Packaging Information for Maximum Height: 3.68 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
EQJ 8   Through-Hole Module Through-Hole Module Plastic Special Shape 22.9 58.4 10.1 3.8 R-PDSS-T
FJ 44   JLCC JLCC Ceramic, Metal Chip Carrier 16.51 16.51 1.78 1.27 S-CQCC-J
FJ 68   JLCC JLCC Ceramic, Metal Chip Carrier 24.2 24.2 2.16 1.27 S-CQCC-J
HFG 84   CFP CFP Ceramic, Metal Flat Pack 19.05 19.05 3.68 .64 S-CQFP-N