TIDC-MULTIBAND-WMBUS

Multiband (169, 433 and 868MHz) wM-Bus RF sub-system with Segmented LCD Reference Design

TIDC-MULTIBAND-WMBUS

Design files

Overview

The TIDC-MULTIBAND-WMBUS single PCB covers all three wM-Bus frequency bands with only a few component value changes. It is a very low-power and ETSI Cat. 1 Receiver capable RF subsystem for wM-Bus 169MHz and 433 systems without SAW filter and TCXO. Ultralow-power MSP430 with always-on LCD segment support is an excellent fit for Sub-metering applications, like Heat Cost allocators.

Features

One RF layout covers all three wM-Bus bands (169, 433 and 868MHz)
Market leading blocking, selectivity and RX sensitivity in all wM-Bus modes
ETSI Cat. 1 Receiver capable wM-Bus subsystem at 169 and 433MHz
Open Source code examples for wM-Bus modes S, T, C, C2OTHER F, Nabef, Ncd and Ng
SRF7 configurations files for Receiving wM-Bus packets in all modes

This ultralow-power LCD + RF system is tested and includes firmware in source code, SRF7 Studio GUI configuration files and User's Guide.

Industrial

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Design files & products

Design files

Download ready-to-use system files to speed your design process.

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Design guide — TIDC-MULTIBAND-WMBUS

TIDU921.PDF (1627 K)

Reference design overview and verified performance test data

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Schematic — TIDC-MULTIBAND-WMBUS

TIDREU2.PDF (112 K)

Detailed schematic diagram for design layout and components

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Bill of materials (BOM) — TIDC-MULTIBAND-WMBUS

TIDREU3.PDF (61 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

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Assembly drawing — TIDC-MULTIBAND-WMBUS

TIDREU4.PDF (44 K)

Detailed overview of design layout for component placement

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CAD/CAE symbol — TIDC-MULTIBAND-WMBUS

TIDREU6.ZIP (1522 K)

Files used for 3D models or 2D drawings of IC components

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Gerber file — TIDC-MULTIBAND-WMBUS

TIDCAB0.ZIP (97 K)

Design file that contains information on physical board layer of design PCB

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PCB layout — TIDC-MULTIBAND-WMBUS

TIDREU5.PDF (234 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

AC/DC & DC/DC converters (integrated FET)

TPS62730 — Step Down Converter with Bypass Mode for Ultra Low Power Wireless Applications

Data sheet: PDF | HTML

MSP430 microcontrollers

MSP430FR4133 — 16 MHz MCU with 16KB FRAM, 2KB SRAM, 10-bit ADC, LCD, UART/SPI/I2C, IR logic, timer

Data sheet: PDF | HTML

Sub-1 GHz transceivers

CC1120 — High performance Sub-1 GHz wireless transceiver for narrowband systems

Data sheet: PDF | HTML

Start development

Hardware

Daughter card

CC1120EMK-868-915 — CC1120 Evaluation Module Kit 868-915MHz

The CC1120 Evaluation Module Kit for 868-915 MHz can be used in conjunction with the CC1120 Development Kit to evaluate the operation of the Perfomance Line RF-IC at these particular frequency bands. The CC1120DK is required for operation and needs to be ordered separately.

Not available on TI.com

Interface adapter

BOOST-CCEMADAPTER — EM Adapter BoosterPack

The purpose of the EM adapter board is to provide an-easy-to-use bridge between any of the TI MCU LaunchPads and the wide variety of TI RF evaluation modules (EM), for instance the CCxxxx Low-Power RF evaluation modules. No specific software is provided, so it is up to the user to write the (...)

User guide: PDF | HTML

Not available on TI.com

Development kit

MSP-EXP430FR4133 — MSP430FR4133 LaunchPad Development Kit

User guide: PDF | HTML

Not available on TI.com

Evaluation board

TPS62730EVM-726 — Step Down Converters | Bypass Mode for Ultralow-Power Wireless, Evaluation Module, TPS62730

The TPS62730EVM-726 evaluation module (EVM) helps designers evaluate the operation and performance of the TPS62730 step-down converter. The user’s guide describes the TPS62730 evaluation module, how to perform a stand-alone evaluation or interface with a host or system. The converter is (...)

User guide: PDF