Packaging Information for Maximum Height: 2.8 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GDK 532   FC/CSP FC/CSP Plastic Grid Array 23 23 1.8 .8 S-PBGA-N
GDK 548   FC/CSP FC/CSP Plastic Grid Array 23 23 1.8 .8 S-PBGA-N
GNZ 480   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
GNZ 532   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
GNZ 548   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
GNZ 352   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
GTS 288   FCBGA FCBGA Plastic Grid Array 23 23 1.9 1.27 S-PBGA-N
HKP 84   CFP CFP Ceramic, Metal Flat Pack 13.81 13.81 1.9 .5 S-CQFP-G
HKQ 8   CFP CFP Ceramic, Metal Flat Pack 5.65 6.9 2.65 1.27 R-CDFP-G
ZNZ 352   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
ZNZ 480   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
ZNZ 532   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
ZNZ 548   FCBGA FCBGA Plastic Grid Array 27 27 2.2 1 S-PBGA-N
ZTS 288   FCBGA FCBGA Plastic Grid Array 23 23 1.9 1 S-PBGA-N