Packaging Information for Maximum Height: 2.7 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GNP 432   BGA BGA Plastic Grid Array 40 40 2 1.27 S-PBGA-N
GNP 520   BGA BGA Plastic Grid Array 40 40 2 1.27 S-PBGA-N
GNP 600   BGA BGA Plastic Grid Array 40 40 2 1.27 S-PBGA-N
HS 100   CFP CFP Ceramic, Glass Flat Pack 14 20 2.4 .65 R-GQFP-F
PJS 48   QFP QFP Plastic Flat Pack 12.1 12.1 2.6 .8 S-PQFP-G