Contact Us
|
TI Worldwide
: United States
|
my.TI Login
All Searches
Packaging Information for Maximum Height: 1.57 mm
Pkg
Pins
Footprint
Type
Industry Standard Term
Description
Width
(mm)
Length
(mm)
Thickness
(mm)
Pitch
(mm)
JEDEC
GND
276
BGA
BGA
Plastic Grid Array
26
26
.94
1
S-PBGA-N
GND
352
BGA
BGA
Plastic Grid Array
26
26
.94
1
S-PBGA-N