[ { "name": "When AI generates the code, what does the Zephyr RTOS actually provide?", "path": "https://www.ti.com/about-ti/behind-chip/articles/when-AI-generates-the-code-what-does-the-Zephyr-RTOS-actually-provide.html", "headline": "When AI generates the code, what does the Zephyr RTOS actually provide?", "subheadline": "Why deep developer expertise and open-source platforms like Zephyr RTOS matter more than ever in the era of AI-generated code", "image": "/content/dam/ticom/images/applications/custom-boards/zephyr-products.jpg", "date": "16 Oct 2026", "category": "Technology" }, { "name": "What's next for the future of data center networking? Optics.", "path": "https://www.ti.com/about-ti/behind-chip/articles/whats-next-for-the-future-of-data-center-networking-optics.html", "headline": "What’s next for the future of data center networking? Optics. ", "subheadline": "AI models are pushing data rates higher, and it will take more than copper alone to travel the distance.", "image": "/content/dam/ticom/images/applications/enterprise-system/silicon-photonics-data-center-networking.jpg", "date": "08 Oct 2026", "category": "Technology" }, { "name": "Engineered to last: Powering the next generation of satellites", "path": "https://www.ti.com/about-ti/behind-chip/articles/engineered-to-last-powering-the-next-generation-of-satellites.html", "headline": "Engineered to last: Powering the next generation of satellites", "subheadline": "Advances in space-grade ICs are changing what it takes for satellites to operate reliably for years in orbit", "image": "/content/dam/ticom/images/applications/space/world-space-week.jpg", "date": "05 Oct 2026", "category": "Technology" }, { "name": "Data centers are generating more heat than ever. Cooling has to keep up.", "path": "https://www.ti.com/about-ti/behind-chip/articles/data-centers-are-generating-more-heat-than-ever-cooling-has-to-keep-up.html", "headline": "Data centers are generating more heat than ever. Cooling has to keep up.", "subheadline": "As AI places extreme power demands on data centers, engineers are rethinking how data centers move, monitor and control heat.", "image": "/content/dam/ticom/images/applications/enterprise-system/data-center-cooling-thermal-management.jpg", "date": "31 Aug 2026", "category": "Technology" }, { "name": "Behind the innovation: The road to rewriting current sensing", "path": "https://www.ti.com/about-ti/behind-chip/articles/behind-the-innovation-the-road-to-rewriting-current-sensing.html", "headline": "Behind the innovation: The road to rewriting current sensing", "subheadline": "How a team of TI engineers tackled a longstanding trade-off to create the industry’s first multiaxial coreless Hall-effect current sensor for traction inverters", "image": "/content/dam/ticom/images/people/employees/on-site/tmcs2100-jason-cole-and-lei-ding-2.jpg", "date": "25 Aug 2026", "category": "Technology" }, { "name": "What will it take to bring humanoid robots into the real world? Read our experts' insights", "path": "https://www.ti.com/about-ti/behind-chip/articles/what-will-it-take-to-bring-humanoid-robots-into-the-real-world-read-our-experts-insights.html", "headline": "What will it take to bring humanoid robots into the real world? Read our experts’ insights", "subheadline": "Humanoid robots are one way AI is becoming physical, and semiconductor technologies will enable them to take the next step ", "image": "/content/dam/ticom/images/applications/factory-automation/humanoid-sensing-and-motor-control-in-factory.jpg", "date": "24 Jun 2026", "category": "Technology" }, { "name": "Reliability will define the next decade of energy storage", "path": "https://www.ti.com/about-ti/behind-chip/articles/reliability-will-define-the-next-decade-of-energy-storage.html", "headline": "Reliability will define the next decade of energy storage", "subheadline": "Advances in battery management are enabling more consistent performance across grid-scale systems", "image": "/content/dam/ticom/images/applications/grid-infrastructure/battery-energy-storage-system-at-sunset.jpg", "date": "09 Jun 2026", "category": "Technology" }, { "name": "The intelligent chassis: The silent upgrade that's changing how cars move", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-intelligent-chassis-the-silent-upgrade-thats-changing-how-cars-move.html", "headline": "The intelligent chassis: The silent upgrade that's changing how cars move", "subheadline": "Steering, braking and suspension are going electronic, and it’s about to change how cars move and feel", "image": "/content/dam/ticom/images/applications/automotive/transparent-car-showing-an-intelligent-chassis.jpg", "date": "01 Jun 2026", "category": "Technology" }, { "name": "The chips that change the world", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-chips-that-change-the-world.html", "headline": "The chips that change the world", "subheadline": "Why general-purpose chips lay the foundation for technological innovations that are redefining our lives", "image": "/content/dam/ticom/images/applications/home-automation/smart-home-health-monitoring.jpg", "date": "27 May 2026", "category": "Technology" }, { "name": "Where innovation meets impact", "path": "https://www.ti.com/about-ti/behind-chip/articles/where-innovation-meets-impact.html", "headline": "Where innovation meets impact", "subheadline": "How we’re driving innovation in our workplace, upholding our commitment to being a good neighbor in our communities, and creating a sustainable future", "image": "/content/dam/ticom/images/literature/corporate/ccr-blog-r4.jpg", "date": "26 May 2026", "category": "Life at TI" }, { "name": "Smarter breakers, safer home: The hidden technology within your energy-abundant house", "path": "https://www.ti.com/about-ti/behind-chip/articles/smarter-breakers-safer-home-the-hidden-technology-within-your-energy-abundant-house.html", "headline": "Smarter breakers, safer home: The hidden technology within your energy-abundant house", "subheadline": "How intelligent electrification helps homeowners manage energy consumption and live safer, more convenient lives", "image": "/content/dam/ticom/images/applications/grid-infrastructure/energized-home-overview.jpg", "date": "26 May 2026", "category": "Technology" }, { "name": "The future starts here: 3 insights on the journey from intern to full-time TIer", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-future-starts-here-3-insights-on-the-journey-from-intern-to-full-time-TIer.html", "headline": "The future starts here: 3 insights on the journey from intern to full-time TIer", "subheadline": "TIers reflect on the internship moments that set their careers in motion and what they learned along the way.", "image": "/content/dam/ticom/images/people/employees/on-site/pre-intern-blog.jpg", "date": "13 May 2026", "category": "Life at TI" }, { "name": "Uncovering the legacy of DSP technology: How a children’s toy sparked the edge AI revolution", "path": "https://www.ti.com/about-ti/behind-chip/articles/uncovering-the-legacy-of-DSP-technology-how-a-childrens-toy-sparked-the-edge-AI-revolution.html", "headline": "Uncovering the legacy of DSP technology: How a children’s toy sparked the edge AI revolution", "subheadline": "Listen to the story of how TI cemented its legacy in signal processing with the Speak & Spell* and continues the innovation with today’s edge AI-enabled devices.", "image": "/content/dam/ticom/images/themes/circuits/invention-of-ai.jpg", "date": "04 May 2026", "category": "Technology" }, { "name": "Why packaging is the next frontier in power design innovation", "path": "https://www.ti.com/about-ti/behind-chip/articles/why-packaging-is-the-next-frontier-in-power-design-innovation.html", "headline": "Why packaging is the next frontier in power design innovation", "subheadline": "As power systems demand more capability within fixed areas, packaging innovations enable greater integration, safety and performance", "image": "/content/dam/ticom/images/themes/circuits/ucc3141-isopack.jpg", "date": "23 Mar 2026", "category": "Technology" }, { "name": "3 semiconductor technologies that are redefining the EV experience", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-semiconductor-technologies-that-are-redefining-the-EV-experience.html", "headline": "3 semiconductor technologies that are redefining the EV experience", "subheadline": "How collaboration-driven semiconductor technologies are transforming EVs into a practical, everyday option", "image": "/content/dam/ticom/images/people/employees/off-site/jerry-shi-charging-ev.jpg", "date": "16 Mar 2026", "category": "Technology" }, { "name": "Beyond sound: How semiconductor innovation is transforming audio experiences", "path": "https://www.ti.com/about-ti/behind-chip/articles/beyond-sound-how-semiconductor-innovation-is-transforming-audio-experiences.html", "headline": "Beyond sound: How semiconductor innovation is transforming audio experiences", "subheadline": "Audio makes our lives richer, more personal, and even safer. When you add semiconductors, what’s possible?", "image": "/content/dam/ticom/images/applications/audio/asc-audio.jpg", "date": "20 Feb 2026", "category": "Technology" }, { "name": "Engineering a path with impact", "path": "https://www.ti.com/about-ti/behind-chip/articles/engineering-a-path-with-impact.html", "headline": "Engineering a path with impact", "subheadline": "TI engineers reflect on professional growth, problem-solving, community and building a career where innovation drives real-world change", "image": "/content/dam/ticom/images/people/employees/on-site/engineers-in-a-lab-with-ashley-richmond.jpg", "date": "19 Feb 2026", "category": "Life at TI" }, { "name": "Putting precision to the test", "path": "https://www.ti.com/about-ti/behind-chip/articles/putting-precision-to-the-test.html", "headline": "Putting precision to the test", "subheadline": "How advances in semiconductors drive breakthroughs in test equipment", "image": "/content/dam/ticom/images/themes/circuits/precision-test-and-measurement.jpg", "date": "16 Feb 2026", "category": "Technology" }, { "name": "3 semiconductor-enabled innovations impacting how we experience the world", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-semiconductor-enabled-innovations-impacting-how-we-experience-the-world.html", "headline": "3 semiconductor-enabled innovations impacting how we experience the world", "subheadline": "Strides in safer systems, smaller devices and AI adoption will shape tomorrow’s technology", "image": "/content/dam/ticom/images/themes/concepts/woman-looking-at-connected-city.jpg", "date": "31 Dec 2025", "category": "Technology" }, { "name": "The future starts with the first: Our newest 300mm wafer fab is in production", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-future-starts-with-the-first-our-newest-300mm-wafer-fab-is-in-production.html", "headline": "The future starts with the first: Our newest 300mm wafer fab is in production ", "subheadline": "The journey to first production in Sherman, Texas marks an important milestone in TI’s legacy of firsts as we build the technology the world relies on today and dreams of tomorrow", "image": "/content/dam/ticom/images/themes/facilities/sm1-first-production-event.jpg", "date": "17 Dec 2025", "category": "Manufacturing" }, { "name": "The semiconductor technology shaping the autonomous driving experience", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-semiconductor-technology-shaping-the-autonomous-driving-experience.html", "headline": "The semiconductor technology shaping the autonomous driving experience", "subheadline": "The vehicle of the future will be more autonomous, making driving less stressful. But how will design engineers get there?", "image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-using-driver-assist-system.jpg", "date": "05 Dec 2025", "category": "Technology" }, { "name": "Building tomorrow's innovations with today's edge AI-enabled devices", "path": "https://www.ti.com/about-ti/behind-chip/articles/building-tomorrows-innovations-with-todays-edge-AI-enabled-devices.html", "headline": "Building tomorrow's innovations with today's edge AI-enabled devices", "subheadline": "Edge AI technology is making devices more efficient, accessible and accurate – and that’s only the beginning", "image": "/content/dam/ticom/images/applications/medical/ai-use-cases-medical-patch.jpg", "date": "11 Nov 2025", "category": "Technology" }, { "name": "From the grid to the gate: Powering the third energy revolution", "path": "https://www.ti.com/about-ti/behind-chip/articles/from-the-grid-to-the-gate-powering-the-third-energy-revolution.html", "headline": "From the grid to the gate: Powering the third energy revolution", "subheadline": "Harnessing renewable energy to meet the growing power demands of AI-driven data centers", "image": "/content/dam/ticom/images/themes/circuits/dce-program-datacenter.jpg", "date": "07 Oct 2025", "category": "Technology" }, { "name": "Beyond the mask: How DLP® technology is enabling new computing solutions with advanced packaging", "path": "https://www.ti.com/about-ti/behind-chip/articles/beyond-the-mask-how-dlp-technology-is-enabling-new-computing-solutions-with-advanced-packaging.html", "headline": "Beyond the mask: How DLP® technology is enabling new computing solutions with advanced packaging", "subheadline": "The movement toward advanced packaging within the semiconductor industry requires a parallel evolution in lithography — and DLP technology is the key to achieving it. ", "image": "/content/dam/ticom/images/applications/projection-display/dlp-digital-lithography.jpg", "date": "30 Sep 2025", "category": "Technology" }, { "name": "The best is yet to come: The legacy of the integrated circuit in tomorrow’s breakthroughs ", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-best-is-yet-to-come-the-legacy-of-the-integrated-circuit-in-tomorrows-breakthroughs.html", "headline": "The best is yet to come: The legacy of the integrated circuit in tomorrow's breakthroughs", "subheadline": "Jack Kilby’s development of the IC became the unseen foundation of modern innovation, powering the technologies we rely on today - and the ones we’ll depend on in the future.", "image": "/content/dam/ticom/images/people/employees/on-site/jack-kilby-day-2025.jpg", "date": "12 Sep 2025", "category": "Technology" }, { "name": "Building stronger communities worldwide: TIers uphold a long-standing commitment to giving back", "path": "https://www.ti.com/about-ti/behind-chip/articles/building-stronger-communities-worldwide-tiers-uphold-a-long-standing-commitment-to-giving-back.html", "headline": "Building stronger communities worldwide: TIers uphold a long-standing commitment to giving back", "subheadline": "From student mentorship to emergency relief, TI volunteers are improving the communities where they live and work", "image": "/content/dam/ticom/images/people/employees/off-site/employees-volunteering-at-food-pantry.jpg", "date": "03 Sep 2025", "category": "Life at TI" }, { "name": "The intelligence within: Building a smarter world with semiconductors", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-intelligence-within-building-a-smarter-world-with-semiconductors.html", "headline": "The intelligence within: Building a smarter world with semiconductors", "subheadline": "How innovations in semiconductors enable a world driven by accuracy, personalization, safety and autonomy ", "image": "/content/dam/ticom/images/applications/space/baw-smart-world.jpg", "date": "26 Aug 2025", "category": "Technology" }, { "name": "Out of this world: How semiconductor technology enables research from space", "path": "https://www.ti.com/about-ti/behind-chip/articles/semiconductor-technology-enables-environmental-research-from-space.html", "headline": "Out of this world: How semiconductor technology enables environmental research from space", "subheadline": "Why imaging technologies, device classifications and packaging help us learn about our planet", "image": "/content/dam/ticom/images/applications/space/sweep-satellite-over-earth-in-space.jpg", "date": "29 Jul 2025", "category": "Technology" }, { "name": "Engineering a better world: our communities, workplace and environmental sustainability impact", "path": "https://www.ti.com/about-ti/behind-chip/articles/engineering-a-better-world-our-communities-workplace-and-environmental-sustainability-impact.html", "headline": "Engineering a better world: our communities, workplace and environmental sustainability impact", "subheadline": "From investing in education and reducing our environmental impact to developing our people and maintaining one of the industry’s best safety records, we are strengthening our corporate citizenship impact to create a better world  
\r\n", "image": "/content/dam/ticom/images/applications/grid-infrastructure/solar-farm.jpg", "date": "10 Jun 2025", "category": "Life at TI" }, { "name": "3 ways semiconductor innovation is powering an evolving energy landscape", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-ways-semiconductor-innovation-is-powering-an-evolving-landscape.html", "headline": "3 ways semiconductor innovation is powering an evolving energy landscape", "subheadline": "Incremental semiconductor advancements are helping to build the future of renewable energy ", "image": "/content/dam/ticom/images/people/employees/off-site/keith-ogboenyiya-distributech-keynote.jpg", "date": "04 Jun 2025", "category": "Technology" }, { "name": "Looking for the future of autonomous driving? It’s in your car today", "path": "https://www.ti.com/about-ti/behind-chip/articles/looking-for-the-future-of-autonomous-driving-its-in-your-car-today.html", "headline": "Looking for the future of autonomous driving? It’s in your car today", "subheadline": "How today’s semiconductors are powering the current and future landscape of autonomous driving", "image": "/content/dam/ticom/images/applications/sensing/autodriving-car-truck.jpg", "date": "14 Apr 2025", "category": "Technology" }, { "name": "Rewiring STEM education through an engineering mindset", "path": "https://www.ti.com/about-ti/behind-chip/articles/rewiring-STEM-education-through-an-engineering-mindset.html", "headline": "Rewiring STEM education through an engineering mindset", "subheadline": "TI engineers and leaders earned our company’s top volunteer award for applying technical expertise, business know-how and hands-on engagement to prepare female students for STEM careers. ", "image": "/content/dam/ticom/images/people/students/employee-volunteering-community-service.jpg", "date": "07 Mar 2025", "category": "Life at TI" }, { "name": "Software-defined future: Why prioritizing software is essential", "path": "https://www.ti.com/about-ti/behind-chip/articles/software-defined-future-why-prioritizing-software-is-essential.html", "headline": "Software-defined future: Why prioritizing software is essential", "subheadline": "How flexibility, interoperability and standardization in software are enabling tomorrow’s innovations ", "image": "/content/dam/ticom/images/themes/business/embedded-ecosystems-software.jpg", "date": "06 Feb 2025", "category": "Technology" }, { "name": "Redefining the commute: The advanced audio technology transforming your drive", "path": "https://www.ti.com/about-ti/behind-chip/articles/redefining-the-commute-the-advanced-audio-technology-transforming-your-drive.html", "headline": "Redefining the commute: The advanced audio technology transforming your drive", "subheadline": "From surround-sound to noise cancellation, our company is ready for the future of automotive audio", "image": "/content/dam/ticom/images/applications/audio/immersive-auto-cabin-audio.jpg", "date": "03 Jan 2025", "category": "Technology" }, { "name": "Embracing robotics: Innovations that benefit society", "path": "https://www.ti.com/about-ti/behind-chip/articles/embracing-robotics-innovations-that-benefit-society.html", "headline": "Embracing robotics: Innovations that benefit society", "subheadline": "At an industrial and personal level, robots are impacting our daily lives for the better", "image": "/content/dam/ticom/images/people/employees/on-site/ti-errol-leon-stands-in-front-of-humanoid.jpg", "date": "03 Jan 2025", "category": "Technology" }, { "name": "The importance of reducing waste in our journey to create a more sustainable future ", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-importance-of-reducing-waste-in-our-journey-to-create-a-more-sustainable-future.html", "headline": "The importance of reducing waste in our journey to create a more sustainable future ", "subheadline": "As the demand for semiconductors grows, strategic programs aimed at reducing waste from our operations and manufacturing processes are reinforcing our commitment to environmental stewardship", "image": "/content/dam/ticom/images/people/employees/off-site/delaney-esh-team.jpg", "date": "17 Dec 2024", "category": "Life at TI" }, { "name": "Everyday industrial: The unsung technologies enhancing everyday life", "path": "https://www.ti.com/about-ti/behind-chip/articles/everyday-industrial--the-unsung-technologies-enhancing-everyday-life.html", "headline": "Everyday industrial: The unsung technologies enhancing everyday life", "subheadline": "Why industrial applications are integral to leading a more sustainable, convenient and safer life", "image": "/content/dam/ticom/images/applications/industrial/everyday-industrial-edge-ai.jpg", "date": "12 Dec 2024", "category": "Technology" }, { "name": "Shaping the future together: insights from TIers about building an impactful career", "path": "https://www.ti.com/about-ti/behind-chip/articles/shaping-the-future-together-insights-from-tiers-about-building-an-impactful-career.html", "headline": "Shaping the future together: insights from TIers about building an impactful career", "subheadline": "Employees at different stages of their TI journey share key lessons about career development, and how they are harnessing their unique skills and experiences to make an impact  ", "image": "/content/dam/ticom/images/people/employees/off-site/recruiters-forming-ti-shape-on-grass.jpg", "date": "10 Dec 2024", "category": "Life at TI" }, { "name": "3 ways software-defined vehicles will transform the automotive industry", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-ways-software-defined-vehicles-will-transform-the-automotive-industry.html", "headline": "3 ways software-defined vehicles will transform the automotive industry", "subheadline": "What vehicles enabled by software can mean for manufacturers, drivers and passengers", "image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-in-front-of-a-blue-vehicle.jpg", "date": "03 Dec 2024", "category": "Technology" }, { "name": "The road to 100% renewable electricity: Making progress on our sustainability commitments ", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-road-to-100-percent-renewable-electricity-making-progress-on-our-sustainability-commitments.html", "headline": "The road to 100% renewable electricity: making progress on our sustainability commitments ", "subheadline": "Employees on our Environment, Safety, Health and Sustainability team provide a behind-the-scenes look at how our company is expanding its use of renewable electricity to create a sustainable future", "image": "/content/dam/ticom/images/applications/grid-infrastructure/sustainability-solar-panels.jpg", "date": "18 Nov 2024", "category": "Life at TI" }, { "name": "Living on the edge: How edge AI enhances everyday experiences", "path": "https://www.ti.com/about-ti/behind-chip/articles/living-on-the-edge-how-edge-AI-enhances-everyday-experiences.html", "headline": "Living on the edge: How edge AI enhances everyday experiences", "subheadline": "Edge AI enables embedded devices to use sensor data more efficiently and enhance our everyday experiences", "image": "/content/dam/ticom/images/applications/grid-infrastructure/house-with-solar-panels.jpg", "date": "08 Nov 2024", "category": "Technology" }, { "name": "How open-source software is driving the adoption of standards in EV charging", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-open-source-software-is-driving-the-adoption-of-standards-in.html", "headline": "How open-source software is driving the adoption of standards in EV charging", "subheadline": "What open-source software means for EV charging, interoperability and the EV market", "image": "/content/dam/ticom/images/applications/automotive/ti-automotive-applications.jpg", "date": "21 Oct 2024", "category": "Technology" }, { "name": "Equipping the next generation of young female innovators through STEM", "path": "https://www.ti.com/about-ti/behind-chip/articles/equipping-the-next-generation-of-young-female-innovators-through-stem.html", "headline": "Equipping the next generation of young female innovators through STEM", "subheadline": "Around the world, our company and TIers are carrying forward a legacy of innovation and impact by investing in programs and partnerships that are building girls’ STEM confidence to help shape the future", "image": "/content/dam/ticom/images/people/students/students-discussing-in-lab.jpg", "date": "05 Sep 2024", "category": "Life at TI" }, { "name": "Lone star rising: How Texas is securing America's technological future", "path": "https://www.ti.com/about-ti/behind-chip/articles/lone-star-rising-how-texas-is-securing-americas-technological-future.html", "headline": "Lone star rising: How Texas is securing America's technological future", "subheadline": "The U.S. CHIPS and Science Act and semiconductor investments in Texas will help build a more resilient and state-of-the-art semiconductor supply chain for now and the future", "image": "/content/dam/ticom/images/applications/industrial/wafer-300mm-manufacturing.jpg", "date": "27 Aug 2024", "category": "Manufacturing" }, { "name": "The inception of digital cinema and the journey ahead", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-inception-of-digital-cinema-and-the-journey-ahead.html", "headline": "The inception of digital cinema and the journey ahead", "subheadline": "Celebrating 25 years since the first time DLP Cinema® technology debuted, DLP product innovators at our company reflect on digital cinema technology and its future", "image": "/content/dam/ticom/images/people/employees/off-site/jeff-marsh-dlp25-behind-the-scenes.jpg", "date": "24 Jul 2024", "category": "Technology" }, { "name": "Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules", "path": "https://www.ti.com/about-ti/behind-chip/articles/breaking-the-mold-how-a-new-magnetic-packaging-technology-will-reshape-the-future-of-power-modules.html", "headline": "Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules", "subheadline": "A global team of TIers persisted through challenges to develop the new MagPack™ packaging technology for power modules, a breakthrough that will help advance the future of power design", "image": "/content/dam/ticom/images/people/employees/off-site/kenji-kawano-outdoor-running.jpg", "date": "16 Jul 2024", "category": "Technology" }, { "name": "Composing a career from intern to leader", "path": "https://www.ti.com/about-ti/behind-chip/articles/composing-a-career-from-intern-to-leader.html", "headline": "Composing a career from intern to leader", "subheadline": "How a young problem-solver with a passion for music grew his career from intern to leader of our Analog Audio business", "image": "/content/dam/ticom/images/people/employees/on-site/vikas-s-v-holding-guitar-sitting-on-sofa.jpg", "date": "29 May 2024", "category": "Life at TI" }, { "name": "Exploring the essential role of analog technology", "path": "https://www.ti.com/about-ti/behind-chip/articles/exploring-the-essential-role-of-analog-technology.html", "headline": "Exploring the essential role of analog technology", "subheadline": "The leader of our Analog Signal Chain business discusses how general-purpose analog ICs are crucial for electronic designs", "image": "/content/dam/ticom/images/people/employees/on-site/hagop-kozanian-on-site.jpg", "date": "30 Apr 2024", "category": "Technology" }, { "name": "Rich and Mary Templeton give $91 million to transform engineering at Union College and recruit more women to tech careers", "path": "https://www.ti.com/about-ti/behind-chip/articles/rich-and-mary-templeton-give-91-million-to-transform-engineering-at-union-college-and-recruit-more-women-to-tech-careers.html", "headline": "Rich and Mary Templeton give $91 million to transform engineering at Union College and recruit more women to tech careers", "subheadline": "Rich and Mary Templeton have given two gifts totaling $91 million to their alma mater, Union College, to transform its engineering, computer science and liberal arts programs and help recruit more women into technology careers", "image": "/content/dam/ticom/images/people/employees/off-site/rich-and-mary-templeton-speaking-at-union-college.jpg", "date": "04 Apr 2024", "category": "Life at TI" }, { "name": "Seamless connectivity for vehicle networking", "path": "https://www.ti.com/about-ti/behind-chip/articles/seamless-connectivity-for-vehicle-networking.html", "headline": "Seamless connectivity for vehicle networking", "subheadline": "How the design trend of zone architecture improves automotive communication", "image": "/content/dam/ticom/images/applications/automotive/connected-vehicle-zonal-architecture.jpg", "date": "01 Apr 2024", "category": "Technology" }, { "name": "The importance of ensuring supply for foundational semiconductor chips", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-importance-of-ensuring-supply-for-foundational-semiconductor-chips.html", "headline": "The importance of ensuring supply for foundational semiconductor chips", "subheadline": "Why 45- to 130-nanometer process nodes matter", "image": "/content/dam/ticom/images/applications/industrial/essential-semiconductor-chips.jpg", "date": "20 Mar 2024", "category": "Manufacturing" }, { "name": "How our employees are living out our legacy of giving back", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-our-employees-are-living-out-our-legacy-of-giving-back.html", "headline": "How our employees are living out our legacy of giving back", "subheadline": "From helping refugees resettle into new homes to removing barriers to education for students, our employees are coming together to build stronger communities", "image": "/content/dam/ticom/images/people/employees/off-site/stephan-griebel-with-kid.jpg", "date": "13 Feb 2024", "category": "Life at TI" }, { "name": "Setting a new standard for electronics in space", "path": "https://www.ti.com/about-ti/behind-chip/articles/setting-a-new-standard-for-electronics-in-space.html", "headline": "Setting a new standard for electronics in space", "subheadline": "Learn about our collaboration with NASA and industry leaders in developing radiation-hardened, plastic packaging for space electronics, known as QML Class P, to power missions with size, weight and power in mind", "image": "/content/dam/ticom/images/applications/space/planet-earth-globe-from-space.jpg", "date": "06 Feb 2024", "category": "Technology" }, { "name": "Low-IQ technologies deliver more efficient power management", "path": "https://www.ti.com/about-ti/behind-chip/articles/loq-iq-technologies-deliver-more-efficient-power-management.html", "headline": "Low-IQ technologies deliver more efficient power management", "subheadline": "As demand for battery-powered applications continues to grow rapidly, low-IQ technologies can help extend battery life without compromising system performance", "image": "/content/dam/ticom/images/themes/circuits/low-iq-extended-battery-life.jpg", "date": "14 Dec 2023", "category": "Technology" }, { "name": "The battery-management technology that will strengthen our grid", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-battery-management-technology-that-will-strengthen-our-grid.html", "headline": "The battery-management technology that will strengthen our grid", "subheadline": "Semiconductor innovations in battery systems are leading to energy storage adoption", "image": "/content/dam/ticom/images/applications/grid-infrastructure/battery-ess.jpg", "date": "07 Dec 2023", "category": "Technology" }, { "name": "Education investment creates STEM learning opportunities for local Utah students", "path": "https://www.ti.com/about-ti/behind-chip/articles/education-investment-creates-stem-learning-opportunities-for-local-utah-students.html", "headline": "Education investment creates STEM learning opportunities for local Utah students", "subheadline": "Our company’s $9 million investment will help students in the Alpine School District become tomorrow’s innovators", "image": "/content/dam/ticom/images/people/students/alpine-school-district.jpg", "date": "05 Dec 2023", "category": "Manufacturing" }, { "name": "6 semiconductor technologies that help create safer, smarter vehicles", "path": "https://www.ti.com/about-ti/behind-chip/articles/6-semiconductor-technologies-that-help-create-safer-smarter-vehicles.html", "headline": "6 semiconductor technologies that help create safer, smarter vehicles", "subheadline": "From bumper to bumper and roof to wheels, there is more innovative, efficient semiconductor technology in cars than ever before", "image": "/content/dam/ticom/images/people/employees/on-site/fern-yoon-standing-on-site.jpg", "date": "17 Nov 2023", "category": "Technology" }, { "name": "Q&A: How TI is creating a sustainable future", "path": "https://www.ti.com/about-ti/behind-chip/articles/qa-how-ti-is-creating-a-sustainable-future.html", "headline": "Q&A: How TI is creating a sustainable future", "subheadline": "The leader of our Worldwide Environmental, Safety and Health team shares our company’s long history of environmental sustainability and how we’re reducing our environmental impact", "image": "/content/dam/ticom/images/people/employees/on-site/heidi-means-in-rfab.jpg", "date": "16 Nov 2023", "category": "" }, { "name": "In the factory and beyond, how robots are enhancing our world", "path": "https://www.ti.com/about-ti/behind-chip/articles/in-the-factory-and-beyond-how-robots-are-enhancing-our-world.html", "headline": "In the factory and beyond, how robots are enhancing our world", "subheadline": "Once a vision of the future, robots are helping humans become more productive, efficient and safe in almost any setting", "image": "/content/dam/ticom/images/applications/industrial/robotics-automation.jpg", "date": "08 Nov 2023", "category": "Technology" }, { "name": "Why accurate and reliable high-voltage sensing is critical to the future of electrification", "path": "https://www.ti.com/about-ti/behind-chip/articles/why-accurate-and-reliable-high-voltage-sensing-is-critical-to-the-future-of-electrification.html", "headline": "Why accurate and reliable high-voltage sensing is critical to the future of electrification", "subheadline": "Technology that measures temperature, current and voltage can help accelerate the transition from fossil fuels to renewable energy sources", "image": "/content/dam/ticom/images/applications/sensing/high-voltage-sensing-daytime.jpg", "date": "12 Oct 2023", "category": "Technology" }, { "name": "How new connectivity technologies are lowering the barriers to Industry 4.0", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-new-connectivity-technologies-are-lowering-the-barriers-to-industry-4-0.html", "headline": "How new connectivity technologies are lowering the barriers to Industry 4.0", "subheadline": "The networking architecture of today’s factories is continuously evolving, unlocking better efficiency, safety and sustainability", "image": "/content/dam/ticom/images/applications/factory-automation/connected-factory.jpg", "date": "30 Aug 2023", "category": "Technology" }, { "name": "How semiconductor innovations are making edge AI the future", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-semiconductor-innovations-are-making-edge-ai-the-future.html", "headline": "How semiconductor innovations are making edge AI the future", "subheadline": "Innovations in processors and software are making edge intelligence simpler and more accessible, and its broad implementation closer", "image": "/content/dam/ticom/images/themes/edge-ai/edge-ai-am6xa-graphic-platform.jpg", "date": "29 Aug 2023", "category": "Technology" }, { "name": "A remarkable journey from refugee to engineering intern", "path": "https://www.ti.com/about-ti/behind-chip/articles/a-remarkable-journey-from-refugee-to-engineering-intern.html", "headline": "A remarkable journey from refugee to engineering intern", "subheadline": "His resume is unconventional – shepherd, camel herder, refugee and university student – but Hassan is now on the cusp of a new career as an electrical engineer and hopes to one day share his expertise to make an impact in his community in Chad", "image": "/content/dam/ticom/images/people/employees/on-site/hassan-eisse-outside-ti-campus.jpg", "date": "18 Aug 2023", "category": "Life at TI" }, { "name": "Building a more sustainable energy ecosystem", "path": "https://www.ti.com/about-ti/behind-chip/articles/building-a-more-sustainable-energy-ecosystem.html", "headline": "Building a more sustainable energy ecosystem", "subheadline": "Technology that captures, converts and distributes energy effectively and efficiently will enable the shift from fossil fuels to renewable energy sources and help create a sustainable future", "image": "/content/dam/ticom/images/applications/industrial/solar-panel-over-cityscape-nightlight.jpg", "date": "15 Aug 2023", "category": "Technology" }, { "name": "Driving change for gender equality in STEM", "path": "https://www.ti.com/about-ti/behind-chip/articles/driving-change-for-gender-equality-in-stem.html", "headline": "Driving change for gender equality in STEM", "subheadline": "Fern Yoon, a leader in automotive systems, is passionate about paving the road ahead for women engineers and the future of vehicle electrification", "image": "/content/dam/ticom/images/people/employees/on-site/fern-yoon-standing.jpg", "date": "20 Jun 2023", "category": "Life at TI" }, { "name": "The symphony of precision: Harmonizing power and signal integrity with low-noise technology", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-symphony-of-precision-harmonizing-power-and-signal-integrity-with-low-noise-technology.html", "headline": "The symphony of precision: Harmonizing power and signal integrity with low-noise technology", "subheadline": "Innovations in low-noise and precision technologies are contributing to the vast performance improvements of sensitive medical, test and measurement, and electric vehicle battery-management systems", "image": "/content/dam/ticom/images/people/employees/on-site/steven-schnier-talking-to-colleagues.jpg", "date": "13 Jun 2023", "category": "Technology" }, { "name": "How TI’s investments in back-end manufacturing are helping build capacity for decades to come", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-tis-investments-in-back-end-manufacturing-are-helping-build-capacity-for-decades-to-come.html", "headline": "How TI’s investments in back-end manufacturing are helping build capacity for decades to come", "subheadline": "We’re expanding our assembly and test operations in Kuala Lumpur and Melaka, Malaysia, as part of our long-term strategy to provide greater assurance of supply and support our customers’ needs", "image": "/content/dam/ticom/images/themes/facilities/chengdu-at-10-flip.jpg", "date": "13 Jun 2023", "category": "Manufacturing" }, { "name": "Q&A: TI is inspiring a global culture of building stronger communities", "path": "https://www.ti.com/about-ti/behind-chip/articles/qa-ti-is-inspiring-a-global-culture-of-building-stronger-communities.html", "headline": "Q&A: TI is inspiring a global culture of building stronger communities", "subheadline": "Andy Smith, leader of our Giving and Volunteering team and executive director of the TI Foundation, discusses how the philanthropic spirit is ingrained in TI’s culture, how we’re strengthening communities where we live and work, and what giving back means to him personally", "image": "/content/dam/ticom/images/people/students/reading-day22.jpg", "date": "23 May 2023", "category": "Life at TI" }, { "name": "How semiconductors enable the future of energy", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-semiconductors-enable-the-future-of-energy.html", "headline": "How semiconductors enable the future of energy", "subheadline": "Analog and embedded processing products are enabling electrification through smarter, reliable and more accessible solar, energy storage and electric-vehicle charging systems", "image": "/content/dam/ticom/images/people/employees/off-site/renewable-energy.jpg", "date": "18 Apr 2023", "category": "Technology" }, { "name": "How one engineer’s problem-solving mindset is helping serve the unsheltered and hungry", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-one-engineers-problem-solving-mindset-is-helping-serve-the-unsheltered-and-hungry.html", "headline": "How one engineer’s problem-solving mindset is helping serve the unsheltered and hungry", "subheadline": "An engineer from our wafer fab in Lehi, Utah, earned our Community Impact Award for demonstrating our company values and working toward broader, sustainable solutions for those without homes", "image": "/content/dam/ticom/images/people/employees/off-site/nathan-reed-in-salt-lake-city.jpg", "date": "17 Apr 2023", "category": "Life at TI" }, { "name": "3 trends impacting the future of embedded processing technology", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-trends-impacting-the-future-of-embedded-processing-technology.html", "headline": "3 trends impacting the future of embedded processing technology", "subheadline": "Technology that’s making the future of embedded possible is transforming smart homes, cities, factories and vehicles, optimizing everyday electronics and unlocking new ways to create a better world", "image": "/content/dam/ticom/images/applications/industrial/gp-platform-process-warehouse.jpg", "date": "07 Apr 2023", "category": "Technology" }, { "name": "3 reasons GaN is changing power management", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-reason-gan-is-changing-power-management.html", "headline": "3 reasons GaN is changing power management", "subheadline": "Gallium nitride is replacing silicon in a growing list of applications that require greater power density and energy efficiency", "image": "/content/dam/ticom/images/applications/enterprise-system/hv-foundation-delta-server.jpg", "date": "04 Apr 2023", "category": "Technology" }, { "name": "How vehicle networks help keep drivers safe", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-vehicle-networks-help-keep-drivers-safe.html", "headline": "How vehicle networks help keep drivers safe", "subheadline": "Take vehicle safety to the next level with integrated and connected communications protocols", "image": "/content/dam/ticom/images/applications/automotive/adas-vehicle-networks.jpg", "date": "23 Mar 2023", "category": "Technology" }, { "name": "Q&A: Pradeep Shenoy shares how he’s inspiring the next generation of power engineers", "path": "https://www.ti.com/about-ti/behind-chip/articles/qa-pradeep-shenoy-shares-how-hes-inspiring-the-next-generation-of-power-engineers.html", "headline": "Q&A: Pradeep Shenoy shares how he’s inspiring the next generation of power engineers", "subheadline": "The leader of our automotive power design services team discusses how he’s leading the Applied Power Electronics Conference and making it more accessible and why he’s excited about creating the future of automotive", "image": "/content/dam/ticom/images/people/employees/on-site/pradeep-shenoy-sahana-krishnan-lab.jpg", "date": "14 Mar 2023", "category": "Life at TI" }, { "name": "A legacy of impact in North Texas", "path": "https://www.ti.com/about-ti/behind-chip/articles/a-legacy-of-impac-in-north-texas.html", "headline": "A legacy of impact in North Texas", "subheadline": "Since our company’s founding more than 90 years ago, we’ve been committed to strengthening the communities where we work and call home.", "image": "/content/dam/ticom/images/people/employees/off-site/corporate-citizenship.jpg", "date": "13 Feb 2023", "category": "Life at TI" }, { "name": "Ultrasonic lens cleaning brings camera reliability into focus", "path": "https://www.ti.com/about-ti/behind-chip/articles/ultrasonic-lens-cleaning-brings-camera-reliability-into-focus.html", "headline": "Ultrasonic lens cleaning brings camera reliability into focus", "subheadline": "As advancements in autonomy multiply the number of cameras and sensors on vehicles, drones, robots and more, a purely electrically driven method can help keep them all clean", "image": "/content/dam/ticom/images/applications/automotive/ultra-lens-cleaning-side-mirror-auto.jpg", "date": "02 Feb 2023", "category": "Technology" }, { "name": "High-voltage technologies are key to empowering a more sustainable future", "path": "https://www.ti.com/about-ti/behind-chip/articles/high-voltage-technologies-are-key-to-empowering-a-more-sustainable-future.html", "headline": "High-voltage technologies are key to empowering a more sustainable future", "subheadline": "As electrification becomes more common, semiconductor innovations enable us to interact with electric vehicles, renewable energy sources and other high-voltage systems safely and reliably", "image": "/content/dam/ticom/images/applications/automotive/ev-charging-hvfoundation.jpg", "date": "30 Jan 2023", "category": "Technology" }, { "name": "Haviv Ilan to become next president and CEO of TI", "path": "https://www.ti.com/about-ti/behind-chip/articles/haviv-ilan-to-become-next-president-and-ceo-of-ti.html", "headline": "Haviv Ilan to become next president and CEO of TI", "subheadline": "Current CEO Rich Templeton continues as chairman of the board", "image": "/content/dam/ticom/images/people/employees/on-site/ceo-haviv-ilan.jpg", "date": "19 Jan 2023", "category": "Life at TI" }, { "name": "5 reasons EVs are here to stay", "path": "https://www.ti.com/about-ti/behind-chip/articles/5-reasons-evs-are-here-to-stay.html", "headline": "5 reasons EVs are here to stay", "subheadline": "Semiconductor technology is powering electric vehicles through the innovation curve, eliminating barriers to EV adoption and enabling automakers to design affordable cars that consumers love", "image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-in-car.jpg", "date": "04 Jan 2023", "category": "Technology" }, { "name": "TI’s latest 300-millimeter wafer fab in Lehi, Utah, begins production", "path": "https://www.ti.com/about-ti/behind-chip/articles/tis-latest-300-millimeter-wafer-fab-in-lehi-utah-begins-production.html", "headline": "TI’s latest 300-millimeter wafer fab in Lehi, Utah, begins production", "subheadline": "LFAB is our second 300-mm fab to start production in 2022, about one year after our company purchased the facility", "image": "/content/dam/ticom/images/themes/facilities/lfab-front-entrance-aerial-view.jpg", "date": "06 Dec 2022", "category": "Manufacturing" }, { "name": "It’s a Matter of standardization: new wireless protocol provides a connected foundation for smart devices", "path": "https://www.ti.com/about-ti/behind-chip/articles/its-a-matter-of-standardization-new-wireless-protocol-provides-a-connected-foundation-for-smart-devices.html", "headline": "It’s a Matter of standardization: new wireless protocol provides a connected foundation for smart devices", "subheadline": "As smart, connected devices become more integrated into our everyday lives, the Matter wireless connectivity protocol aims to unify the fragmented Internet of Things ecosystem", "image": "/content/dam/ticom/images/applications/communication-equipment/matter-protocol.jpg", "date": "29 Nov 2022", "category": "Technology" }, { "name": "5 things you should know about V2G", "path": "https://www.ti.com/about-ti/behind-chip/articles/5-things-you-should-know-about-v2g.html", "headline": "5 things you should know about V2G", "subheadline": "As rising demands are pushing electric grids to their limits, vehicle-to-grid (V2G) bidirectional charging can help smooth out peak capacity", "image": "/content/dam/ticom/images/applications/automotive/vehicle-to-grid.jpg", "date": "08 Nov 2022", "category": "Technology" }, { "name": "Q&A: How TI is investing in manufacturing capacity to support growth for decades to come", "path": "https://www.ti.com/about-ti/behind-chip/articles/qa-how-ti-is-investing-in-manufacturing-capacity-to-support-growth-for-decades-to-come.html", "headline": "Q&A: How TI is investing in manufacturing capacity to support growth for decades to come", "subheadline": "Kyle Flessner, who leads our Technology and Manufacturing Group, discusses TI’s plans to expand internal manufacturing capacity for the long term", "image": "/content/dam/ticom/images/people/employees/on-site/flessner-kyle-manufacturing.jpg", "date": "01 Nov 2022", "category": "Manufacturing" }, { "name": "How thermal efficiency is helping data centers run more sustainably", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-thermal-efficiency-is-helping-data-centers-run-more-sustainably.html", "headline": "How thermal efficiency is helping data centers run more sustainably", "subheadline": "Innovative semiconductor design and packaging technologies are improving efficiencies in data centers as server power demands increase", "image": "/content/dam/ticom/images/applications/enterprise-system/thermals-power-density.jpg", "date": "25 Oct 2022", "category": "Technology" }, { "name": "TI’s new 300-millimeter wafer fab in Richardson, Texas, begins initial production", "path": "https://www.ti.com/about-ti/behind-chip/articles/tis-new-300-millimeter-wafer-fab-in-richardson-texas-begins-initial-production.html", "headline": "TI’s new 300-millimeter wafer fab in Richardson, Texas, begins initial production", "subheadline": "We’re building the next era of semiconductor manufacturing to support the future growth in electronics", "image": "/content/dam/ticom/images/themes/facilities/richardson-texas-wafer-fabs.jpg", "date": "29 Sep 2022", "category": "Manufacturing" }, { "name": "From idea to invention: The origin story of the tiny chip that changed the world", "path": "https://www.ti.com/about-ti/behind-chip/articles/from-idea-to-invention-the-origin-story-of-the-tiny-chip-that-changed-the-world.html", "headline": "From idea to invention: The origin story of the tiny chip that changed the world", "subheadline": "How an ice storm in Kansas sparked Jack Kilby’s interest in electronics, fueling his work to develop the first integrated circuit", "image": "/content/dam/ticom/images/people/employees/on-site/kilby-integrated-circuit-historical.jpg", "date": "12 Sep 2022", "category": "Technology" }, { "name": "Traction inverters: the intersection of automotive innovation and performance", "path": "https://www.ti.com/about-ti/behind-chip/articles/traction-inverters-the-intersection-of-automotive-innovation-and-performance.html", "headline": "Traction inverters: the intersection of automotive innovation and performance", "subheadline": "Step on the pedal of a modern electric vehicle (EV) and you’re rewarded with quick, smooth acceleration. Should you be satisfied? Absolutely not.", "image": "/content/dam/ticom/images/applications/automotive/red-auto-mountain-road-traction-inverter.jpg", "date": "12 Sep 2022", "category": "Technology" }, { "name": "Why isolation matters for your power electronics", "path": "https://www.ti.com/about-ti/behind-chip/articles/why-isolation-matters-for-your-power-electronics.html", "headline": "Why isolation matters for your power electronics", "subheadline": "Innovations in isolation pave the way for more sophisticated electric vehicles, more intelligent factory sensors and robots, and more reliable medical devices", "image": "/content/dam/ticom/images/applications/automotive/isolation-hand-charging-electric-vehicle.jpg", "date": "30 Aug 2022", "category": "Technology" }, { "name": "The vehicle-to-grid vision: unleashing the power of electric vehicles", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-vehicle-to-grid-vision-unleashing-the-power-of-electric-vehicles.html", "headline": "The vehicle-to-grid vision: unleashing the power of electric vehicles", "subheadline": "Enabled by semiconductor technology, vehicle-to-grid (V2G) bidirectional charging can provide battery power to reinforce electric grids during peak demand and power your home when electricity is expensive or out", "image": "/content/dam/ticom/images/applications/automotive/vehicle-grid-technology.jpg", "date": "23 Aug 2022", "category": "Technology" }, { "name": "From sun to switch, semiconductors enable the journey of energy", "path": "https://www.ti.com/about-ti/behind-chip/articles/from-sun-to-switch-semiconductors-enable-the-journey-of-energy.html", "headline": "From sun to switch, semiconductors enable the journey of energy", "subheadline": "As the popularity of renewable energy sources increases, semiconductors can enable the efficient and safe transportation of energy to more homes, buildings and cities", "image": "/content/dam/ticom/images/applications/industrial/residential-solar-panels.jpg", "date": "02 Aug 2022", "category": "Technology" }, { "name": "Space-grade ICs help the James Webb Telescope peer deep into the cosmos", "path": "https://www.ti.com/about-ti/behind-chip/articles/space-grade-ics-help-the-james-webb-telescope-peer-deep-into-the-cosmos.html", "headline": "Space-grade ICs help the James Webb Telescope peer deep into the cosmos", "subheadline": "NASA has released the first images from its largest and most powerful space telescope as it looks into the universe with unprecedented resolution and sensitivity", "image": "/content/dam/ticom/images/applications/space/webb-telescope.jpg", "date": "19 Jul 2022", "category": "Technology" }, { "name": "3 ways semiconductors enhance automation and efficiency", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-ways-semiconductors-enhance-automation-and-efficiency.html", "headline": "3 ways semiconductors enhance automation and efficiency", "subheadline": "Semiconductor technology is helping maximize productivity across a range of industrial systems, from robotics to factory automation, grid, home automation and more", "image": "/content/dam/ticom/images/applications/industrial/enhancing-automation-warehouse.jpg", "date": "28 Jun 2022", "category": "Technology" }, { "name": "How sensor fusion is driving vehicle autonomy forward", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-sensor-fusion-is-driving-vehicle-autonomy-forward.html", "headline": "How sensor fusion is driving vehicle autonomy forward", "subheadline": "As ADAS technology extends to critical, time-sensitive applications – such as emergency braking, front-collision warning and avoidance, and blind-spot detection – combining data from multiple sensors enables reliable, real-time decisions for safer autonomous driving", "image": "/content/dam/ticom/images/applications/automotive/real-time-processing.jpg", "date": "07 Jun 2022", "category": "Technology" }, { "name": "Vision: Possible", "path": "https://www.ti.com/about-ti/behind-chip/articles/vision-possible.html", "headline": "Vision: Possible", "subheadline": "The inside story of the world’s first millimeter-wave radar system on chip, part 1", "image": "/content/dam/ticom/images/applications/sensing/firefighter-helmet-sensing.jpg", "date": "28 Apr 2022", "category": "Technology" }, { "name": "5 trends shaping the future of power management", "path": "https://www.ti.com/about-ti/behind-chip/articles/5-trends-shaping-the-future-of-power-management.html", "headline": "5 trends shaping the future of power management", "subheadline": "Performance improvements in power density, electromagnetic interference, isolation, quiescent current, and noise and precision are giving designers the capabilities to push power further", "image": "/content/dam/ticom/images/people/employees/on-site/jeff-morroni-showing-small-ic.jpg", "date": "06 Apr 2022", "category": "Technology" }, { "name": "Sensor fusion is enabling the next wave of smart, autonomous robots", "path": "https://www.ti.com/about-ti/behind-chip/articles/sensor-fusion-is-enabling-the-next-wave-of-smart-autonomous-robots.html", "headline": "Sensor fusion is enabling the next wave of smart, autonomous robots", "subheadline": "Sensors in robots that mimic human vision are accelerating automation, improving reliability and safety, and making our lives easier", "image": "/content/dam/ticom/images/applications/industrial/robots-moving-boxes-in-warehouse.jpg", "date": "29 Mar 2022", "category": "Technology" }, { "name": "Building a fast, flexible EV charging network", "path": "https://www.ti.com/about-ti/behind-chip/articles/building-a-fast-flexible-EV-charging-network.html", "headline": "Building a fast, flexible EV charging network", "subheadline": "In our electric-vehicle future, semiconductor technology will offer grid operators more flexibility to better manage energy infrastructure", "image": "/content/dam/ticom/images/people/employees/off-site/henrik-mannesson-electric-car.jpg", "date": "08 Feb 2022", "category": "Technology" }, { "name": "What’s next in BMS? Safer, more affordable electric vehicles", "path": "https://www.ti.com/about-ti/behind-chip/articles/whats-next-in-bms-safer-more-affordable-electric-vehicles.html", "headline": "What’s next in BMS? Safer, more affordable electric vehicles", "subheadline": "As automakers consider new EV battery chemistries, battery management systems (BMS) with advanced semiconductor technologies are more critical than ever", "image": "/content/dam/ticom/images/applications/automotive/red-car-wheat-field.jpg", "date": "25 Jan 2022", "category": "Technology" }, { "name": "Dan Wang on enabling a safer world with TI mmWave radar: ‘It’s just the beginning’", "path": "https://www.ti.com/about-ti/behind-chip/articles/dan-wang-on-enabling-a-safer-world-with-ti-mmwave-radar-its-just-the-beginning.html", "headline": "Dan Wang on enabling a safer world with TI mmWave radar: ‘It’s just the beginning’", "subheadline": "Dan, a pioneer in millimeter wave radar applications, has a vision for the future of sensing technology", "image": "/content/dam/ticom/images/people/employees/on-site/dan-wang.jpg", "date": "10 Jan 2022", "category": "Technology" }, { "name": "7 ways semiconductors are accelerating the future of automotive technology", "path": "https://www.ti.com/about-ti/behind-chip/articles/7-ways-semiconductors-are-accelerating-the-future-of-automotive-technology.html", "headline": "7 ways semiconductors are accelerating the future of automotive technology", "subheadline": "As the world drives toward vehicle electrification, semiconductors enable automakers to optimize performance, accelerate development and make electric vehicles (EVs) more affordable for more people", "image": "/content/dam/ticom/images/people/employees/off-site/keith-ogboenyiya-automotive.jpg", "date": "30 Nov 2021", "category": "Technology" }, { "name": "New TI Biomedical Engineering and Sciences Building will advance patient care", "path": "https://www.ti.com/about-ti/behind-chip/articles/new-ti-biomedical-engineering-and-sciences-building-will-advance-patient-care.html", "headline": "New TI Biomedical Engineering and Sciences Building will advance patient care", "subheadline": "A collaboration between The University of Texas at Dallas, UT Southwestern Medical Center and TI will take biomedical engineering and research to new levels", "image": "/content/dam/ticom/images/themes/facilities/ti-biomedical-engineering-science-building-at-utsw.jpg", "date": "15 Nov 2021", "category": "Life at TI" }, { "name": "Q&A: How low quiescent current is transforming battery-powered devices", "path": "https://www.ti.com/about-ti/behind-chip/articles/qa-how-low-quiescent-current-is-transforming-battery-powered-devices.html", "headline": "Q&A: How low quiescent current is transforming battery-powered devices", "subheadline": "Low quiescent current is extending battery life in devices ranging from smart watches to smoke detectors", "image": "/content/dam/ticom/images/people/employees/off-site/keith-kunz-running-on-trail-timg.jpg", "date": "10 Nov 2021", "category": "Technology" }, { "name": "ADAS: The technology driving automotive safety forward", "path": "https://www.ti.com/about-ti/behind-chip/articles/adas-the-technology-driving-automotive-safety-forward.html", "headline": "ADAS: The technology driving automotive safety forward", "subheadline": "Advanced driver assistance systems make cars safer and smarter, helping carmakers achieve their vision for a collision-free future", "image": "/content/dam/ticom/images/applications/automotive/cars-using-adas-on-highway.jpg", "date": "05 Oct 2021", "category": "Technology" }, { "name": "Meet the risk-buster: How functional safety helps keep you safe", "path": "https://www.ti.com/about-ti/behind-chip/articles/meet-the-risk-buster-how-functional-safety-helps-keep-you-safe.html", "headline": "Meet the risk-buster: How functional safety helps keep you safe", "subheadline": "Whether it’s preventing systematic failures or anticipating and mitigating future risk, functional safety has changed the way engineers think about designing systems", "image": "/content/dam/ticom/images/applications/automotive/functional-safety-dashboard-display.jpg", "date": "24 Aug 2021", "category": "Technology" }, { "name": "From the rice fields to technology leadership", "path": "https://www.ti.com/about-ti/behind-chip/articles/from-the-rice-fields-to-technology-leadership.html", "headline": "From the rice fields to technology leadership", "subheadline": "Since leaving the rice fields as a young man and advancing his career, Jinrong Qian has been driven to be creative, solve problems, and do the right thing for customers and our company", "image": "/content/dam/ticom/images/people/employees/on-site/jinrong-qian-outside-ti-south-campus.jpg", "date": "10 Aug 2021", "category": "Life at TI" }, { "name": "Q&A: The technology making real-time processing easy and affordable", "path": "https://www.ti.com/about-ti/behind-chip/articles/qa-the-technology-making-real-time-processing-easy-and-affordable.html", "headline": "Q&A: The technology making real-time processing easy and affordable", "subheadline": "As the need grows for real-time control, intelligence and communications at the edge of electronic systems, high-performance MCUs are now providing a simple, cost-effective solution", "image": "/content/dam/ticom/images/people/employees/on-site/mike-pienovi-in-lab.jpg", "date": "03 Aug 2021", "category": "Technology" }, { "name": "Bringing high-quality 3D printing to your desktop", "path": "https://www.ti.com/about-ti/behind-chip/articles/bringing-high-quality-3d-printing-to-your-desktop.html", "headline": "Bringing high-quality 3D printing to your desktop", "subheadline": "TI DLP® technology is making high-quality 3D printing more affordable for small business owners, hobbyists and others", "image": "/content/dam/ticom/images/applications/projection-display/dlp-3d-printing.jpg", "date": "20 Jul 2021", "category": "Technology" }, { "name": "Developing the first ICs to orbit Earth", "path": "https://www.ti.com/about-ti/behind-chip/articles/developing-the-first-ics-to-orbit-earth.html", "headline": "Developing the first ICs to orbit Earth", "subheadline": "For Charles “Bob” Cook, a project assigned by Jack Kilby led to the development of the first integrated circuits to ever orbit the Earth – and a foundation for future space electronics", "image": "/content/dam/ticom/images/themes/size/charles-cook-holding-integrated-circuit.jpg", "date": "24 Jun 2021", "category": "Technology" }, { "name": "The power of packaging", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-power-of-packaging.html", "headline": "The power of packaging", "subheadline": "The packages that encapsulate and protect integrated circuits have become increasingly critical as electronics get smaller and more components are integrated.", "image": "/content/dam/ticom/images/themes/size/small-packaging.jpg", "date": "01 Jun 2021", "category": "Technology" }, { "name": "Carmakers charge ahead with electric vehicle powertrain integration", "path": "https://www.ti.com/about-ti/behind-chip/articles/carmakers-charge-ahead-with-electric-vehicle-powertrain-integration.html", "headline": "Carmakers charge ahead with electric vehicle powertrain integration", "subheadline": "Integrating powertrain systems into a compact mechanical enclosure can lead to more affordable, more efficient electric vehicles (EVs)", "image": "/content/dam/ticom/images/applications/automotive/integrated-power-train.jpg", "date": "28 Apr 2021", "category": "Technology" }, { "name": "Tackling the EMI challenge", "path": "https://www.ti.com/about-ti/behind-chip/articles/tackling-the-emi-challenge.html", "headline": "Tackling the EMI challenge", "subheadline": "As consumers expect better performance out of their electronics, mitigating electromagnetic interference (EMI) becomes a bigger problem to solve", "image": "/content/dam/ticom/images/people/employees/on-site/jeff-meroni-engineering-progress.jpg", "date": "19 Apr 2021", "category": "Technology" }, { "name": "3 ways real-time control can make cities more sustainable", "path": "https://www.ti.com/about-ti/behind-chip/articles/3-ways-real-time-control-can-make-cities-more-sustainable.html", "headline": "3 ways real-time control can make cities more sustainable", "subheadline": "From electric vehicle charging stations to solar energy solutions, cities are becoming more efficient through technology advances like real-time control", "image": "/content/dam/ticom/images/themes/landmark/shanghai-skyline.jpg", "date": "13 Apr 2021", "category": "Technology" }, { "name": "Small satellites, big advances", "path": "https://www.ti.com/about-ti/behind-chip/articles/small-satellites-big-advances.html", "headline": "Small satellites, big advances", "subheadline": "TI’s high-reliability space-grade power-management devices are helping power the next generation of smarter, smaller satellites, enabling NASA engineers to better understand our universe", "image": "/content/dam/ticom/images/applications/space/earth-with-illustrated-air-routes-network.jpg", "date": "02 Mar 2021", "category": "Technology" }, { "name": "More miles, fewer wires in future electric vehicles", "path": "https://www.ti.com/about-ti/behind-chip/articles/more-miles-fewer-wires-in-future-electric-vehicles.html", "headline": "More miles, fewer wires in future electric vehicles", "subheadline": "Going wireless with the next generation of battery management systems (BMS) removes heavy communications cabling from inside EVs to help improve driving range and reliability", "image": "/content/dam/ticom/images/applications/automotive/wbms-car-nature.jpg", "date": "06 Jan 2021", "category": "Technology" }, { "name": "Pushing automotive power tech faster and further", "path": "https://www.ti.com/about-ti/behind-chip/articles/pushing-automotive-power-tech-faster-and-further.html", "headline": "Pushing automotive power tech faster and further", "subheadline": "From developing groundbreaking innovations to mentoring new TIers, Pradeep Shenoy is passionate about pushing the next generation of automotive power technology forward", "image": "/content/dam/ticom/images/people/employees/off-site/pradeep-shenoy-electric-vehicle.jpg", "date": "15 Dec 2020", "category": "Technology" }, { "name": "Accelerating wireless connectivity for a changing world", "path": "https://www.ti.com/about-ti/behind-chip/articles/accelerating-wireless-connectivity-for-a-changing-world.html", "headline": "Accelerating wireless connectivity for a changing world", "subheadline": "From remote work to home-based education, wireless connectivity allows us to quickly adapt and stay productive", "image": "/content/dam/ticom/images/people/employees/off-site/mattias-lange-in-dallas.jpg", "date": "17 Nov 2020", "category": "Technology" }, { "name": "Driving the electric vehicle evolution with GaN", "path": "https://www.ti.com/about-ti/behind-chip/articles/driving-the-electric-vehicle-evolution-with-gan.html", "headline": "Driving the electric vehicle evolution with GaN", "subheadline": "New gallium nitride (GaN) technology can help electric and hybrid-electric vehicles charge faster and drive farther", "image": "/content/dam/ticom/images/applications/automotive/electric-car-on-scenic-road.jpg", "date": "09 Nov 2020", "category": "Technology" }, { "name": "Cobots bring the future to the factory", "path": "https://www.ti.com/about-ti/behind-chip/articles/cobots-bring-the-future-to-the-factory.html", "headline": "Cobots bring the future to the factory", "subheadline": "Working alongside humans, collaborative robots create operational efficiencies and unleash ingenuity", "image": "/content/dam/ticom/images/applications/industrial/factory-automation-sensor-mmwave-radar.jpg", "date": "03 Nov 2020", "category": "Technology" }, { "name": "Preparing for disruption", "path": "https://www.ti.com/about-ti/behind-chip/articles/preparing-for-disruption.html", "headline": "Preparing for disruption", "subheadline": "3 ways machine learning helps companies react quickly to changing circumstances", "image": "/content/dam/ticom/images/applications/industrial/machine-learning-and-business-agility.jpg", "date": "13 Oct 2020", "category": "Technology" }, { "name": "Journey of innovation", "path": "https://www.ti.com/about-ti/behind-chip/articles/journey-of-innovation.html", "headline": "Journey of innovation", "subheadline": "The inside story of the world’s first millimeter-wave radar system on chip, part 2", "image": "/content/dam/ticom/images/applications/automotive/front-long-range-mmwave-radar-automotive.jpg", "date": "06 Oct 2020", "category": "Technology" }, { "name": "The chip that changed the world", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-chip-that-changed-the-world.html", "headline": "The chip that changed the world", "subheadline": "TIer Jack Kilby’s invention of the integrated circuit, plus decades of subsequent innovation, demonstrate our passion to create a better world by making electronics more affordable through semiconductors.", "image": "/content/dam/ticom/images/people/employees/on-site/jack-kilby-day.jpg", "date": "15 Sep 2020", "category": "Technology" }, { "name": "Doing more with less power", "path": "https://www.ti.com/about-ti/behind-chip/articles/doing-more-with-less-power.html", "headline": "Doing more with less power", "subheadline": "Our insatiable appetite for electricity brings challenges to pack more power in a smaller space, all while reducing system costs", "image": "/content/dam/ticom/images/applications/enterprise-system/engineering-progress.jpg", "date": "25 Aug 2020", "category": "Technology" }, { "name": "The new tech frontier in senior care", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-new-tech-frontier-in-senior-care.html", "headline": "The new tech frontier in senior care", "subheadline": "Cost-effective, accessible technologies – sensors, wearable monitors and data – are creating new opportunities to care for the senior population.", "image": "/content/dam/ticom/images/applications/sensing/telehealth-vital-sign-detection-sensor-mmwave-radar.jpg", "date": "11 Aug 2020", "category": "Technology" }, { "name": "The art of persistence", "path": "https://www.ti.com/about-ti/behind-chip/articles/the-art-of-persistence.html", "headline": "The art of persistence", "subheadline": "Xiaolin’s tenacity and passion for networks improves technology and people", "image": "/content/dam/ticom/images/people/employees/on-site/xiaolin-lu-at-kilby-building.jpg", "date": "04 Aug 2020", "category": "Technology" }, { "name": "Perfect timing", "path": "https://www.ti.com/about-ti/behind-chip/articles/perfect-timing.html", "headline": "Perfect timing", "subheadline": "The inside story of the microchip that helps sync Earth's largest radio-telescope, the Square Kilometer Array", "image": "/content/dam/ticom/images/applications/space/square-kilometer-array.jpg", "date": "21 Jul 2020", "category": "Technology" }, { "name": "Engineering hope for rare diseases", "path": "https://www.ti.com/about-ti/behind-chip/articles/engineering-hope-for-rare-diseases.html", "headline": "Engineering hope for rare diseases", "subheadline": "Gina Hann walked into her son’s kindergarten class wearing zebra stripes and armed with enough black-and-white snack cakes to build a small fort.", "image": "/content/dam/ticom/images/people/employees/off-site/gina-hann-and-joseph-laughing.jpg", "date": "26 Nov 2019", "category": "Technology" }, { "name": "TI has selected Richardson, Texas as the location for our next 300mm analog wafer fab", "path": "https://www.ti.com/about-ti/behind-chip/articles/ti-has-selected-richardson-texas-as-the-location-for-our-next-300mm-analog-wafer-fab.html", "headline": "TI has selected Richardson, Texas as the location for our next 300mm analog wafer fab", "subheadline": "We are pleased to announce TI has selected Richardson, Texas as the location for our next 300mm analog wafer fab.", "image": "/content/dam/ticom/images/themes/facilities/rfab-site-aereal-view.jpg", "date": "19 Apr 2019", "category": "Manufacturing" }, { "name": "How two engineers used problem solving to turn a terminal diagnosis into hope for their son and countless others", "path": "https://www.ti.com/about-ti/behind-chip/articles/how-two-engineers-used-problem-solving-to-turn-a-terminal-diagnosis-into-hope-for-their-son-and-countless-others.html", "headline": "How two engineers used problem solving to turn a terminal diagnosis into hope for their son and countless others", "subheadline": "Everything changed for TI engineers Matt and Gina Hann on March 7, when they were told to prepare for the end of their son’s life.", "image": "/content/dam/ticom/images/people/employees/off-site/batten-hope-family.jpg", "date": "19 Sep 2017", "category": "Technology" } ]