Accelerating Analog Performance with Packaging Breakthroughs

This white paper explores how recent advancements in analog packaging technology enable engineers to integrate more functionality into smaller form factors while maintaining high levels of precision and performance, thus creating new design possibilities.

Topics include:

• Overview of market requirements driving the need for efficient and dependable packaging
• Integration at system, subsystem and package level and how it drives enhanced power efficiency
• The impact of packaging on semiconductor size