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Advanced light-control chipsets – Applications

TI DLP® chipsets have enabled powerful, flexible, and programmable light control solutions. The DLP advanced light control product portfolio extends this industry-leading MEMS display technology into ultra-violet and infrared wavelengths, while also enabling faster pattern rates and more advanced pixel control. Through complete reference designs and easy-to-use development tools, TI is accelerating innovative new product development into industrial light control applications.

3D machine vision

Produce non-contact, highly accurate 3D data in real-time using programmable structured light patterns. Generate a 3D point cloud by projecting a series of patterns onto an object and capturing the light distortion with a camera or sensor.

The point cloud can be used directly for analysis of the object’s surface area, volume, or feature sizes. It can be exported to a variety of CAD modeling formats.

3D machine vision applications

  • Automated optical inspection
  • 3D metrology
  • Intra-oral scanners (IOS)
  • 3D scanner accessories
  • Factory automation
  • Medical imaging
  • Consumer 3D scanners
  • Biometrics
  • Dental scanners
  • Reverse engineering
3D machine vision

Benefits of 3D machine vision

Optical MEMS device (up to 4M pixels)

Enables non-invasive, non-contact 3D scans reliable over time and temperature.

External triggers

Synchronize to external cameras and sensors.

Extended wavelength support (up to 2500 nm)

Supports wide range of light sources for best scans of varying materials and colored objects.

Programmable, high speed pattern generation  (up to 32 kHz)

Real-time scan data, optimized for multiple objects and environments using adaptive pattern sets.

High bit depth

Up to 16-bit enables high accuracy and resolution.

Small form factor

Portable, lower cost solutions when combined with TI's embedded processors.

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3D machine vision products and development kits

Portability
High speed
Digital micromirror device (DMD) DLP2010LC DLP3010LC DLP4500 DLP4710LC DLP5500 DLP6500 DLP500YX DLP670S
Resolution 854 x 480 1280 x 720 912 x 1140 1920 x 1080 1024 x 768 1920 x 1080 2048 x 1200 2716 x 1600
Number of pixels (MP) 0.41 0.92 1.04 2.07 0.79 2.07 2.46 4.35
Number of prestored patterns 1-bit 64 51-64 48 60-64 960 400 800 400
8-bit 8 6-8 6 7-8 120 50 100 50
16-bit
no
no
no
no
no
no
50
no
Max pattern rate (prestored patterns) (Hz) 1-bit 2487 2487 4225 2500 5000 9500 16100 9523
8-bit 272 272 120 437 500 1031 2016 1190
16-bit
no
no
no
no
no
no
1008
no
Controller DLPC3470 DLPC3478 DLPC350 DLPC3479
(qty 2)
DLPC200 DLPC900 DLPC900
(qty 2)
DLPC900
(qty 2)
Evaluation module DLP2010EVM-LC DLP3010EVM-LC DLPLCR4500EVM DLP4710EVM-LC
no
DLPLCR65EVM DLPLCR50XEVM DLPLCR67EVM

3D printing

3D printing allows manufacturers to speed up design cycles, make quicker prototype adjustments, and print production parts.

3D Computer Aided Design (CAD) model of the object is converted into cross-sectional slices that are sent to the 3D printer. DLP technology is used to project image slices continuously or layer by layer to build the object. For DLP stereolithography (SLA) printers, liquid resins are hardened by light exposure. For DLP 3D printer selective laser sintering (SLS) systems, fine powders are fused together by laser thermal energy.  

3D printing applications

  • Rapid prototyping
  • Direct manufacturing
  • Tooling and casting
  • Dental printers
  • Custom fit products
  • 3D printer accessories
3D printing

Benefits of 3D printing

2D light pattern generation

Exposes entire print layer on a single shot for fast build times independent of layer complexity.

High resolution micromirror array

Enables sub 1μm resolution.

Extended wavelength support (355 - 2500 nm)

Compatible with a wide range of polymers, resins, sintering powders and other build materials.

Reliable MEMS technology

No expensive parts to replace.

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3D printing products and development kits

Portability
High resolution
High speed
Digital Micromirror Device (DMD) DLP2010 DLP3010 DLP4710 DLP4500 DLP6500FYE / DLP6500FLQ DLP9000 DLP7000
DLP7000UV
DLP9500
DLP9500UV
DLP9000X DLP650LNIR 
Resolution 854 x 480 854 x 480 1920 x 1080 912 x 1140 1920 x 1080 2560 x 1600 1024 x 768 1920 x 1080 2560 x 1600 1280 x 800 
Controller DLPC3470 DLPC3478 DLPC3479 DLPC350 DLPC900 DLPC900
(qty 2)
DLPC410 DLPC410 DLPC910 DLPC410
Max Pattern Rate 2.5 kHz 2.5 kHz 2.5 kHz 4.2 kHz 9.5 kHz 9.5 kHz 32.5 kHz 23.1 kHz 15.0 kHz 12.5 kHz 
Max Pixel Data Rate 1.0 Gbps 2.3 Gbps 5.2 Gbps 4.4 Gbps 19.7 Gbps 39 Gbps 25.2 Gbps 48.0 Gbps 61.1 Gbps 12 Gbps 
Optimized Wavelength 420-700 nm 420-700 nm 420-700 nm 420-700 nm

DLP6500FYE: 420 - 700 nm,

DLP6500FLQ: 400 - 700 nm

400 - 700 nm

DLP7000: 420 - 700 nm,

DLP7000UV: 363 - 420 nm

DLP9500: 400 - 700 nm,

DLP9500UV: 363 - 420 nm

400 - 700 nm 800 - 2000 nm 
Evaluation Module DLP2010EVM-LC DLP3010EVM-LC
no
DLP LightCrafter™ 4500 DLP6500FYE: DLP LightCrafter 6500 DLP LightCrafter 9000

DLPLCR70EVM

DLPLCR70UVEVM

DLPLCRC410EVM 

DLPLCR95EVM

DLPLCR95UVEMV

DLPLCRC4100EVM 

no

DLPLCR65NEVM

DLPLCRC4100EVM

Digital lithography

Digital lithography is used for PCB manufacturing, flat panel display repair, laser marking, and other light exposure systems. In digital lithography, DLP technology provides high speed and high resolution light patterns to expose photoresist films and other photosensitive materials without using contact masks. This reduces material cost, improves production rates, and allows for rapid pattern changes, especially ideal for use cases where fine feature sizes require double patterning.

 

Digital lithography applications

  • Printed circuit boards
  • Flant panels
  • Industrial printers
  • Computer-to-plate printing
  • Flexographic printers
  • Dynamic laser marking and coding
  • Ablation and repair
digital lithography

Benefits of digital lithography

High speed digital pattern generation (up to 32 kHz)

Improve manufacturing throughput and eliminate physical masks or print plates.

Multiple micromirror sizes available (5.4, 7.6, 10.8,13.6 µm)

Achieve micron-level feature sizes.

Extended wavelength support (355 - 2500 nm)

Cure a variety of photosensitive materials or interact with thermally sensitive films.

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Digital lithography products and development kits

High resolution
High speed
Digital micromirror device (DMD) DLP6500FLQ DLP9000 DLP7000
DLP7000UV
DLP9500
DLP9500UV
DLP9000X
DLP9000XUV
Resolution 1920 x 1080 2560 x 1600 1024 x 768 1920 x 1080 2560 x 1600
Controller DLPC910 DLPC900
(qty 2)
DLPC410 DLPC410 DLPC910
Max pattern rate 11.6 kHz 9.5 kHz 32.5 kHz 23.1 kHz 15.0 kHz
Max pixel data rate 24 Gbps 39 Gbps 25.2 Gbps 48.0 Gbps 61.1 Gbps
Optimized wavelength 400 - 700 nm 400 - 700 nm DLP7000: 420 - 700 nm
DLP7000UV: 363 - 420 nm
DLP9500: 400 - 700 nm
DLP9500UV: 363 - 420 nm
DLP9000X: 400 - 700 nm
DLP9000XUV: 355 - 420 nm
Evaluation module DLPLCR65FLQEVM DLPLCR90EVM DLPLCR70EVM
DLPLCR70UVEVM
DLPLCR95EVM
DLPLCR95UVEVM
DLPLCR90XEVM
DLPLCR90XUVEVM

Digital lithography reference designs

End Equipment Featured TI Design Key Product
  High speed, high resolution lithography subsystem DLP9000X

Spectroscopy

All molecules have unique responses to different wavelengths of light. Spectroscopy is an analysis technique that uses these unique responses to identify and characterize materials.

In a spectrometer design, the TI DLP Digital Micromirror Device (DMD) can be used as a programmable wavelength selector. Broadband light goes through an optical slit. Then the individual wavelengths of light are dispersed onto the micromirror array using a diffraction grating or prism, allowing subsets of the micromirror array to be mapped to specific wavelengths. Specific wavelengths of light can then be switched to a single-element detector. This powerful design architecture eliminates the need for linear array detectors or motors to generate a spectral scan over a wavelength range, enabling chemical analysis with higher performance and smaller form factors at lower costs.

 

Spectroscopy applications

  • Agriculture
  • Oil and gas analysis
  • Food and drug inspection
  • Water and air quality
  • Chemical and material identification
digital lithography

Benefits of spectroscopy

High resolution, programmable optical MEMS array

Use a large single element detector to capture more light than with linear array detects without sacrificing wavelength resolution.

Extended wavelength support (up to 2500 nm)

Enables a single spectral engine customizable for a variety of solids and liquids and multiple light sources.

High speed switching

Generate fast spectral scans for real-time material analysis with adjustable scan parameters.

Reliable MEMS technology

Stable over temperature and lifetime and enables compact, robust designs.

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Spectroscopy products and development kits

Small form factor
High resolution
Digital Micromirror Device (DMD) DLP2010NIR DLP4500NIR DLP650LNIR
Resolution 854 x 480 912 x 1140 1280 x 800
Digital controller DLPC150 DLPC350 DLPC410
Max pattern rate 2,880 Hz 4,225 Hz 12.5 kHz
Optimized wavelength 700 - 2500 nm 700 - 2500 nm 800 - 2000 nm
Evaluation module (EVM) DLP NIRscan Nano DLP NIRscan

DLPLCR65NEVM

DLPLCRC4100EVM

EVM features

900 - 1700 nm wavelength range

10 nm spectral resolution

Up to 6000:1 signal-to-noise ratio with included reflective head

Bluetooth® and Bluetooth low energy for wireless connectivity with battery charging option

1350 - 2450 nm wavelength range

12 nm spectral resolution

More than 30,000:1 signal to noise ratio with included transmissive head