Preferred package. Package is qualified and orderable.
Use if a preferred package is not available.
Requires department/business unit approval.
Not recommended for new designs.
Do not use. No longer supported. Not qualified. No longer tooled.
The JEDEC Standard for this package type.
The length of the device (in millimeters).
The maximum height above board surface form (in millimeters).
Package designator code used in TI part numbers.
The number of pins or terminals on the package.
Package type | Pins
The TI package designator for a device, or the number of pins for a device.
The distance between the centers of adjacent pins (in millimeters).
The maximum thickness of the package body (in millimeters).
The abbreviated acronymn for this type of package.
The width of the device (in millimeters).
Enhanced Package Online (Typically includes package outline, land pattern, and stencil design).
The pattern of solderable area on the PCB where a "no-lead" package may rest.
The periphery leads and thermal pad of a "no-lead" package.
The bottom surface of the package is parallel to the landing surface of the PCB.
Thermal pad = Exposed pad = Power pad
The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements
Search part number
The TI or customer part number entered on the initial Search page.
TI part number
The part number to use when placing orders.
Indicates whether the part number is Pb-Free or standard.
The device can be added to the ESL list immediately.
The plant location(s) where a TI device is assembled.
RoHS & High-Temp compatible (Y/N)
Indicates whether or not a device meets TI's "Pb-free" definition.
TI defines "Lead-free (Pb-free)" or "Pb-free" to mean semiconductor products that are compatible with the current RoHS requirements for all six substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which becomes effective July 1, 2006.
Pb-free (RoHS) available supply date
The forecasted or actual date that the device will be available for purchase.
Current Lead/Ball finish
The current metal finish on the leads or solder balls of a device.
Planned Lead/Ball finish
The planned metal finish on the leads or solder balls of a Pb-Free device.
Current MSL/reflow ratings
The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL/reflow ratings are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.
Green compatible (Y/N)
Indicates whether or not a device meets TI's "green" definition.
TI defines "green" to mean Pb-free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
RoHS restricted substances - ppm
The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance.
Example: PPM= 1000000 X total amount of lead in component (mg)
Total leadframe plating weight (mg)
RoHS restricted substances - amount (mg)
The total amount of each RoHS substance in the component
Green reportable substances - ppm
The ppm calculations are at the homogeneous material level and are worst-case ppm for each green substance.
Example: ppm= 1000000 X total amount of antimony in component (mg)
total mold compound weight (mg)
Green reportable substances - amount (mg)
The total amount of each green substance in the component.
Recyclable metals - ppm
The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. The ppm calculations are at the component level.
Example: ppm= 1000000 X total amount of gold in component (mg)
total component weight (mg)
Recyclable metals - amount (mg)
The total amount of each recyclable metal in the component.
Total device mass (mg)
Weight of the component in milligrams.
IEC 62474 Database
TI products that are compliant to RoHS requirements are also compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide).
IEC 62474 Database – Mandatory
The mandatory substances contained within the IEC 62474 Database are restricted based on WW legislation. These substances shall be reported if thresholds defined within the database are exceeded.
IEC 62474 Database – Optional
The optional substances contained within the IEC 62474 Database are reportable based on industry defined reporting requirements. These substances may be reported if thresholds defined within the database are exceeded.
Extended shelf life
TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.
Representative device weight (per part) in milligram
The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC). This list is usually updated 2 times per year.
IEC 62474 DB
Is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time.