Packaging Information for Type: LCCC

Pkg Pins Footprint Industry Standard Term Description Width
(mm)		 Length
(mm)		 Thickness
(mm)		 Pitch
(mm)		 Maximum Height
(mm)		 JEDEC
FD 20   LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.83 1.27 3.05 S-CQCC-N
FD 28   LCCC Ceramic, Metal Chip Carrier 11.43 11.43 1.83 1.27 3.05 S-CQCC-N
FD 44   LCCC Ceramic, Metal Chip Carrier 16.51 16.51 2.4 1.27 3.05 S-CQCC-N
FD 52   LCCC Ceramic, Metal Chip Carrier 19.05 19.05 2.57 1.27 3.05 S-CQCC-N
FD 68   LCCC Ceramic, Metal Chip Carrier 24.11 24.11 2.57 1.27 3.05 S-CQCC-N
FD 84   LCCC Ceramic, Metal Chip Carrier 29.21 29.21 2.57 1.27 3.05 S-CQCC-N
FE 18   LCCC Ceramic, Metal Chip Carrier 7.37 9.02 1.7 1.27 2.21 R-CQCC-N
FE 28   LCCC Ceramic, Metal Chip Carrier 8.89 13.97 1.83 1.27 2.21 R-CQCC-N
FE 32   LCCC Ceramic, Metal Chip Carrier 11.43 13.97 1.83 1.27 2.21 R-CQCC-N
FK 20   LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.83 1.27 2.03 S-CQCC-N
FK 28   LCCC Ceramic, Metal Chip Carrier 11.43 11.43 1.83 1.27 2.03 S-CQCC-N
FK 44   LCCC Ceramic, Metal Chip Carrier 16.51 16.51 1.83 1.27 2.03 S-CQCC-N
FK 52   LCCC Ceramic, Metal Chip Carrier 19.05 19.05 1.83 1.27 2.03 S-CQCC-N
FK 68   LCCC Ceramic, Metal Chip Carrier 24.11 24.11 1.83 1.27 2.03 S-CQCC-N
FK 84   LCCC Ceramic, Metal Chip Carrier 29.21 29.21 1.83 1.27 2.03 S-CQCC-N
FLN 355   LCCC Ceramic, Metal Grid Array 42.16 42.16 2.69 0 4.07 R-CLGA-N
FLP 203   LCCC Ceramic, Metal Chip Carrier 31.75 40.64 6.01 2.54 6.6 R-CLCC-N
FQA 46   LCCC Ceramic, Metal Grid Array 15.5 9 4.23 .5 5.38 R-CLGA-N
FQD 98   LCCC Ceramic, Metal Grid Array 9.1 20.7 3.3 .742 3.58 R-CLGA-N
FQE 80   LCCC Plastic Grid Array 9.1 20.7 3.3 .4 3.58 R-PLGA-P
NAJ 20   LCCC Ceramic, Metal Chip Carrier 8.89 8.89 1.753 1.27 1.905 S-CLCC-N