SBAS925A August   2018  – November 2018 ADS1119

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Voltage, Current, and Temperature Monitoring Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 I2C Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Rail-to-Rail Input Buffers and Programmable Gain Stage
      3. 8.3.3 Voltage Reference
      4. 8.3.4 Modulator and Internal Oscillator
      5. 8.3.5 Digital Filter
      6. 8.3.6 Conversion Times
      7. 8.3.7 Offset Calibration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 RESET Pin
        3. 8.4.1.3 Reset by Command
      2. 8.4.2 Conversion Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous Conversion Mode
      3. 8.4.3 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Address
        2. 8.5.1.2 Serial Clock (SCL) and Serial Data (SDA)
        3. 8.5.1.3 Data Ready (DRDY)
        4. 8.5.1.4 Interface Speed
        5. 8.5.1.5 Data Transfer Protocol
        6. 8.5.1.6 I2C General Call (Software Reset)
        7. 8.5.1.7 Timeout
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 Command Latching
        2. 8.5.3.2 RESET (0000 011x)
        3. 8.5.3.3 START/SYNC (0000 100x)
        4. 8.5.3.4 POWERDOWN (0000 001x)
        5. 8.5.3.5 RDATA (0001 xxxx)
        6. 8.5.3.6 RREG (0010 0rxx)
        7. 8.5.3.7 WREG (0100 00xx dddd dddd)
      4. 8.5.4 Reading Data and Monitoring for New Conversion Results
    6. 8.6 Register Map
      1. 8.6.1 Configuration and Status Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Configuration Register (address = 0h) [reset = 00h]
          1. Table 10. Configuration Register Field Descriptions
        2. 8.6.2.2 Status Register (address = 1h) [reset = 00h]
          1. Table 11. Status Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Interface Connections
      2. 9.1.2 Connecting Multiple Devices on the Same I2C Bus
      3. 9.1.3 Unused Inputs and Outputs
      4. 9.1.4 Analog Input Filtering
      5. 9.1.5 External Reference and Ratiometric Measurements
      6. 9.1.6 Establishing Proper Limits on the Absolute Input Voltage
      7. 9.1.7 Pseudo Code Example
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Voltage Monitoring
        2. 9.2.2.2 High-Side Current Measurement
        3. 9.2.2.3 Thermistor Measurement
        4. 9.2.2.4 Register Settings
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.6 Conversion Times

Table 4 shows the actual conversion times for each data rate setting. The values provided are in terms of tCLK cycles and in milliseconds.

Continuous conversion mode data rates are timed from one DRDY falling edge to the next DRDY falling edge. The first conversion starts 28.5 · tCLK after the START/SYNC command is latched.

Single-shot conversion mode data rates are timed from when the START/SYNC command is latched to the DRDY falling edge and rounded to the next tCLK.

Commands are latched on the eighth falling edge of SCL in the command byte.

Table 4. Conversion Times

NOMINAL DATA RATE
(SPS)		 –3-dB BANDWIDTH
(Hz)		 CONTINUOUS CONVERSION MODE(2) SINGLE-SHOT CONVERSION MODE
ACTUAL CONVERSION TIME (tCLK)(1) ACTUAL CONVERSION TIME (ms) ACTUAL CONVERSION TIME (tCLK)(1) ACTUAL CONVERSION TIME (ms)
20 13.1 51192 49.99 51213 50.01
90 39.6 11532 11.26 11557 11.29
330 150.1 3116 3.04 3141 3.07
1000 483.8 1036 1.01 1061 1.04
(1) tCLK = 1 / fCLK. fCLK = 1.024 MHz.
(2) The first conversion starts 28.5 · tCLK after the START/SYNC command is latched. The times listed in this table do not include that time.

Although the conversion time at the 20-SPS setting is not exactly 1 / 20 Hz = 50 ms, this discrepancy does not affect the 50-Hz or 60-Hz rejection. The conversion time and filter notches vary by the amount specified in the Electrical Characteristics table for oscillator accuracy.