Packaging Information for Maximum Height: 2.29 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GKN 352   BGA BGA Plastic Grid Array 27 27 1.69 1 S-PBGA-N
GKQ 792   BGA BGA Plastic Grid Array 40 40 1.54 1 S-PBGA-N
GKQ 896   BGA BGA Plastic Grid Array 40 40 1.54 1 S-PBGA-N
GNH 480   BGA BGA Plastic Grid Array 35 35 1.7 1 S-PBGA-N
NAF 20   CFP CFP Ceramic, Metal Flat Pack 6.756 13.716 1.905 1.27 R-CDFP-N
W 24   CFP CFP Ceramic, Glass Flat Pack 9.09 14.36 1.72 1.27 R-GDFP-F