Description

Microsoft Windows™ Embedded CE* (CE) 6.0 R3 is an operating system optimized for embedded devices that require minimum storage based on a componentized architecture. Windows CE has a noticeably different kernel that can run in under a megabyte of memory. It conforms to the definition of a real-time operating system, with deterministic interrupt latency. Designed for use with Microsoft’s Platform Builder and Visual Studio tools, the Windows Embedded CE 6.0 R3 OS allows embedded developers to begin development immediately utilizing a familiar, full-featured environment for embedded design. Developers can easily achieve performance beyond General Purpose Processor (GPP) capabilities while using familiar and standard Windows Embedded CE application programming interfaces (APIs).

TI Support for Windows Embedded CE 6.0 R3
TI has worked with its CE partners to provide free production-quality Microsoft Windows Embedded CE 6.0 R3 Board Support Packages (BSP) for its devices and associated Evaluation Modules (EVM). All functional blocks of the device are available, including the ARM application processor and TMS320C674x™ DSP and a shared peripheral set integrated onto the EVM. In addition to the BSP, TI has also made available CE ports of its DSP/BIOS™ Link.

Additional Information:

Windows Embedded CE Board Support Packages (BSP) 

Features

The Sitara ARM AM1x and OMAP-L1xCE Software Development Kit (SDK) and EVM Board Support Package (BSP) Source Code feature the Windows Embedded CE operating system. Additionally for OMAP-L1x devices, the SDK support access to TI’s C674x DSP using inter-processor communication software, DSP/BIOS™ Link.

Microsoft Windows Embedded CE 6.0 R3 - for Sitara ARM AM1xand OMAP-L1x Processors

1. CE Development Tools
Texas Instruments and Microsoft have collaborated on the Windows Embedded Design Acceleration program (WE DAP) to assist CE 6.0 developers using TI's Sitara ARM AM1x and OMAP-L1x Evaluation Modules (EVMs):

To jumpstart CE design, use the CE 180-day evaluation tool kit available via web download today and expected to be included in the production release of Sitara ARM AM1x and OMAP-L1x EVMs. A minimum of 128 MB DDR memory is required to take full advantage of the WinCE software offered. Special support offers from Windows EmbeddedCE Partners include MPC Data* and Adeneo Embedded*.

* These links take you away from www.ti.com.

2. BSP Demo 
Using the Sitara ARM AM1x and OMAP-L1x Evaluation Modules, developers can demo the Microsoft Windows Embedded CE 6.0 R3 Board Support Package (BSP) on their existing hardware today. The BSP Demo requires this Evaluation Module (EVM) and a supplied SD card. Full instructions are available in the CE BSP Demo readme.txt file.

3. BSP Source
EVM users can also begin development today with the Sitara ARM AM1x and OMAP-Lx Microsoft Windows Embedded CE BSP source code software. This package includes a production quality Microsoft Windows Embedded CE 6.0 R3 BSP Source Code developed with TI Developer Network and Windows Embedded Gold Partner, MPC Data. All functional blocks of the Sitara ARM AM1x and OMAP-L1x devices are available, including ARM® ARM926 processor, TMS320C674x™ DSP and a shared peripheral set integrated onto the EVM.

• Sitara ARM AM1x and OMAP-L1x BSP Source Code includes:
  • Bootloaders:
    • OMAP-L1x UBL with 300MHz ARM and DSP configuration
    • AM1x UBL with 456MHz ARM configuration
    • Boot from NOR (OMAP-L138/AM1808 only), NAND, and SPI Serial Flash
    • Ethernet download of CE image
    • Load of CE image from NOR (OMAP-L138/AM1808 only), NAND, and SD card
    • Persistent storage of EBOOT configuration in flash
    • Splash screen support
  • CE 6.0 OEM Abstraction Layer (OAL) supporting:
    • KITL over Ethernet
    • VMINI Ethernet support
    • Kernel debugger
    • Performance Profiler
    • Real Time Clock
    • Watchdog Timer
  • Device Drivers and libraries for the Sitara ARM AM1x and OMAP-L1x EVM peripherals:
    • EDMA driver
    • I2C driver
    • SPI driver
    • LIDD support library
    • Character LCD driver
    • Raster LCD driver
    • EMAC NDIS Ethernet driver
    • McASP support library
    • UART Serial driver
    • USB 1.1 OHCI driver
    • USB 2.0 Host driver
    • USB 2.0 Function driver
    • USB 2.0 OTG driver
    • UPP driver (OMAP-L138/AM1808 only)
    • NAND flash driver
    • AIC3106 Audio driver
    • SD/MMC card driver
    • PWM driver
    • McBSP driver (OMAP-L138/AM1808 only)
    • Notification LED driver
    • TPS65070 Touch Screen driver (OMAP-L138/AM1808 only)
    • TSC2004 Touch Screen driver (OMAP-L137/AM1707 only)
    • Power Management Suspend/Resume support

4. DSP/BIOS Link Source
DSP/BIOS Link is ARM-DSP inter-processor communication software that enables the ARM to bootload the DSP and for the two processors to pass messages and data buffers via shared memory (Only for OMAP-L1x devices).