Ultraviolet TI DLP® Chipsets
Optimized for wavelengths of 355 to 420 nm for digital exposure applications
Ultraviolet (UV) products are ideal for digital exposure applications such as maskless lithography (LDI) for PCB, FPD, substrate panels and 3D printing or additive manufacturing using photosensitive films and resins. These solutions provide precise pixel control combined with flexible data loading and fast pattern rates required for high volume manufacturing.
- Pixel data rates up to 61.1 Gbps
- Pattern rates up to 32.5 kHz
- Flexible data loading and sequencing
- Transmission down to 355 nm
- Low thermal resistance for high power applications
- Hermetic packages
DLP technology enables constant build speeds, resolution and layer thickness control allowing for smooth finished parts with fine feature sizes.
In digital lithography, DLP technology provides high speed and high resolution light patterns to expose photoresist films and other photosensitive materials without using contact masks.
This high performance, highly flexible development kit is perfect for a wide variety of light steering applications, such as 3D printing and laser direct imaging (LDI).