0

DAYS

0

HOURS

0

MINUTES

0

SECONDS

Power

to do anything

Texas Instruments at APEC 2017

March 26 - 30 – Tampa, Florida

Booth 701


Join TI at APEC to experience the latest innovation in key applications, interactive design stations and advice from our experts. Visit our news center for information on the newest products we’re demonstrating at the show.

Power to innovate

TI will be showcasing demos that push technology boundaries in five key application areas.

Click here to see details on all of our 2017 APEC demos.

Server/Communication
systems

TI’s portfolio of analog components enable the high capacity and low power demanded in today’s server and communication systems.

GaN
Power modules

HEV/EV Power train
systems

TI enables improved performance and safety functionality throughout the hybrid/electric and powertrain.

Motor drives

Automotive interior
power systems

TI has the analog solutions to design your system end to end, whether you are designing a cluster, head unit, HMI display or other infotainment system

USB Type-C
Audio amplifier

Industrial automation
systems

TI can help you meet the toughest system-level challenges from Industry 4.0 to motor drive and control.

Isolation
Power Over Ethernet

Battery powered
systems

TI’s battery power technology addresses all major chemistries and provides faster, cooler charging to extend battery life and run time. 

USB Type-C
Drones


TI empowers design engineers at APEC 2017

Texas Instruments gives design engineers the “Power to Do Anything” through a series of demonstrations and presentations at the Applied Power Electronics Conference (APEC), March 26-30, in Tampa, Florida. TI will reveal new products and unveil end-to-end power-management system solutions including hardware, software and reference designs that give designers the power to:

  • Innovate:
    • See how the industry’s first end-to-end gallium nitride (GaN) solution revolutionizes data center AC-to-processor power density by over 3x, with TI’s GaN technology clocking in at over 7 million device reliability hours.
    • Experience the design simplicity that power modules provide as TI takes the wraps off its new high-current PMBus™ module with telemetry for communications applications.
    • Watch two new low quiescent current (IQ) step-down DC/DC converters power the next evolution of automotive USB Type-C™ and industrial heating, ventilation and air conditioning (HVAC) applications.
    • View the industry’s first multiphase bidirectional current controller efficiently transfer power between 48-V and 12-V automotive dual-battery systems.
  • Design:
    • Analyze and interpret designs with new WEBENCH® Power Design tools. Go beyond the traditional concerns of performance, footprint and cost with tools that mitigate electromagnetic interference (EMI) noise and handle noise-sensitive loads.
    • Check out the new TI Power Management Lab Kit (TI-PMLK) buck-boost board and experiment book to better understand the trade-offs related to common power-supply parameters such as power losses, converter efficiency, stability, load and line regulation, and more.
  • Learn:
    • Attend the APEC plenary “Power Semiconductor Technology – Flexibility for Tomorrow’s Solutions” by Ahmad Bahai, Texas Instruments’ chief technologist and senior vice president. From 1:30 to 2 p.m. on Monday, March 27. Bahai will show how the demand for smart, high-efficiency power management is outpacing the average growth rate of the semiconductor industry.
    • Join TI power experts at more than 30 technical sessions covering topics such as renewable energy systems, wireless technology and GaN device reliability validation.
    • Meet Bob Mammano, author of “Fundamentals of Power Supply Design”, your new indispensable reference book for all things power, daily in the TI booth. Enter for a chance to win an exclusive autographed pre-release copy.
    • Grab TI’s new month-to-month power-topology guide in the TI booth while they last.

Follow us on Twitter and Facebook. Tune into Facebook Live discussions throughout APEC to watch demonstrations, hear more about TI’s latest news in power innovation, and get your questions answered by TI experts in real time.

Read more

TI at APEC 2017

    Read more

    Power to learn

    See what’s next for power technology by attending industry, technical, plenary sessions and more.


    Meet Dr. Ahmad Bahai

    Dr. Ahmad Bahai, TI Chief Technologist and Senior Vice President

    Dr.Ahmad Bahai will be kicking off the APEC plenary sessions with his presentation “Power semiconductor technology – flexibility for tomorrow’s solutions” where he will be discussing how today’s systems and future systems are adopting USB Power Delivery.

    Dr. Ahmad Bahai is chief technologist of TI and director of Kilby Labs and corporate research. Ahmad is a thought leader in the technology industry, having co-invented the multi-carrier spread spectrum, which is being used in many modern communication systems, such as 4G and power line communications. He also authored the first textbook on orthogonal frequency-division multiplexing (OFDM) in 1999 and served as the associate editor of IEEE journals for five years.

    Ahmad has been published in more than 80 IEEE/IEE publications and has 33 patents and five pending on systems and circuits. He received his master of science degree from Imperial College, the University of London, and his doctorate from the University of California at Berkeley, all in electrical engineering.

    Attend the session:
    Monday, March 27 13:30 - 14:00
    Read abstract

    Meet Dr. Stephanie Watts Butler

    Dr. Stephanie Watts Butler, TI Technology Innovation Architect in High Voltage Power

    Dr. Stephanie Watts Butler, Ph.D., P.E., is driving new technology innovations from concept to revenue by leading partnerships with TI’s technology organizations, manufacturing sites, universities, and product development teams. In her career, she has produced innovations in the semiconductor industry in the areas of control, process and package development, R&D management, and new product development. The result is power semiconductors that enable TI's customers to make smaller, lighter, and more energy efficient products. Dr. Butler has authored more than 40 papers and 16 U.S. patents.  She is a Fellow of AVS and a Senior Member of IEEE and AIChE.  SWE has honored Dr. Butler with the 2016 Achievement Award, and the Dallas Business Journal selected her as a 2015 Woman in Technology. Most recently, Business Insider named Dr. Butler to their most power female engineers list of 2017. Dr. Butler also serves on the TxGCP Champion Board  and UT Austin Department of Chemical Engineering Advisory Council.

    Please join Dr. Stephanie Watts Butler as she shares invaluable tips and experiences from her own career path journey.

    What:   IEEE PELS WIE Breakfast
    When:  Tuesday, March 28th from 8 - 9am
    Where: Room 12 at the Tampa Convention Center 

    Power to design

    See TI’s easy-to-use design tools, lab kits and reference designs in action.

    Power to collaborate