Altiumcustomize

Design Rule Verification Report

Date : 7/1/2014
Time : 3:00:28 PM
Elapsed Time : 00:00:04
Filename : D:\TIDA-00182\Completed_E1\Backup\TIDA-00182.PcbDoc
Warnings : 0
Rule Violations : 4

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=30mil) (InPolygon),(All) 0
Clearance Constraint (Gap=12mil) (All),(All) 0
Width Constraint (Min=15mil) (Max=100mil) (Preferred=40mil) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Routing Layers(All) 0
Routing Via (MinHoleWidth=16mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=20mil) (MinWidth=30mil) (MaxWidth=40mil) (PreferedWidth=40mil) (All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Minimum Annular Ring (Minimum=5.905mil) (IsVia and InAnyComponent) 0
Minimum Annular Ring (Minimum=9mil) (All) 0
Hole Size Constraint (Min=8mil) (Max=251mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Net Antennae (Tolerance=0mil) (All) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsVia) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsSMTPin) 4
Total 4


Clearance Constraint (Gap=12mil) (IsVia),(IsSMTPin)
Via (580mil,2520mil) Top Layer to Bottom Layer Pad Q1-9(641.862mil,2450mil) Top Layer
Via (680mil,2520mil) Top Layer to Bottom Layer Pad Q1-9(641.862mil,2450mil) Top Layer
Via (580mil,2380mil) Top Layer to Bottom Layer Pad Q1-9(641.862mil,2450mil) Top Layer
Via (680mil,2380mil) Top Layer to Bottom Layer Pad Q1-9(641.862mil,2450mil) Top Layer
Back to top