Ultraviolet TI DLP® Chipsets
Optimized for wavelengths of 363 to 420 nm for digital exposure applications
Ultraviolet (UV) products are ideal for digital exposure applications such as maskless lithography for PCB, LED, OLED panels and additive manufacturing using photosensitive films and resins. These solutions provide precise pixel control combined with flexible data loading and fast pattern rates required for high volume manufacturing.
High throughput
- Pixel data rates up to 48 Gbps
- Pattern rates up to 32.5 kHz
- Flexible data loading and sequencing
Optical efficiency
- 98% transmission down to 363 nm
- Low thermal resistance for high power applications
- Hermetic packages
Fine feature sizes
- Supports sub-1 um features
- Resolution up to 2 million pixels
- Applications for 3D printing, maskless lithography
Technical resources
Use our selection guide to learn about the entire DLP portfolio and choose the right chipset for your design.
In digital lithography, DLP technology provides high speed and high resolution light patterns to expose photoresist films and other photosensitive materials without using contact masks.
This high performance, highly flexible development kit is perfect for a wide variety of light steering applications, such as 3D printing and direct digital imaging.
Key software documents
