Packaging Information for Maximum Height: 1.7 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
DDA 8   HSOP HSOP Plastic Small Outline 3.9 4.89 1.48 1.27 R-PDSO-G
GGN 256   BGA BGA Plastic Grid Array 27 27 .9 1.27 S-PBGA-N
GGP 352   BGA BGA Plastic Grid Array 35 35 .91 1.27 S-PBGA-N
GGQ 432   BGA BGA Plastic Grid Array 40 40 .91 1.27 S-PBGA-N
GGR 520   BGA BGA Plastic Grid Array 40 40 .91 1.27 S-PBGA-N
GGS 600   BGA BGA Plastic Grid Array 45 45 .91 1.27 S-PBGA-N
GJQ 256   BGA BGA Plastic Grid Array 27 27 .97 1.27 S-PBGA-N
VG 100   HLQFP HLQFP Plastic Flat Pack 14.15 14.15 1.4 .5 S-PQFP-G