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Ceramic SOIC Products
TI's Enhanced Solutions has introduced a Ceramic SOIC package which offers a hermetic Surface Mount Package with Gull Wings leads.
Features and Benefits
- Emulates JEDEC standard for wide body (300mil) SOICs
- 37% smaller footprint than ceramic DIP
- 61% profile reduction
- 80% weight reduction*
- Surface mount technology
- 10, 14, 16 & 20 leads packages available
- Excellent thermal characteristics for heat sensitive applications
* typical value - actual reduction varies by package and die type
SOIC Vs. DIP
