MicroSiP power modules combine high performance, ease-of-use, and all external components into a small solution size with 1-mm thickness. Using System-in-Package (SiP) technology, the modules integrate IC and passive components (capacitor and inductor) in a single device with a BGA format. The IC is embedded inside the PCB, and the passives components are mounted on top. Similar to MicroSiP, MicroSiL modules use the same System-in-Package technology, but only integrate the inductor. MicroSiL modules are available in a package similar to QFN.
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