Dual-mode Bluetooth® CC2564 evaluation board

(ACTIVE) CC256XQFNEM

Description & Features

Technical Documents

Support & Training

Order Now



Description

The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, DK-TM4C129X and other MCUs. Moreover, a certified and royalty-free TI Bluetooth Stack is available for the MSP430 (CC256XMSPBTBLESW), TM4C12x MCUs (CC256XM4BTBLESW) and other MCUs (CC256XSTBTBLESW).

The CC256XQFNEM hardware design files (schematics, layout and BOM) are provided as a reference to aid in the implementation of the CC256x devices.

Features
  • CC2564B device (QFN package)
  • Bluetooth Specification v4.1
  • Dual Mode - Bluetooth & Bluetooth low energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (+12dBm)
  • High sensitivity (-93 dBm typ.)
  • UART Interface - Control and Data
  • PCM/I2S Interface - Voice and Audio
  • 4 Layer PCB design
  • 1.8 LDO (LP2985-18)
  • 3 Voltage level translators (SN74AVC4T774)
  • PCB antenna
  • EM connectors that plug directly into the TI hardware development kits:
    • MSP-EXP430F5529
    • MSP-EXP430F5438
    • DK-TM4C123G
    • DK-TM4C129X
  • COM connector
  • Certified and royalty-free TI Bluetooth Stack

What's Included

  • 1 CC256x EM board with TI CC256x device with QFN package
  • 1 Jumper for MSP-EXP430F5438 board
  • 4 Jumpers for MSP-EXP430F5529 board
  • Experimenter boards sold separately


Order Now
Part Number Buy from Texas Instruments or Third Party Order Options Status

CC256XQFNEM:
Dual-mode Bluetooth® CC2564 evaluation board

$59.00(USD)




Pricing may vary.



ACTIVE
Contact a Distributor  

TI's Standard Terms and Conditions for Evaluation Modules apply.

Technical Documents
Third party documents (1)
*This is not an TI official document.
Title Date Type
Surface Mount Assembly of Amkor’s Dual Row MicroLeadFrame (MLF) Packages 09 Jul 2015
Application notes (4)
Title Abstract Type Size (KB) Date Views
PDF 1818 28 Oct 2016 479
PDF 138 12 Feb 2013 4,132
Multiple Files   28 Nov 2011 326
PDF 1836 06 Oct 2010 3,361
User guides (9)
*This is not an TI official document.
Title Abstract Type Size (KB) Date Views
Wiki* 16 Jun 2015
Wiki* 01 Jul 2015
Wiki* 09 Jul 2015
ZIP 18 28 Oct 2016 225
PDF 5090 28 Dec 2015 271
PDF 317 01 Oct 2015 452
PDF 4623 08 Jul 2015 692
PDF 1717 21 May 2015 227
Multiple Files   19 May 2015 273
White papers (2)
Title Abstract Type Size (KB) Date Views
PDF 873 16 Oct 2017 4,494
PDF 322 25 Mar 2014 588
More literature (2)
Title Abstract Type Size (KB) Date Views
PDF 66 14 Feb 2018 12
PDF 441 03 Feb 2016 531

Software (4)

Name Part Number Software Type
TI Dual-Mode Bluetooth® Stack  TIBLUETOOTHSTACK-SDK  Software Development Kits (SDK) 
TI Dual-mode Bluetooth® stack on MSP430™ MCUs  CC256XMSPBTBLESW  Software Development Kits (SDK) 
TI dual-mode Bluetooth® stack on TM4C MCUs  CC256XM4BTBLESW  Software Development Kits (SDK) 

Design Kits & Evaluation Modules (3)

Name Part Number Tool Type
Dual-mode Bluetooth® CC2564 module evaluation board  CC2564MODNEM  Evaluation Modules & Boards 
EZ430-RF256x Bluetooth Evaluation Tool  EZ430-RF256X  Evaluation Modules & Boards 
TI Dual-mode Bluetooth® Stack on STM32F4 MCUs  CC256XSTBTBLESW  Evaluation Modules & Boards 

Reference Designs (1)

Name Part Number Tool Type
CC256x Bluetooth® Reference Design  CC256XEM-RD  TI Designs

TI Devices (5)

Part Number Name Product Family
CC2560  Bluetooth® CC2560 controller  SimpleLink Solutions 
CC2564  Dual-mode Bluetooth® Controller  SimpleLink Solutions 
CC2564MODA  Dual-mode Bluetooth® CC2564 module with integrated antenna  SimpleLink Solutions 
CC2564MODN  Dual-mode Bluetooth® CC2564 module  SimpleLink Solutions 
SN74AVC4T774  4-Bit Dual-Supply Bus Transceiver With Configurable Voltage-Level Shifting and 3-State Outputs  Voltage Level Translation 

Support & Training

Try our support forums.
Search expert answers for this part Ask a new question

Content is provided 'AS IS' by the respective TI and Community contributors and does not constitute TI specifications.
See terms of use.

Blogs