1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Input and Multiplexer
      2. 7.3.2  Reference
        1. 7.3.2.1 External Reference
        2. 7.3.2.2 Internal Reference
      3. 7.3.3  ADC Transfer Function
      4. 7.3.4  ADC Offset Calibration
      5. 7.3.5  Programmable Averaging Filters
      6. 7.3.6  CRC on Data Interface
      7. 7.3.7  Oscillator and Timing Control
      8. 7.3.8  Diagnostic Modes
        1. 7.3.8.1 Bit-Walk Test Mode
        2. 7.3.8.2 Fixed Voltage Test Mode
      9. 7.3.9  Output Data Format
        1. 7.3.9.1 Status Flags
        2. 7.3.9.2 Output CRC (Device to Host)
        3. 7.3.9.3 Input CRC (Host to Device)
      10. 7.3.10 Device Programming
        1. 7.3.10.1 Enhanced-SPI Interface
        2. 7.3.10.2 Daisy-Chain Mode
        3. 7.3.10.3 Register Read/Write Operation
          1. 7.3.10.3.1 Register Write
          2. 7.3.10.3.2 Register Read
            1. 7.3.10.3.2.1 Register Read With CRC
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Power-Up and Reset
      2. 7.4.2 Manual Mode
      3. 7.4.3 On-the-Fly Mode
      4. 7.4.4 Auto-Sequence Mode
    5. 7.5 ADS7066 Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Charge-Kickback Filter and ADC Amplifier
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 AVDD and DVDD Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information