TIDA-060017

Transmitting SPI Signals Over LVDS Interface Reference Design

TIDA-060017

Design files

Overview

This reference design demonstrates how to resolve and optimize signal integrity challenges typically found when sending SPI signals over longer distance on the same PCB or off PCB to another board in a noisy environment by transmitting SPI signals over an LVDS interface. The concept offers high-noise immunity, reduced EMI emission and wider common-mode input tolerance.

Features
  • Noise immunity and range extension for SPI bus using an LVDS interface
  • At least three-meter communication range using SPI over LVDS versus 0.5-meter range using standard SPI
  • Techniques to reduce propagation delay and improve SPI communication speed or range by routing SCLK back to SPI master
  • 10 times lower power consumption compared to other differential signaling (RS-422/RS-485) options
  • –4-V to +5-V common-mode input voltage range offers high-ground bounce immunity
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Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUED8.PDF (2332 K)

Reference design overview and verified performance test data

TIDRWR3.ZIP (356 K)

Detailed schematic diagram for design layout and components

TIDRWR4.ZIP (154 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDCES7.ZIP (760 K)

Design file that contains information on physical board layer of design PCB

TIDRWR5.PDF (1000 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

LVDS, M-LVDS & PECL ICs

SN65LVDS31400-Mbps LVDS quad high speed differential driver

Data sheet: PDF | HTML
LVDS, M-LVDS & PECL ICs

SN65LVDS33Quad LVDS receiver with -4 to 5-V common-mode range

Data sheet: PDF
Precision ADCs

ADS8910B18-Bit, 1-MSPS, 1-Ch SAR ADC with Internal VREF Buffer, Internal LDO and Enhanced SPI Interface

Data sheet: PDF | HTML

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Hardware

Evaluation board

SN65LVDS31-33EVM — Evaluation Module for SN65LVDS31 and SN65LVDS33

TI offers a series of low-voltage differential signaling (LVDS) evaluation modules (EVMs) designed for analysis of the electrical characteristics of LVDS drivers and receivers. Four unique EVMs are available to evaluate the different classes of LVDS devices offered by TI.

As seen in the Combination (...)

User guide: PDF
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Limit: This limit is in place to protect sample purchases for design evaluation and will be removed once more stock is available.
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Technical documentation

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Type Title Date
* Design guide Transmitting SPI Over LVDS Interface Reference Design Jul. 19, 2018

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