SBASAL3B September   2024  – June 2025 ADC3668 , ADC3669

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - AC Specifications (ADC3668 - 250 MSPS)
    8. 6.8  Electrical Characteristics - AC Specifications (ADC3669 - 500 MSPS)
    9. 6.9  Timing Requirements
    10. 6.10 Typical Characteristics, ADC3668
    11. 6.11 Typical Characteristics, ADC3669
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Inputs
        1. 8.3.1.1 Nyquist Zone Selection
        2. 8.3.1.2 Analog Front End Design
      2. 8.3.2 Sampling Clock Input
      3. 8.3.3 Multi-Chip Synchronization
        1. 8.3.3.1 SYSREF Monitor
      4. 8.3.4 Time-Stamp
      5. 8.3.5 Overrange
      6. 8.3.6 External Voltage Reference
      7. 8.3.7 Digital Gain
      8. 8.3.8 Decimation Filter
        1. 8.3.8.1 Uncommon Decimation Ratios
        2. 8.3.8.2 Decimation Filter Response
        3. 8.3.8.3 Decimation Filter Configuration
        4. 8.3.8.4 Numerically Controlled Oscillator (NCO)
      9. 8.3.9 Digital Interface
        1. 8.3.9.1 Parallel LVDS (DDR)
        2. 8.3.9.2 Serial LVDS (SLVDS) with Decimation
          1. 8.3.9.2.1 SLVDS - Status Bit Insertion
        3. 8.3.9.3 Output Data Format
        4. 8.3.9.4 32-bit Output Resolution
        5. 8.3.9.5 Output Scrambler
        6. 8.3.9.6 Output MUX
        7. 8.3.9.7 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low Latency Mode
      2. 8.4.2 Digital Channel Averaging
      3. 8.4.3 Power Down Mode
    5. 8.5 Programming
      1. 8.5.1 GPIO Programming
      2. 8.5.2 Register Write
      3. 8.5.3 Register Read
      4. 8.5.4 Device Programming
      5. 8.5.5 Register Map
      6. 8.5.6 Detailed Register Description
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Wideband Spectrum Analyzer
      2. 9.2.2 Design Requirements
        1. 9.2.2.1 Input Signal Path
        2. 9.2.2.2 Clocking
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Sampling Clock
      4. 9.2.4 Application Performance Plots
      5. 9.2.5 Initialization Set Up
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision A (January 2025) to Revision B (June 2025)

  • Updated pins SCLK and SDIO from pull-up to DGND to pull-up to DVDD18 in the Pin Functions Go
  • Changed min sampling rate from 125MSPS to 100MSPS in the CLOCK INPUT (CLKP/M) sectionGo
  • Updated internal equivalent input circuitry with more detailed model in Figure 8-2 Go
  • Added GPIO pin assignment in step 4 of the power up sequence and added power down sequenceGo

Changes from Revision * (September 2024) to Revision A (January 2025)

  • Changed the ADC3668 from Product Preview to Production Go
  • Changed pins SCLK and SDIO from pull-down to pull-up in the Pin Functions Go
  • Updated max current limits for ADC3668/69Go
  • Added 0.5Vpp  to MIN VID in the DC SpecificationsGo
  • Added min HD2 value in the AC Specification (ADC36698 - 250 MSPS)Go
  • Added min HD3 value in the AC Specification (ADC3668 - 250 MSPS)Go
  • Changed the ENOB values in the AC Specifications (ADC3669 - 500 MSPS)Go
  • Added min HD2 value in the AC Specification (ADC3669 - 500 MSPS)Go
  • Added min HD3 value in the AC Specification (ADC3669 - 500 MSPS)Go
  • Added input voltage range description to analog inputsGo
  • Changed the Parallel LVDS (DDR) sectionGo
  • Added the SLVDS - Status Bit Insertion topicGo
  • Added the Output Scrambler topicGo
  • Changed the LVDS inversion lane mapping in Table 8-30 Go