Packaging terminology

Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.

Common package groups	Definition
BGA	Ball Grid Array
CFP	Both Formed and Unformed CFP = Ceramic Flat Pack
LGA	Land Grid Array
PFM	Plastic Flange Mount Package
QFP	Quad Flat Package
SIP	Single-In-Line Package
OPTO*	Light Sensor Package = optical
RFID	Radio Frequency Identification Device
CGA	Column Grid Array
COF	Chip on Flex
COG	Chip on Glass
DIP	Dual In-Line Package
DSBGA	Die Size Ball Grid Array (WCSP = Wafer Chip Scale Package)
LCC	Leaded Chip Carrier
NFMCA-LID	Substrate Metal Cavity with Lid
PGA	Pin Grid Array
POS	Package on Substrate
QFN	Quad Flatpack No Lead
SO	Small Outline
SON	Small Outline No Lead
TO	Transistor Outlines
ZIP	Zig-Zag In-Line
uCSP	Micro Chip Scale Package
DLP	Digital Light Processing
Module	Module
TAB	Tape Automated Bonding Package

Package family	Definition
CBGA	Ceramic Ball Grid Array
CDIP	Glass-Sealed Ceramic Dual In-Line Package
CDIP SB	Side-Braze Ceramic Dual In-Line Package
CPGA	Ceramic Pin Grid Array
CZIP	Ceramic Zig-Zag Package
DFP	Dual Flat Package
FC/CSP	Flip Chip / Chip Scale Package
HLQFP	Thermally Enhanced Low Profile QFP
HQFP	Thermally Enhanced Quad Flat Package
HSOP	Thermally Enhanced Small-Outline Package
HTQFP	Thermally Enhanced Thin Quad Flat Pack
HTSSOP	Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP	Thermally Enhanced Very Thin Quad Flat Package
JLCC	J-Leaded Ceramic or Metal Chip Carrier
LCCC	Leadless Ceramic Chip Carrier
LQFP	Low Profile Quad Flat Pack
PDIP	Plastic Dual-In-Line Package
SOJ	J-Leaded Small-Outline Package
SOP	Small-Outline Package (Japan)
SSOP	Shrink Small-Outline Package
TQFP	Thin Quad Flat Package
TSSOP	Thin Shrink Small-Outline Package
TVFLGA	Thin Very-Fine Land Grid Array
TVSOP	Very Thin Small-Outline Package
VQFP	Very Thin Quad Flat Package
DIMM*	Dual-In-Line Memory Module
HSSOP*	Thermally Enhanced Shrink Small-Outline Package
LPCC*	Leadless Plastic Chip Carrier
MCM*	Multi-Chip Module
MQFP*	Metal Quad Flat Package
PLCC*	Plastic Leaded Chip Carrier
PPGA*	Plastic Pin Grid Array
SDIP*	Shrink Dual-In-Line Package
SIMM*	Single-In-Line Memory Module
SODIMM*	Small Outline Dual-In-Line Memory Module
TSOP*	Thin Small-Outline Package
VSOP*	Very Small Outline Package
XCEPT*	Exceptions - May not be a real Package

Product preference code	Definition
P	Preferred package. Package is qualified and orderable.
OK	Use if a preferred package is not available.
A	Requires department/business unit approval.
N	Not recommended for new designs.
X	Do not use. No longer supported. Not qualified. No longer tooled.

Quality terms	Definition
JEDEC	The JEDEC Standard for this package type.
Length	The length of the device (in millimeters).
Maximum height	The maximum height above board surface form (in millimeters).
Pkg	Package designator code used in TI part numbers.
Pins	The number of pins or terminals on the package.
Package type \| Pins	The TI package designator for a device, or the number of pins for a device.
Pitch	The distance between the centers of adjacent pins (in millimeters).
Thickness	The maximum thickness of the package body (in millimeters).
Type	The abbreviated acronymn for this type of package.
Width	The width of the device (in millimeters).
ePOD	Enhanced Package Online (Typically includes package outline, land pattern, and stencil design).
Land pattern	The pattern of solderable area on the PCB where a "no-lead" package may rest.
Footprint	The periphery leads and thermal pad of a "no-lead" package.
Coplanarity	The bottom surface of the package is parallel to the landing surface of the PCB.
Thermal pad = Exposed pad = Power pad	The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements
Search part number	The TI or customer part number entered on the initial Search page.
TI part number	The part number to use when placing orders.
PN type	Indicates whether the part number is Pb-Free or standard.
Eligibility	The device can be added to the ESL list immediately.
Assembly site	The plant location(s) where a TI device is assembled.
RoHS & High-Temp compatible (Y/N)	Indicates whether or not a device meets TI's "Pb-free" definition.
Pb-free	TI defines "Lead-free (Pb-free)" or "Pb-free" to mean semiconductor products that are compatible with the current RoHS requirements for all six substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
RoHS	On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which becomes effective July 1, 2006.
Pb-free (RoHS) available supply date	The forecasted or actual date that the device will be available for purchase.
Current Lead/Ball finish	The current metal finish on the leads or solder balls of a device.
Planned Lead/Ball finish	The planned metal finish on the leads or solder balls of a Pb-Free device.
Current MSL/reflow ratings	The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL/reflow ratings are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.
Green compatible (Y/N)	Indicates whether or not a device meets TI's "green" definition.
Green	TI defines "green" to mean Pb-free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
RoHS restricted substances - ppm	The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance. Example: PPM= 1000000 X total amount of lead in component (mg) Total leadframe plating weight (mg)
RoHS restricted substances - amount (mg)	The total amount of each RoHS substance in the component
Green reportable substances - ppm	The ppm calculations are at the homogeneous material level and are worst-case ppm for each green substance. Example: ppm= 1000000 X total amount of antimony in component (mg) total mold compound weight (mg)
Green reportable substances - amount (mg)	The total amount of each green substance in the component.
Recyclable metals - ppm	The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. The ppm calculations are at the component level. Example: ppm= 1000000 X total amount of gold in component (mg) total component weight (mg)
Recyclable metals - amount (mg)	The total amount of each recyclable metal in the component.
Total device mass (mg)	Weight of the component in milligrams.
IEC 62474 Database	TI products that are compliant to RoHS requirements are also compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide).
IEC 62474 Database – Mandatory	The mandatory substances contained within the IEC 62474 Database are restricted based on WW legislation. These substances shall be reported if thresholds defined within the database are exceeded.
IEC 62474 Database – Optional	The optional substances contained within the IEC 62474 Database are reportable based on industry defined reporting requirements. These substances may be reported if thresholds defined within the database are exceeded.
Extended shelf life	TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.
Mass (mg)	Representative device weight (per part) in milligram
REACH status	The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC). This list is usually updated 2 times per year.
IEC 62474 DB	Is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time.