SBAS752B May   2017  – October 2018 ADS122U04

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      K-Type Thermocouple Measurement
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 UART Timing Requirements
    7. 6.7 UART Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Multiplexer
      2. 8.3.2  Low-Noise Programmable Gain Stage
        1. 8.3.2.1 PGA Input Voltage Requirements
        2. 8.3.2.2 Bypassing the PGA
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Modulator and Internal Oscillator
      5. 8.3.5  Digital Filter
      6. 8.3.6  Conversion Times
      7. 8.3.7  Excitation Current Sources
      8. 8.3.8  Sensor Detection
      9. 8.3.9  System Monitor
      10. 8.3.10 Temperature Sensor
        1. 8.3.10.1 Converting From Temperature to Digital Codes
          1. 8.3.10.1.1 For Positive Temperatures (For Example, 50°C):
          2. 8.3.10.1.2 For Negative Temperatures (For Example, –25°C):
        2. 8.3.10.2 Converting From Digital Codes to Temperature
      11. 8.3.11 Offset Calibration
      12. 8.3.12 Conversion Data Counter
      13. 8.3.13 Data Integrity
      14. 8.3.14 General-Purpose Digital Inputs/Outputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 RESET Pin
        3. 8.4.1.3 Reset by Command
      2. 8.4.2 Conversion Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous Conversion Mode
      3. 8.4.3 Operating Modes
        1. 8.4.3.1 Normal Mode
        2. 8.4.3.2 Turbo Mode
        3. 8.4.3.3 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 UART Interface
        1. 8.5.1.1 Receive (RX)
        2. 8.5.1.2 Transmit (TX)
        3. 8.5.1.3 Data Ready (DRDY)
        4. 8.5.1.4 Protocol
        5. 8.5.1.5 Timeout
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 RESET (0000 011x)
        2. 8.5.3.2 START/SYNC (0000 100x)
        3. 8.5.3.3 POWERDOWN (0000 001x)
        4. 8.5.3.4 RDATA (0001 xxxx)
        5. 8.5.3.5 RREG (0010 rrrx)
        6. 8.5.3.6 WREG (0100 rrrx dddd dddd)
        7. 8.5.3.7 Command Latching
      4. 8.5.4 Reading Data
        1. 8.5.4.1 Manual Data Read Mode
        2. 8.5.4.2 Automatic Data Read Mode
      5. 8.5.5 Data Integrity
    6. 8.6 Register Map
      1. 8.6.1 Configuration Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Configuration Register 0 (address = 00h) [reset = 00h]
          1. Table 18. Configuration Register 0 Field Descriptions
        2. 8.6.2.2 Configuration Register 1 (address = 01h) [reset = 00h]
          1. Table 19. Configuration Register 1 Field Descriptions
        3. 8.6.2.3 Configuration Register 2 (address = 02h) [reset = 00h]
          1. Table 21. Configuration Register 2 Field Descriptions
        4. 8.6.2.4 Configuration Register 3 (address = 03h) [reset = 00h]
          1. Table 22. Configuration Register 3 Field Descriptions
        5. 8.6.2.5 Configuration Register 4 (address = 04h) [reset = 00h]
          1. Table 23. Configuration Register 4 Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Interface Connections
      2. 9.1.2 Analog Input Filtering
      3. 9.1.3 External Reference and Ratiometric Measurements
      4. 9.1.4 Establishing Proper Limits on the Absolute Input Voltage
      5. 9.1.5 Unused Inputs and Outputs
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Applications
      1. 9.2.1 K-Type Thermocouple Measurement (–200°C to +1250°C)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 3-Wire RTD Measurement (–200°C to +850°C)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Resistive Bridge Measurement
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (August 2017) to B Revision

  • Changed Internal Voltage Reference, Accuracy parameter: added TSSOP package to test conditions of first row and added second row for the WQFN packageGo
  • Added TSSOP package to conditions of Internal Reference Voltage Histogram figureGo
  • Changed Digital Supply Current vs Temperature figureGo
  • Changed Voltage Reference section locationGo
  • Changed –3-dB bandwidth value in turbo mode 40 SPS parameter from 26.2 Hz to 17.1 HzGo
  • Changed Offset Calibration section locationGo
  • Changed FFh to FFFFh in Data Integrity sectionGo
  • Changed description of power-on reset procedure in Power-On Reset sectionGo
  • Added note to Data Format sectionGo
  • Changed first paragraph of Data Integrity sectionGo
  • Added Register Data Output with CRC Enabled figureGo
  • Changed Conversion Data Output with CRC Enabled and Conversion Data Output with Inverted Data Output Enabled figure captionsGo
  • Deleted conversion result from bit CRC[1:0] descriptionGo
  • Changed 50 µs to 600 µs and changed (MUX[3:1] = 1110) to (MUX[3:0] = 1110) in Pseudo Code Example sectionGo
  • Deleted Power-Supply Ramp Rate sectionGo
  • Changed 50 µs to 600 µs in Power-Supply Sequencing sectionGo

Changes from * Revision (May 2017) to A Revision

  • Released to production Go