Packaging Information for Maximum Height: 3.3 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
CLZ 532 FC/CSP FC/CSP Plastic Grid Array 23 23 2.65 .8 S-PBGA-N
GLK 567   CBGA CBGA Ceramic, Metal Grid Array 31 31 2.7 1.27 S-CBGA-N
GLP 429 FC/CSP FC/CSP Ceramic, Metal Grid Array 27 27 2.7 1.27 S-CBGA-N
GLZ 532 FCBGA FCBGA Plastic Grid Array 23 23 2.65 .8 S-PBGA-N
GUN 561   FCBGA FCBGA Plastic Grid Array 23 23 2.65 .8 S-PBGA-N
HFG 132   CFP CFP Ceramic, Metal Flat Pack 24.13 24.13 2.67 .64 S-CQFP-F
HFG 132   CFP CFP Ceramic, Metal Flat Pack 24.13 24.13 2.67 .64 S-CQFP-F
HFG 164   CFP CFP Ceramic, Metal Flat Pack 29.09 29.09 2.67 .64 S-CQFP-F
HFG 164   CFP CFP Ceramic, Metal Flat Pack 29.09 29.09 2.67 .64 S-CQFP-F
HFG 172   CFP CFP Ceramic, Metal Flat Pack 29.09 29.09 2.67 .64 S-CQFP-F
HFG 100   CFP CFP Ceramic, Metal Flat Pack 24 24 3.05 .64 S-CQFP-F
HT 84   CFP CFP Ceramic, Metal Flat Pack 16.51 16.51 2.67 .64 S-CQFP-F
HT 132   CFP CFP Ceramic, Metal Flat Pack 24.07 24.07 2.67 .64 S-CQFP-F
ZLZ 532 FCBGA FCBGA Plastic Grid Array 23 23 2.65 .8 S-PBGA-N
ZUN 561   FCBGA FCBGA Plastic Grid Array 23 23 2.65 .8 S-PBGA-N