SBAS350G June   2005  – January 2021 ADS1232 , ADS1234

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Noise Performance
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs (AINPX, AINNX)
      2. 8.3.2  Temperature Sensor (ADS1232 Only)
      3. 8.3.3  Low-Noise PGA
        1. 8.3.3.1 PGA Bypass Capacitor
      4. 8.3.4  Voltage Reference Inputs (REFP, REFN)
      5. 8.3.5  Clock Sources
      6. 8.3.6  Digital Filter Frequency Response
      7. 8.3.7  Settling Time
      8. 8.3.8  Data Rate
      9. 8.3.9  Data Format
      10. 8.3.10 Data Ready and Data Output (DRDY/DOUT)
      11. 8.3.11 Serial Clock Input (SCLK)
      12. 8.3.12 Data Retrieval
    4. 8.4 Device Functional Modes
      1. 8.4.1 Offset Calibration Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Standby Mode With Offset-Calibration
      4. 8.4.4 Power-Down Mode
      5. 8.4.5 Power-Up Sequence
      6. 8.4.6 Summary of Serial Interface Waveforms
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

For best performance, dedicate a PCB layer to a ground plane and do not route any other signal traces on this layer. However, depending on space limitations, a dedicated ground plane may not be practical. If a continuous ground plane is not possible, connect the individual plane segments in one place at the ADC.

Route digital traces away from the PGA output pins (CAP) and away from all analog inputs and associated components in order to minimize interference. Maintain differential trace routing for the input signal and reference signal to minimize RFI susceptibility.

Use C0G capacitors for analog and reference input filters and the PGA output capacitor in high-linearity applications. High-K type capacitors (such as Y5V and X7R) should be avoided. Place supply bypass and the PGA bypass capacitors as close as possible to the device pins using short, direct traces. For optimum performance, use low-impedance connections (such as multiple vias) on the ground-side connections of the bypass capacitors.

Avoid long traces on DRDY/DOUT, because high trace capacitance can lead to increased ADC noise. Use a series resistor or a local buffer if long traces are used. When applying an external clock, be sure the clock is free of overshoot and glitches. A source-termination resistor placed at the clock buffer helps control reflections and overshoot. Glitches present on the clock signal can lead to increased noise and possible mis-operation and must be avoided.

Figure 11-1 illustrates a PCB layout example. Separate 5-V analog and a 3.3-V digital supplies are shown. The ADC configuration is through hard-tie of the control pins as shown in Table 11-1.

Table 11-1 Layout Example Pin Connections
MODE PIN CONTROL VOLTAGE
Data rate = 10 SPS SPEED 0 V
Gain = 128 GAIN[1:0] 3.3 V
Input = channel 1 A0, TEMP 0 V