TI DualCool™ NexFET™ Power MOSFET Technology Device Size VDS (V) VGS (V) R at 10V (mΩ) R at 4.5V (mΩ) Qg (nC) Qgd (nC) Samples CSD16325Q5C 5X6 25 10 — 1.7 18 2.9 Order CSD16322Q5C 5X6 25 10 — 4.5 6.5 1.2 Order CSD16321Q5C 5X6 25 10 — 2.1 14 2.5 Order CSD16407Q5C 5X6 25 16 1.8 2.5 13.3 3.5 Order CSD16408Q5C 5X6 25 16 3.7 5.4 6.5 1.9 Order TI’s complete NexFET Power MOSFET family Learn more
DualCool™ NexFET™ Power MOSFET Enables top-side cooling 80% higher power dissipation 50% more current in standard footprint

TI’s DualCool™ NexFET™ family of power MOSFETs delivers an industry standard footprint, while enabling thermally efficient cooling through the top and bottom of the package. This package allows power system designers to effectively direct heat away from the PCB in high-current DC/DC applications, resulting in improved power density, higher current capability and improved system reliability.

Thermal Performance Comparison		CSD16321Q5C — Measured Thermal Improvements (Ta = 25°C, Pd = 2.1 Watts, Airflow = 300 LFM)
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