Packaging Information for Industry Standard Term: LCCC

Pkg Pins Footprint Type Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 Maximum Height
(mm)		 JEDEC
FD 20   LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.83 1.27 3.05 S-CQCC-N
FD 28   LCCC Ceramic, Metal Chip Carrier 11.43 11.43 1.83 1.27 3.05 S-CQCC-N
FD 44   LCCC Ceramic, Metal Chip Carrier 16.51 16.51 2.4 1.27 3.05 S-CQCC-N
FD 52   LCCC Ceramic, Metal Chip Carrier 19.05 19.05 2.57 1.27 3.05 S-CQCC-N
FD 68   LCCC Ceramic, Metal Chip Carrier 24.11 24.11 2.57 1.27 3.05 S-CQCC-N
FD 84   LCCC Ceramic, Metal Chip Carrier 29.21 29.21 2.57 1.27 3.05 S-CQCC-N
FE 18   LCCC Ceramic, Metal Chip Carrier 7.37 9.02 1.7 1.27 2.21 R-CQCC-N
FE 28   LCCC Ceramic, Metal Chip Carrier 8.89 13.97 1.83 1.27 2.21 R-CQCC-N
FE 32   LCCC Ceramic, Metal Chip Carrier 11.43 13.97 1.83 1.27 2.21 R-CQCC-N
FK 20   LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.83 1.27 2.03 S-CQCC-N
FK 28   LCCC Ceramic, Metal Chip Carrier 11.43 11.43 1.83 1.27 2.03 S-CQCC-N
FK 44   LCCC Ceramic, Metal Chip Carrier 16.51 16.51 1.83 1.27 2.03 S-CQCC-N
FK 52   LCCC Ceramic, Metal Chip Carrier 19.05 19.05 1.83 1.27 2.03 S-CQCC-N
FK 68   LCCC Ceramic, Metal Chip Carrier 24.11 24.11 1.83 1.27 2.03 S-CQCC-N
FK 84   LCCC Ceramic, Metal Chip Carrier 29.21 29.21 1.83 1.27 2.03 S-CQCC-N
FLN 355   LCCC Ceramic, Metal Grid Array 42.16 42.16 2.69 0 4.07 R-CLGA-N
FLP 203   LCCC Ceramic, Metal Chip Carrier 31.75 40.64 6.01 2.54 6.6 R-CLCC-N
FQA 46   LCCC Ceramic, Metal Grid Array 15.5 9 4.23 .5 5.38 R-CLGA-N
FQD 98   LCCC Ceramic, Metal Grid Array 9.1 20.7 3.3 .742 3.58 R-CLGA-N
FQE 80   LCCC Plastic Grid Array 9.1 20.7 3.3 .4 3.58 R-PLGA-P
NAJ 20   LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.753 1.27 1.905 S-CLCC-N