we expect to be able to put dozens of DSPs, each with 500 million transistors, onto a single chip.

In addition, TI's large infrastructure guarantees our ability to handle high-volume capacity. TI owns semiconductor fabs, assembly, and test facilities around the world. Our huge investments in process technology and manufacturing capacity are what turn an aggressive product roadmap into the actual semiconductor products you need, when you need them.

The depth of our technology at TI has enabled the launch of mini-LVDS and PanelBus™ products at once, with others to be announced throughout 2001 and beyond. The same technologies that enable these solutions will also allow TI to provide solutions for high-definition digital video displays in other applications, such as home entertainment systems, as market demand increases in those areas.