Home DLP products Advanced light-control chipsets

DLP products

Advanced light-control chipsets – Applications

TI DLP® chipsets have enabled powerful, flexible, and programmable light control solutions. The DLP advanced light control product portfolio extends this industry-leading MEMS display technology into ultra-violet and infrared wavelengths, while also enabling faster pattern rates and more advanced pixel control. Through complete reference designs and easy-to-use development tools, TI is accelerating innovative new product development into industrial light control applications.

3D machine vision

Produce non-contact, highly accurate 3D data in real-time using programmable structured light patterns. Generate a 3D point cloud by projecting a series of patterns onto an object and capturing the light distortion with a camera or sensor.

The point cloud can be used directly for analysis of the object’s surface area, volume, or feature sizes. It can be exported to a variety of CAD modeling formats.

3D machine vision applications

  • Automated optical inspection
  • 3D metrology
  • Intra-oral scanners (IOS)
  • 3D scanner accessories
  • Factory automation
  • Medical imaging
  • Consumer 3D scanners
  • Biometrics
  • Dental scanners
  • Reverse engineering
3D machine vision

Benefits of 3D machine vision

Optical MEMS device (up to 4M pixels)

Enables non-invasive, non-contact 3D scans reliable over time and temperature.

External triggers

Synchronize to external cameras and sensors.

Extended wavelength support (up to 2500 nm)

Supports wide range of light sources for best scans of varying materials and colored objects.

Programmable, high speed pattern generation  (up to 32 kHz)

Real-time scan data, optimized for multiple objects and environments using adaptive pattern sets.

High bit depth

Up to 16-bit enables high accuracy and resolution.

Small form factor

Portable, lower cost solutions when combined with TI's embedded processors.

3D printing

3D printing allows manufacturers to speed up design cycles, make quicker prototype adjustments, and print production parts.

3D Computer Aided Design (CAD) model of the object is converted into cross-sectional slices that are sent to the 3D printer. DLP technology is used to project image slices continuously or layer by layer to build the object. For DLP stereolithography (SLA) printers, liquid resins are hardened by light exposure. For DLP 3D printer selective laser sintering (SLS) systems, fine powders are fused together by laser thermal energy.  

3D printing applications

  • Rapid prototyping
  • Direct manufacturing
  • Tooling and casting
  • Dental printers
  • Custom fit products
  • 3D printer accessories
3D printing

Benefits of 3D printing

2D light pattern generation

Exposes entire print layer on a single shot for fast build times independent of layer complexity.

High resolution micromirror array

Enables sub 1μm resolution.

Extended wavelength support (355 - 2500 nm)

Compatible with a wide range of polymers, resins, sintering powders and other build materials.

Reliable MEMS technology

No expensive parts to replace.

Digital lithography

Digital lithography is used for PCB manufacturing, flat panel display repair, laser marking, and other light exposure systems. In digital lithography, DLP technology provides high speed and high resolution light patterns to expose photoresist films and other photosensitive materials without using contact masks. This reduces material cost, improves production rates, and allows for rapid pattern changes, especially ideal for use cases where fine feature sizes require double patterning.

 

Digital lithography applications

  • Printed circuit boards
  • Flant panels
  • Industrial printers
  • Computer-to-plate printing
  • Flexographic printers
  • Dynamic laser marking and coding
  • Ablation and repair
digital lithography

Benefits of digital lithography

High speed digital pattern generation (up to 32 kHz)

Improve manufacturing throughput and eliminate physical masks or print plates.

Multiple micromirror sizes available (5.4, 7.6, 10.8,13.6 µm)

Achieve micron-level feature sizes.

Extended wavelength support (355 - 2500 nm)

Cure a variety of photosensitive materials or interact with thermally sensitive films.

Spectroscopy

All molecules have unique responses to different wavelengths of light. Spectroscopy is an analysis technique that uses these unique responses to identify and characterize materials.

In a spectrometer design, the TI DLP Digital Micromirror Device (DMD) can be used as a programmable wavelength selector. Broadband light goes through an optical slit. Then the individual wavelengths of light are dispersed onto the micromirror array using a diffraction grating or prism, allowing subsets of the micromirror array to be mapped to specific wavelengths. Specific wavelengths of light can then be switched to a single-element detector. This powerful design architecture eliminates the need for linear array detectors or motors to generate a spectral scan over a wavelength range, enabling chemical analysis with higher performance and smaller form factors at lower costs.

 

Spectroscopy applications

  • Agriculture
  • Oil and gas analysis
  • Food and drug inspection
  • Water and air quality
  • Chemical and material identification
digital lithography

Benefits of spectroscopy

High resolution, programmable optical MEMS array

Use a large single element detector to capture more light than with linear array detects without sacrificing wavelength resolution.

Extended wavelength support (up to 2500 nm)

Enables a single spectral engine customizable for a variety of solids and liquids and multiple light sources.

High speed switching

Generate fast spectral scans for real-time material analysis with adjustable scan parameters.

Reliable MEMS technology

Stable over temperature and lifetime and enables compact, robust designs.