Packaging Information for Maximum Height: 3 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
DCW 28   SOP SOP Plastic Small Outline 8.4 18.3 2.6 1.27 R-PDSO-G
GLS 384   FCBGA FCBGA Plastic Grid Array 18 18 2.4 .8 S-PBGA-N
HFQ 84   CFP (TBAR) CFP (TBAR) Ceramic, Metal Flat Pack 13.8 13.8 2.67 .5 S-CQFP-F
NSD 256   FCBGA FCBGA Ceramic, Metal Grid Array 17 17 3 1 S-CBGA-N
ZYR 676   FCBGA FCBGA Plastic Grid Array 27 27 2.18 1 S-PBGA-N