SBAS949A February   2020  – February 2021 ADS131M06

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Measurements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input ESD Protection Circuitry
      2. 8.3.2  Input Multiplexer
      3. 8.3.3  Programmable Gain Amplifier (PGA)
      4. 8.3.4  Voltage Reference
      5. 8.3.5  Clocking and Power Modes
      6. 8.3.6  ΔΣ Modulator
      7. 8.3.7  Digital Filter
        1. 8.3.7.1 Digital Filter Implementation
          1. 8.3.7.1.1 Fast-Settling Filter
          2. 8.3.7.1.2 SINC3 and SINC3 + SINC1 Filter
        2. 8.3.7.2 Digital Filter Characteristic
      8. 8.3.8  DC Block Filter
      9. 8.3.9  Internal Test Signals
      10. 8.3.10 Channel Phase Calibration
      11. 8.3.11 Calibration Registers
      12. 8.3.12 Communication Cyclic Redundancy Check (CRC)
      13. 8.3.13 Register Map CRC
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 SYNC/RESET Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Fast Startup Behavior
      3. 8.4.3 Conversion Modes
        1. 8.4.3.1 Continuous-Conversion Mode
        2. 8.4.3.2 Global-Chop Mode
      4. 8.4.4 Power Modes
      5. 8.4.5 Standby Mode
      6. 8.4.6 Current-Detect Mode
    5. 8.5 Programming
      1. 8.5.1 Interface
        1. 8.5.1.1  Chip Select (CS)
        2. 8.5.1.2  Serial Data Clock (SCLK)
        3. 8.5.1.3  Serial Data Input (DIN)
        4. 8.5.1.4  Serial Data Output (DOUT)
        5. 8.5.1.5  Data Ready (DRDY)
        6. 8.5.1.6  Conversion Synchronization or System Reset (SYNC/RESET)
        7. 8.5.1.7  SPI Communication Frames
        8. 8.5.1.8  SPI Communication Words
        9. 8.5.1.9  ADC Conversion Data
          1. 8.5.1.9.1 Collecting Data for the First Time or After a Pause in Data Collection
        10. 8.5.1.10 Commands
          1. 8.5.1.10.1 NULL (0000 0000 0000 0000)
          2. 8.5.1.10.2 RESET (0000 0000 0001 0001)
          3. 8.5.1.10.3 STANDBY (0000 0000 0010 0010)
          4. 8.5.1.10.4 WAKEUP (0000 0000 0011 0011)
          5. 8.5.1.10.5 LOCK (0000 0101 0101 0101)
          6. 8.5.1.10.6 UNLOCK (0000 0110 0110 0110)
          7. 8.5.1.10.7 RREG (101a aaaa annn nnnn)
            1. 8.5.1.10.7.1 Reading a Single Register
            2. 8.5.1.10.7.2 Reading Multiple Registers
          8. 8.5.1.10.8 WREG (011a aaaa annn nnnn)
        11. 8.5.1.11 Short SPI Frames
      2. 8.5.2 Synchronization
    6. 8.6 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unused Inputs and Outputs
      2. 9.1.2 Antialiasing
      3. 9.1.3 Minimum Interface Connections
      4. 9.1.4 Power Metrology Applications
      5. 9.1.5 Multiple Device Configuration
      6. 9.1.6 Code Example
      7. 9.1.7 Troubleshooting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Voltage Measurement Front-End
        2. 9.2.2.2 Current Measurement Front-End
        3. 9.2.2.3 ADC Setup
        4. 9.2.2.4 Calibration
        5. 9.2.2.5 Formulae
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 CAP Pin Behavior
    2. 10.2 Power-Supply Sequencing
    3. 10.3 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision * (February 2020) to Revision A (February 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Changed WQFN package from preview to active Go
  • Added gain of 128 to High impedance inputs bulletGo
  • Changed value of Low power consumption bullet from 5.0 mW to 4.9 mW Go
  • Added Protection relays and Power quality meters to Applications sectionGo
  • Changed WQFN package from preview to active on front pageGo
  • Removed capacitor recommendation for REFIN pin in Pin Functions table Go
  • Corrected analog input pin numbering in Pin Functions table Go
  • Added thermal pad to pinout diagram Go
  • Added Differential input voltage range using external reference Go
  • Added long-term reference and gain error drift in WQFN package in Electrical Characteristics tableGo
  • Added typical value for long term reference and gain error drift in WQFN packageGo
  • Changed tsu(SY) parameter description in Timing Requirements table Go
  • Changed SPI Timing Diagram and SYNC/RESET Timing Requirements figuresGo
  • Added typical characteristics plotsGo
  • Removed recommendation for decoupling capacitor when using internal referenceGo
  • Changed Clocking and Power Modes section, added internal oscillator optionGo
  • Changed description of modulator frequency and added fMOD equation in ΔΣ Modulator sectionGo
  • Changed Digital Filter sectionGo
  • Changed Digital Filter Implementation title and section Go
  • Updated description of the test signal derived from the internal reference Go
  • Changed communication cyclic redundancy check (CRC) seed valueGo
  • Added DRDY transitions in Power-Up and Reset sectionGo
  • Moved Fast Startup Behavior section to Device Functional Modes section, and changed values for wait time delays in text and figuresGo
  • Added global-chop mode block diagram, global-chop mode conversion timing diagram, and unique_55_Connect_42_GUID-9098CEB9-A583-4DDA-8593-B1AE8D1F320BEquation 9 Go
  • Changed Standby Mode section Go
  • Deleted comments about MOSI, MISO, slave, and masterGo
  • Added description for new conversions when reading data in the Data Ready (DRDY) sectionGo
  • Added second paragraph to SPI Communication Frames section Go
  • Changed Register Map tableGo
  • Changed description sentence for each register sectionGo
  • Added pullup resistor option for DRDY in the Unused Inputs and Outputs sectionGo
  • Changed root cause description in Troubleshooting section Go
  • Changed discussion of burden resistor in Current Measurement Front-End section Go
  • Added ADC energy metrology library software to Related Documents Go