Packaging Information for Maximum Height: 3.05 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
FD 20   LCCC LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.83 1.27 S-CQCC-N
FD 28   LCCC LCCC Ceramic, Metal Chip Carrier 11.43 11.43 1.83 1.27 S-CQCC-N
FD 44   LCCC LCCC Ceramic, Metal Chip Carrier 16.51 16.51 2.4 1.27 S-CQCC-N
FD 52   LCCC LCCC Ceramic, Metal Chip Carrier 19.05 19.05 2.57 1.27 S-CQCC-N
FD 68   LCCC LCCC Ceramic, Metal Chip Carrier 24.11 24.11 2.57 1.27 S-CQCC-N
FD 84   LCCC LCCC Ceramic, Metal Chip Carrier 29.21 29.21 2.57 1.27 S-CQCC-N
HKN 14   CFP CFP Ceramic, Metal Flat Pack 8 20 2.05 1.02 S-CDFP-G
WD 48   CFP CFP Ceramic, Glass Flat Pack 9.66 15.88 2.48 .635 R-GDFP-F
WD 56   CFP CFP Ceramic, Glass Flat Pack 9.66 18.42 2.48 .635 R-GDFP-F