Packaging Information for Maximum Height: 3.5 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GFX 352   BGA BGA Plastic Grid Array 35 35 3 1.27 S-PBGA-N
GJC 352 FC/CSP FC/CSP Plastic Grid Array 35 35 3 1.27 S-PBGA-N
GLC 587   BGA BGA Plastic Grid Array 37.5 37.5 2 1.27 S-PBGA-N
GTU 480   FCBGA FCBGA Plastic Grid Array 23 23 1.9 1.27 S-PBGA-N
GTZ 737   FCBGA FCBGA Plastic Grid Array 24 24 2.65 .8 S-PBGA-N
GTZ 697 FCBGA FCBGA Plastic Grid Array 24 24 2.65 .8 S-PBGA-N
ZTZ 697 FCBGA FCBGA Plastic Grid Array 24 24 2.65 .8 S-PBGA-N
ZTZ 737   FCBGA FCBGA Plastic Grid Array 24 24 2.65 .8 S-PBGA-N