Packaging terminology
Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.
Common package groups | Definition |
---|---|
BGA | Ball Grid Array |
CFP | Both Formed and Unformed CFP = Ceramic Flat Pack |
LGA | Land Grid Array |
PFM | Plastic Flange Mount Package |
QFP | Quad Flat Package |
SIP | Single-In-Line Package |
OPTO* | Light Sensor Package = optical |
RFID | Radio Frequency Identification Device |
CGA | Column Grid Array |
COF | Chip on Flex |
COG | Chip on Glass |
DIP | Dual In-Line Package |
DSBGA | Die Size Ball Grid Array (WCSP = Wafer Chip Scale Package) |
LCC | Leaded Chip Carrier |
NFMCA-LID | Substrate Metal Cavity with Lid |
PGA | Pin Grid Array |
POS | Package on Substrate |
QFN | Quad Flatpack No Lead |
SO | Small Outline |
SON | Small Outline No Lead |
TO | Transistor Outlines |
ZIP | Zig-Zag In-Line |
uCSP | Micro Chip Scale Package |
DLP | Digital Light Processing |
Module | Module |
TAB | Tape Automated Bonding Package |
Package family | Definition |
---|---|
CBGA | Ceramic Ball Grid Array |
CDIP | Glass-Sealed Ceramic Dual In-Line Package |
CDIP SB | Side-Braze Ceramic Dual In-Line Package |
CPGA | Ceramic Pin Grid Array |
CZIP | Ceramic Zig-Zag Package |
DFP | Dual Flat Package |
FC/CSP | Flip Chip / Chip Scale Package |
HLQFP | Thermally Enhanced Low Profile QFP |
HQFP | Thermally Enhanced Quad Flat Package |
HSOP | Thermally Enhanced Small-Outline Package |
HTQFP | Thermally Enhanced Thin Quad Flat Pack |
HTSSOP | Thermally Enhanced Thin Shrink Small-Outline Package |
HVQFP | Thermally Enhanced Very Thin Quad Flat Package |
JLCC | J-Leaded Ceramic or Metal Chip Carrier |
LCCC | Leadless Ceramic Chip Carrier |
LQFP | Low Profile Quad Flat Pack |
PDIP | Plastic Dual-In-Line Package |
SOJ | J-Leaded Small-Outline Package |
SOP | Small-Outline Package (Japan) |
SSOP | Shrink Small-Outline Package |
TQFP | Thin Quad Flat Package |
TSSOP | Thin Shrink Small-Outline Package |
TVFLGA | Thin Very-Fine Land Grid Array |
TVSOP | Very Thin Small-Outline Package |
VQFP | Very Thin Quad Flat Package |
DIMM* | Dual-In-Line Memory Module |
HSSOP* | Thermally Enhanced Shrink Small-Outline Package |
LPCC* | Leadless Plastic Chip Carrier |
MCM* | Multi-Chip Module |
MQFP* | Metal Quad Flat Package |
PLCC* | Plastic Leaded Chip Carrier |
PPGA* | Plastic Pin Grid Array |
SDIP* | Shrink Dual-In-Line Package |
SIMM* | Single-In-Line Memory Module |
SODIMM* | Small Outline Dual-In-Line Memory Module |
TSOP* | Thin Small-Outline Package |
VSOP* | Very Small Outline Package |
XCEPT* | Exceptions - May not be a real Package |
Product preference code | Definition |
---|---|
P | Preferred package. Package is qualified and orderable. |
OK | Use if a preferred package is not available. |
A | Requires department/business unit approval. |
N | Not recommended for new designs. |
X | Do not use. No longer supported. Not qualified. No longer tooled. |
Quality terms | Definition |
---|---|
JEDEC | The JEDEC Standard for this package type. |
Length | The length of the device (in millimeters). |
Maximum height | The maximum height above board surface form (in millimeters). |
Pkg | Package designator code used in TI part numbers. |
Pins | The number of pins or terminals on the package. |
Package type | Pins | The TI package designator for a device, or the number of pins for a device. |
Pitch | The distance between the centers of adjacent pins (in millimeters). |
Thickness | The maximum thickness of the package body (in millimeters). |
Type | The abbreviated acronymn for this type of package. |
Width | The width of the device (in millimeters). |
ePOD | Enhanced Package Online (Typically includes package outline, land pattern, and stencil design). |
Land pattern | The pattern of solderable area on the PCB where a "no-lead" package may rest. |
Footprint | The periphery leads and thermal pad of a "no-lead" package. |
Coplanarity | The bottom surface of the package is parallel to the landing surface of the PCB. |
Thermal pad = Exposed pad = Power pad | The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements |
Search part number | The TI or customer part number entered on the initial Search page. |
TI part number | The part number to use when placing orders. |
PN type | Indicates whether the part number is Pb-Free or standard. |
Eligibility | The device can be added to the ESL list immediately. |
Assembly site | The plant location(s) where a TI device is assembled. |
RoHS & High-Temp compatible (Y/N) | Indicates whether or not a device meets TI's "Pb-free" definition. |
Pb-free | |
RoHS | On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which becomes effective July 1, 2006. |
Pb-free (RoHS) available supply date | The forecasted or actual date that the device will be available for purchase. |
Current Lead/Ball finish | The current metal finish on the leads or solder balls of a device. |
Planned Lead/Ball finish | The planned metal finish on the leads or solder balls of a Pb-Free device. |
Current MSL/reflow ratings | The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL/reflow ratings are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board. |
Green compatible (Y/N) | Indicates whether or not a device meets TI's "green" definition. |
Green | TI defines "green" to mean Pb-free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). |
RoHS restricted substances - ppm | |
RoHS restricted substances - amount (mg) | The total amount of each RoHS substance in the component |
Green reportable substances - ppm | |
Green reportable substances - amount (mg) | The total amount of each green substance in the component. |
Recyclable metals - ppm | |
Recyclable metals - amount (mg) | The total amount of each recyclable metal in the component. |
Total device mass (mg) | Weight of the component in milligrams. |
IEC 62474 Database | TI products that are compliant to RoHS requirements are also compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide). |
IEC 62474 Database – Mandatory | The mandatory substances contained within the IEC 62474 Database are restricted based on WW legislation. These substances shall be reported if thresholds defined within the database are exceeded. |
IEC 62474 Database – Optional | The optional substances contained within the IEC 62474 Database are reportable based on industry defined reporting requirements. These substances may be reported if thresholds defined within the database are exceeded. |
Extended shelf life | TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor. |
Mass (mg) | Representative device weight (per part) in milligram |
REACH status | The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC). This list is usually updated 2 times per year. |
IEC 62474 DB | Is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time. |