Texas Instruments’ innovative approach to packaging helps customers differentiate their products and enables further cost-effective advancements in miniaturization and performance, including reliability for analog and embedded processing applications. Our broad portfolio includes thousands of diversified packaging configurations and lead-free technologies, ranging from traditional ceramics, to advanced QFNs, WCSP, BGA, fine pitch wire bond, flip chip, SiPs and modules, stacked and embedded die packaging, and more.
Our packaging solutions are based on a tradition of excellence in R&D, design and manufacturing, and decades of expertise and a continued commitment to innovation. With TI’s know-how in developing advanced packaging technologies, TI is well poised to deliver the next wave of innovative solutions to meet customers’ needs.
Search various package families to find technical specifications such as dimension, pin count, pitch, and package drawing.
Get documentation on TI’s surface mount technology (SMT), and find application notes on a variety of packaging topics.