Die products provide the ultimate opportunity for size and weight reduction, electrical performance improvements, enhanced function integration and reduced costs in system design. A die product is simply a package-free semiconductor, thus allowing the system designer to take advantage of the true device performance not encumbered by the penalties resulting from the package.
Electronic products and systems designed today are smaller and lighter, yet offer ever increasing functionality. Texas Instruments offers bare die/wafer solutions for applications that require higher levels of integration to reduce board space. TI can provide a wide range of products in bare die and wafer form. A variety of testing and qualification options are available based on product maturity and complexity, as well as customer requirements.
Texas Instruments Incorporated has expanded package options with the availability of bare die. With new small volume waffle pack quantities for Tested Die (TD) TI provides the capability to prototype bare die applications quickly without the need to purchase a full wafer. TI provides a wide range of products for sale in bare die, known good die and in wafer form.
TI offers three categories of bare die screening:
- Tested die (TD): TD is defined as 25C DC probed die that have not undergone any special testing. Also called bare die.
- Known Good Die (KGD): KGD is defined as die that have the same quality and reliability as the equivalent packaged part.
- Commercial wafers
Feasibility assessments are conducted for each opportunity to assess unique requirements related to die sales. The assessment takes into account such factors as:
- Customer requirements (qualification, inspection, radiation expectations)
- End application
- Probe Solution (HW)
- Probe Test Coverage
- Packing options (wafer, waffle pack)
- Test Platform