Packaging Information for Maximum Height: 5.21 mm

Pkg Pins Footprint Type Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 JEDEC
GA-GB 225   CPGA CPGA Ceramic, Metal Grid Array 39.75 39.75 3.69 2.54 S-CPGA-P
GA-GB 256   CPGA CPGA Ceramic, Metal Grid Array 42.17 42.17 3.69 2.54 S-CPGA-P
GA-GB 289   CPGA CPGA Ceramic, Metal Grid Array 44.61 44.61 3.69 2.54 S-CPGA-P
GA-GB 324   CPGA CPGA Ceramic, Metal Grid Array 47.08 47.08 3.69 2.54 S-CPGA-P
GA-GB 361   CPGA CPGA Ceramic, Metal Grid Array 49.79 49.79 3.69 2.54 S-CPGA-P
LMD 8   TO-CAN TO-CAN Metal Cylinder or Can 8.96 8.96 3.99 2.54 O-MBCY-W