TIDA-01531

Low-Power Wireless M-Bus Communications Module Reference Design

TIDA-01531

Design files

Overview

This reference design explains how to use the TI wireless M-Bus stack for CC1310 and CC1350 wireless MCUs and integrate it into a smart meter or data-collector product. This software stack is compatible with the Open Metering System (OMS) v3.0.1 specification. EN13757-1 through EN13757-7 are European standards for meter reading and include both wired and wireless metering-bus (M-Bus); these together are very popular in ultra-low-power metering and sub-metering applications. This design offers ready-to-use binary images for any of the wireless M-Bus S-, T-, or C-modes at 868 MHz with unidirectional (meter) or bidirectional configurations (both meter and data collector). Multiple precompiled binary images are provided that cover metering applications, including but not limited to heat cost allocators (HCAs), gas, water, and heat meters, or e-meters with an external host MCU.

Features

Meets EN13757-4 class HR requirements for sensitivity and selectivity and class HT for transmit power in S-, T-, and C-modes
Complete single-chip implementation with serial interface to host MCU
Consumes only 0.7 µA @ 3.6 V in shutdown mode
Embedded (API level) interface for combining wM-Bus stack and meter application
wM-Bus OMSv3.0.1-compliant S- and T- modes (S1, S2, T1, T2) with C1 and C2 modes added
Supports meter and data collector (also called "Other") functionality

Industrial

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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

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Design guide — TIDA-01531

TIDUDG0.PDF (7932 K)

Reference design overview and verified performance test data

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Schematic — TIDA-01531

TIDRST2.PDF (129 K)

Detailed schematic diagram for design layout and components

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Bill of materials (BOM) — TIDA-01531

TIDRST3.PDF (50 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

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Assembly drawing — TIDA-01531

TIDRST4.PDF (52 K)

Detailed overview of design layout for component placement

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CAD/CAE symbol — TIDA-01531

TIDRST6.ZIP (3366 K)

Files used for 3D models or 2D drawings of IC components

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Gerber file — TIDA-01531

TIDCDV1.ZIP (300 K)

Design file that contains information on physical board layer of design PCB

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PCB layout — TIDA-01531

TIDRST5.PDF (1083 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Sub-1 GHz wireless MCUs

CC1310 — SimpleLink™ 32-bit Arm Cortex-M3 Sub-1 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML

Sub-1 GHz wireless MCUs

CC1350 — SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML

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Software

Support software

TIDCDV2 — TI Wireless M-Bus Stack

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TIDCDV2 — TI Wireless M-Bus Stack

Latest version

Version: 01.00.00.00

Release date: 21 Sep 2017

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TI Wireless M-Bus Stack (zip) — 4991 K

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Technical documentation

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	Type	Title		Date
*	Design guide	Low-Power wM-Bus Communications Module Reference Design		Sep. 22, 2017
	Application brief	Low-power wM-Bus Stack Implementation With CC1310 and CC1350	PDF \| HTML	Oct. 19, 2018
	Application note	Using the MSP430FR6047 Wireless M-Bus Serial Library for Metering Applications		Apr. 05, 2018

Related design resources

Hardware development

EVALUATION BOARD

LAUNCHXL-CC1310 — CC1310 LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU

DEVELOPMENT KIT

LAUNCHXL-CC1350 — CC1350 LaunchPad™ development kit for SimpleLink™ dual-band wireless MCU

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