TI Dual-mode Bluetooth® Stack on STM32F4 MCUs

(ACTIVE) CC256XSTBTBLESW

Description & Features

Technical Documents

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Description

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 and QDID 69886), provides simple command line sample applications to speed development, and upon request has MFI capability.

For a complete evaluation solution, the CC256XSTBTBLESW works directly with the hardware development kit: STM3240G-EVAL. Moreover the stack that is available for the STM32 MCU, is certified and royalty-free (CC256XSTBTBLESW).

The software works with all CC256x EM boards (CC256XQFNEM and CC2564MODNEM) which provide a complete Bluetooth BR/EDR/LE HCI solution, reducing design effort and enabling fast time to market. The CC256x EM boards include TI's seventh-generation Bluetooth core and provide a product-proven solution that is Bluetooth 4.1 compliant. The devices provide best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

Features
  • Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royalty free
  • The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886)
  • Fully Thread safe
  • Supports threaded (RTOS) and non-threaded (No OS) environment
  • Fully Documented API Interface
  • Works with any STM32F4 MCU
  • Sample Apps are available for the STM3240G-EVAL MCU development kit with the support of the CC256XEM-STADAPT
  • Protocols/Profiles can be selectively enabled/disabled
  • Supports Keil and IAR IDEs
  • Classic Profiles Available
    • Advanced Audio Distribution Profile (A2DP): A3DP Implementation
    • Audio/Video Remote Control Profile (AVRCP)
    • Device ID Profile (DI)
    • Generic Access Profile (GAP )
    • Generic Audio/Video Distribution Profile (GAVDP)
    • Headset Profile (HSP)
    • Hands Free Profile (HFP)
    • Human Interface Device Profile (HID)
    • Phonebook Access Profile (PBAP)
    • Serial Port Profile (SPP)
  • Bluetooth Low Energy Profiles Available
    • Alert Notification Service (ANS)
    • Alert Notification Profile (ANP)
    • Battery Service (BAS)
    • Device Information Service (DIS)
    • Find Me Profile (FMP)
    • Generic Access Profile Service (GAPS)
    • Generic Attribute Profile (GATT)
    • Health Thermometer Service (HTS)
    • Health Thermometer Profile (HTP)
    • Heart Rate Service (HRS)
    • Heart Rate Profile (HRP)
    • Human Interface Device Service (HIDS)
    • HID over GATT Profile (HOGP)
    • Immediate Alert Service (IAS)
    • Link Loss Service (LLS)
    • Phone Alert State Service (PASS)
    • Phone Alert State Profile (PASP)
    • Proximity Profile (PXP)
    • TX Power Service (TPS)


Order Now
Part Number Buy from Texas Instruments or Third Party Alert Me Order Options Status Current Version   Version Date  

CC256XEM-STADAPT:
CC256xEM Bluetooth® Adapter Kit

$19.99(USD)




Pricing may vary.



ACTIVE v1.0  29-JUN-2015 

CC2564MODNEM-STADAPT-BNDL:
Dual-mode Bluetooth® CC2564 module evaluation board + CC256xEM Bluetooth® Adapter Kit

$39.98(USD)

Not Available ACTIVE    

CC256XSTBTBLESW:
TI Dual-mode Bluetooth® stack on STM32F4 MCUs

Not Available ACTIVE v4.0.2.2  26-OCT-2015 
Contact a Distributor  

TI's Standard Terms and Conditions for Evaluation Modules apply.

Technical Documents
User guides (8)
*This is not an TI official document.
Title Abstract Type Size (KB) Date Views
Wiki* 16 Jun 2015
PDF 1049 28 Feb 2017 977
PDF 317 01 Oct 2015 685
PDF 1672 24 Jul 2015 388
PDF 4623 08 Jul 2015 1,293
PDF 1717 21 May 2015 350
Multiple Files   19 May 2015 469
PDF 1737 20 Aug 2014 764
White papers (2)
Title Abstract Type Size (KB) Date Views
PDF 873 16 Oct 2017 5,113
PDF 322 25 Mar 2014 2,778
Design files (1)
Title Abstract Type Size (KB) Date Views
ZIP 11825 01 Jul 2015 222
More literature (2)
Title Abstract Type Size (KB) Date Views
PDF 37 15 Mar 2017 41
PDF 441 03 Feb 2016 1,159

Software (4)

Name Part Number Software Type
TI Dual-Mode Bluetooth® Stack  TIBLUETOOTHSTACK-SDK  Software Development Kits (SDK) 
Bluetooth Service Pack for CC256xB  CC256XB-BT-SP  Software Libraries 
TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and CC256x  TI-BT-STACK-LINUX-ADDON  Software Libraries 

Development Tools (1)

Name Part Number Tool Type
CC256x Bluetooth Hardware Evaluation Tool  SWRC256  Calculation Tools 

Design Kits & Evaluation Modules (2)

Name Part Number Tool Type
Dual-mode Bluetooth® CC2564 evaluation board  CC256XQFNEM  Evaluation Modules & Boards 
Dual-mode Bluetooth® CC2564 module evaluation board  CC2564MODNEM  Evaluation Modules & Boards 

Reference Designs (4)

Name Part Number Tool Type
Bluetooth and MSP MCU Audio Source Reference Design  BT-MSPAUDSOURCE-RD  TI Designs
Bluetooth and MSP430 Audio Sink Reference Design  BT-MSPAUDSINK-RD  TI Designs
CC256x Bluetooth® Reference Design  CC256XEM-RD  TI Designs
DLP Ultra-mobile NIR Spectrometer for Portable Chemical Analysis with Bluetooth Connectivity  TIDA-00554  TI Designs

TI Devices (4)

Part Number Name Product Family
CC2560  Bluetooth® CC2560 controller  Dual Mode Bluetooth (BLE/BT) 
CC2564  Dual-mode Bluetooth® Controller  Dual Mode Bluetooth (BLE/BT) 
CC2564MODA  Dual-mode Bluetooth® CC2564 module with integrated antenna  Dual Mode Bluetooth (BLE/BT) 
CC2564MODN  Dual-mode Bluetooth® CC2564 module  Dual Mode Bluetooth (BLE/BT) 

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