Packaging Information for Maximum Height: 2.4 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GNM 144   CBGA CBGA Ceramic, Metal Grid Array 12 12 1.9 .8 S-CBGA-N
NXA 292   BGA BGA Plastic Grid Array 27 27 2.38 1.27 S-PBGA-N