TMP007 Evaluation Module for Infrared Thermopile Sensor with Integrated Math Engine


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TMP007 is an infrared thermopile sensor that measures the temperature of an object in a contactless manner. The integrated thermopile absorbs the infrared energy emitted from the object which appears in the sensor’s field of view. The thermopile voltage is digitized and provided as an input to the integrated math processor, along with the local die temperature. The processor then computes the corresponding object temperature. Default Seebeck coefficient and thermal transient coefficients are encoded into the processor. System calibration values can be programmed and stored in the built-in non-volatile memory as user-inputs for improved accuracy. An alert function is available and can be programmed in comparator or interrupt mode. The TMP007EVM consists of two PCBs; the SM-USB-DIG which communicates with the computer, provides power, and sends and receives appropriate digital signals. The second board is the TMP007 Test Board, which contains the TMP007 and its support circuitry.

  • Small form Factor
  • Easy to use graphical user interface (GUI)
  • Protective plastic Case

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TMP007 Evaluation Module for Infrared Thermopile Sensor with Integrated Math Engine


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Technical Documents
User guides (1)
Title Abstract Type Size (KB) Date Views TI Recommends
PDF 1007 22 Oct 2014 637

Software (1)

TI Devices (1)

Part Number Name Product Family
TMP007  Infrared Thermopile Contactless Temperature Sensor with Integrated Math Engine in WCSP Package  Temperature Sensors 

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