Packaging Information for Maximum Height: 2.13 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GFM 225   BGA BGA Plastic Grid Array 27 27 1.53 1.5 S-PBGA-N
NWA 169   BGA BGA Plastic Grid Array 23 23 1.53 1.5 S-PBGA-N