TI Embedded Labs

Learn about our latest technological advancements and system solutions for a broad range of embedded topics

Attend a TI Embedded Labs session

This event features expert-led sessions on embedded processing topics from cybersecurity to edge AI integrations. Whether you're interested in AI-powered signal processing, multi-protocol wireless solutions, precision motor control, navigating new regulatory landscapes, or accelerating development with zero-code tools, there's something here for everyone. Join our industry experts as they guide you through embedded topics, and become an expert yourself.

Registration information

Session title
Date
Time
Registration
How TI's edge AI accelerators solve real industrial problems
September 14, 2026 8:30 a.m. CST Register now
Compliance by design: Texas Instruments' response to global cybersecurity regulations
September 14, 2026 10:00 a.m. CST Register now
Discover the TI Software ecosystem- from a unified Zephyr RTOS story to Agentic AI in CCStudio™
September 15, 2026 8:30 a.m. CST Register now
Building safer embedded systems with TI's functional safety architecture
September 15, 2026 10:00 a.m. CST Register now
Designing next-gen digital power and motor control
September 16, 2026 8:30 a.m. CST Register now
Advanced wireless connectivity features on SimpleLink MCU low-power F3 and Wi-Fi CC33xx devices
September 16, 2026 10:00 a.m. CST Register now
Functional Safety with MSPM0/M33 across home appliances, industrial and automotive sectors
September 17, 2026 8:30 a.m. CST Register now
How TI Partners speed up time to market and enable customers through cybersecurity challenges
September 17, 2026 10:00 a.m. CST Register now
How TI's mmWave radar module lowers the barrier to radar-based designs
September 18, 2026 8:30 a.m. CST Register now

Session details

Topic & description

How TI's edge AI accelerators solve real industrial problems

As industrial systems demand smarter, real-time decision-making, edge AI has become a critical enabler. This session introduces TI's edge AI accelerator portfolio—including TINIE and NPU-CDE—and presents a cross-BU overview of AI-enabled devices. Attendees will explore TI's AI toolchain and development flow, from model training to embedded deployment. Real-world examples demonstrate edge AI solving practical challenges: HVAC efficiency optimization, power quality monitoring, temperature prediction, AC arc fault detection, and washing machine weight sensing. The session also covers how edge AI is transforming embedded software development, helping engineers build smarter, faster, and more efficient industrial solutions on TI platforms.

Compliance by design: Texas Instruments' response to global cybersecurity regulations

With the emergence of strict global regulations such as the Cyber Resilience Act (CRA), cybersecurity is no longer optional—it is a prerequisite in embedded system design. This session will present TI's understanding of these regulatory frameworks and our embedded processing portfolio's approach to meeting them. Attendees will learn how TI is integrating compliance capabilities into our products and what tools and support we are building to help you navigate the new compliance landscape.

Discover the TI Software ecosystem- from a unified Zephyr RTOS story to Agentic AI in CCStudio™

Explore Texas Instruments' evolving software ecosystem, where a unified Zephyr RTOS strategy brings consistency and portability across TI's microcontroller and processor families. Discover how TI's Zephyr contributions accelerate development with standardized drivers, HALs, and tooling that span from ultra-low-power SimpleLink devices to high-performance processors. Upgrade your connectivity with Matter and OpenThread, then step into the future with Agentic AI integration in Code Composer Studio — intelligent assistance that understands your hardware context, automates repetitive workflows, and guides developers from concept to production-ready embedded code.

Building safer embedded systems with TI's functional safety architecture

This session introduces how TI's embedded products support functional safety applications. It covers the fundamentals of functional safety, the safety architecture of TI MCUs and processors, and practical use cases. Learn how these solutions help engineers design safer and more reliable systems for years to come.

Designing next-gen digital power and motor control

This session examines how leveraging real-time performance and low-latency peripherals can drive next-generation efficiency in motor control and digital power solutions. We will explore how advanced PWM peripherals facilitate complex power topologies-including matrix converters, HVDC data center solutions, and resonant converters in order to optimize efficiency, form factor, and reliability. Furthermore, we will discuss the integration of multi-axis, multi-encoder architectures using real-time EtherCAT communication to meet the rigorous demands of humanoid robotics and drone applications, such as implementing four-BLDC FOC control on a single MCU. The session concludes with a look at TI's comprehensive safety and application-specific solutions for data centers, traction, EV charging, and servo drives

Advanced wireless connectivity features on SimpleLink MCU low-power F3 and Wi-Fi CC33xx devices

This session covers recently implemented advanced wireless connectivity features on SimpleLink MCU low-power F3 (CC23xx/CC27xx) Bluetooth LE devices and SimpleLink Wi-Fi CC33xx Wi-Fi + BLE devices. Dive into the Bluetooth LE 5 and Bluetooth LE 6 features such as channel sounding, connection handover, and Periodic Advertisements with Write Responses (PaWR) - their use cases, target end equipment, and key design considerations. The session also highlights the dual-mode CC33xx platform's flexibility for enabling multiple connectivity options from a single MCU, and provides guidance on TI's demo library, SDK support, and tools for engineers migrating from other vendor platforms.

Functional Safety with MSPM0/M33 across home appliances, industrial and automotive sectors

Explore how TI’s MSP MCUs streamline the path to functional safety. Across the MSPM0 and MSPM33 portfolio, TI offers pre-qualified safety packages certified to home appliance (IEC 60730 Class B), industrial (IEC 61508 SIL-2), and automotive (ISO 26262 ASIL-B). This session delivers a system-level overview of key safety concepts, the regulatory landscape and practical guidance on leveraging the built-in safety features. Plus TI’s comprehensive documentation to simplify compliance.

How TI Partners speed up time to market and enable customers through cybersecurity challenges

Bringing a connected embedded product to market demands more than silicon, it requires secure, production-ready software stacks and trusted ecosystem partners. This session examines how TI System-on-Module (SOM) partners accelerate customer development by delivering pre-integrated hardware and software solutions built on TI processors. Featuring platforms like Torizon, we explore how managed Linux environments, OTA update infrastructure, and built-in security hardening help teams navigate today's cybersecurity requirements from secure boot to vulnerability management without starting from scratch. Learn how leveraging the TI partner ecosystem compresses development cycles, reduces compliance risk, and lets teams focus on their core application differentiation.

How TI's mmWave radar module lowers the barrier to radar-based designs

Radar sensing has long demanded specialized expertise in RF design, signal processing, and regulatory compliance — but that's changing. Recent advances in hardware integration, simplified software frameworks, and development tools have dramatically lowered the barrier to entry. This presentation explores how TI's first pre-certified mmWave radar module addresses these traditional challenges and how radar has evolved into an accessible, easy-to-use technology suitable for smart homes, industrial automation, healthcare, and beyond.