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Find TI packages

TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies, from traditional BGA and ceramics, to advanced WCSP, QFN, SiP, modules, power packages and more. Select a package family below, or search all TI packages to explore TI’s complete package portfolio.

A complete description of available TI package families can be found here.

High ball count substrate package

High-pin-density solution in a miniature package

Uses radio waves to identify people or objects

Ceramic rectangular package with leads on opposite sides

J-shaped lead configuration with pins on each side

Leaded package with leads on opposite sides

Well suited for high pin-count, fine pitch applications

Fully integrated with active die and passives

Low lead inductance, thin profile for handheld applications

Custom packages for DMD display and controller chips

High pin count, leaded substrate package

Non-packaged die option with high test capability

Small form factor for low-to-moderate pin count devices

Thin profile no-lead package, enhanced thermal performance

Through-hole package with small footprint

Through-hole package with enhanced thermal performance

Leaded package on four sides, enhanced thermal

High pin capacity for compact systems