SBAS817C November   2017  – November 2019 ADS8166 , ADS8167 , ADS8168

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      ADS816x Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Multiplexer
        1. 7.3.1.1 Multiplexer Configurations
        2. 7.3.1.2 Multiplexer With Minimum Crosstalk
        3. 7.3.1.3 Early Switching for Direct Sensor Interface
      2. 7.3.2 Reference
        1. 7.3.2.1 Internal Reference
        2. 7.3.2.2 External Reference
      3. 7.3.3 Reference Buffer
      4. 7.3.4 REFby2 Buffer
      5. 7.3.5 Converter Module
        1. 7.3.5.1 Internal Oscillator
        2. 7.3.5.2 ADC Transfer Function
      6. 7.3.6 Low-Dropout Regulator (LDO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Channel Selection Using Internal Multiplexer
        1. 7.4.1.1 Manual Mode
        2. 7.4.1.2 On-The-Fly Mode
        3. 7.4.1.3 Auto Sequence Mode
        4. 7.4.1.4 Custom Channel Sequencing Mode
      2. 7.4.2 Digital Window Comparator
    5. 7.5 Programming
      1. 7.5.1 Data Transfer Protocols
        1. 7.5.1.1 Enhanced-SPI Interface
          1. 7.5.1.1.1 Protocols for Configuring the Device
          2. 7.5.1.1.2 Protocols for Reading From the Device
            1. 7.5.1.1.2.1 SPI Protocols With a Single SDO
            2. 7.5.1.1.2.2 SPI Protocols With Dual SDO
            3. 7.5.1.1.2.3 Clock Re-Timer Data Transfer
              1. 7.5.1.1.2.3.1 Output Bus Width Options
      2. 7.5.2 Register Read/Write Operation
    6. 7.6 Register Maps
      1. 7.6.1 Interface and Hardware Configuration Registers
        1. 7.6.1.1 REG_ACCESS Register (address = 00h) [reset = 00h]
          1. Table 11. REG_ACCESS Register Field Descriptions
        2. 7.6.1.2 PD_CNTL Register (address = 04h) [reset = 00h]
          1. Table 12. PD_CNTL Register Field Descriptions
        3. 7.6.1.3 SDI_CNTL Register (address = 008h) [reset = 00h]
          1. Table 13. SDI_CNTL Register Field Descriptions
        4. 7.6.1.4 SDO_CNTL1 Register (address = 0Ch) [reset = 00h]
          1. Table 14. SDO_CNTL1 Register Field Descriptions
        5. 7.6.1.5 SDO_CNTL2 Register (address = 0Dh) [reset = 00h]
          1. Table 15. SDO_CNTL2 Register Field Descriptions
        6. 7.6.1.6 SDO_CNTL3 Register (address = 0Eh) [reset = 00h]
          1. Table 16. SDO_CNTL3 Register Field Descriptions
        7. 7.6.1.7 SDO_CNTL4 Register (address = 0Fh) [reset = 00h]
          1. Table 17. SDO_CNTL4 Register Field Descriptions
        8. 7.6.1.8 DATA_CNTL Register (address = 10h) [reset = 00h]
          1. Table 18. DATA_CNTL Register Field Descriptions
        9. 7.6.1.9 PARITY_CNTL Register (address = 11h) [reset = 00h]
          1. Table 19. PARITY_CNTL Register Field Descriptions
      2. 7.6.2 Device Calibration Registers
        1. 7.6.2.1 OFST_CAL Register (address = 18h) [reset = 00h]
          1. Table 21. OFST_CAL Register Field Descriptions
        2. 7.6.2.2 REF_MRG1 Register (address = 19h) [reset = 00h]
          1. Table 22. REF_MRG1 Register Field Descriptions
        3. 7.6.2.3 REF_MRG2 Register (address = 1Ah) [reset = 00h]
          1. Table 24. REF_MRG2 Register Field Descriptions
        4. 7.6.2.4 REFby2_MRG Register (address = 1Bh) [reset = 00h]
          1. Table 25. REFby2_MRG Register Field Descriptions
      3. 7.6.3 Analog Input Configuration Registers
        1. 7.6.3.1 AIN_CFG Register (address = 24h) [reset = 00h]
          1. Table 28. AIN_CFG Register Field Descriptions
        2. 7.6.3.2 COM_CFG Register (address = 27h) [reset = 00h]
          1. Table 29. COM_CFG Register Field Descriptions
      4. 7.6.4 Channel Sequence Configuration Registers Map
        1. 7.6.4.1 DEVICE_CFG Register (address = 1Ch) [reset = 00h]
          1. Table 31. DEVICE_CFG Register Field Descriptions
        2. 7.6.4.2 CHANNEL_ID Register (address = 1Dh) [reset = 00h]
          1. Table 33. CHANNEL_ID Register Field Descriptions
        3. 7.6.4.3 SEQ_START Register (address = 1Eh) [reset = 00h]
          1. Table 35. SEQ_START Register Field Descriptions
        4. 7.6.4.4 SEQ_ABORT Register (address = 1Fh) [reset = 00h]
          1. Table 36. SEQ_ABORT Register Field Descriptions
        5. 7.6.4.5 ON_THE_FLY_CFG Register (address = 2Ah) [reset = 00h]
          1. Table 37. ON_THE_FLY_CFG Register Field Descriptions
        6. 7.6.4.6 AUTO_SEQ_CFG1 Register (address = 80h) [reset = 00h]
          1. Table 38. AUTO_SEQ_CFG1 Register Field Descriptions
        7. 7.6.4.7 AUTO_SEQ_CFG2 Register (address = 82h) [reset = 00h]
          1. Table 39. AUTO_SEQ_CFG2 Register Field Descriptions
        8. 7.6.4.8 Custom Channel Sequencing Mode Registers
          1. 7.6.4.8.1 CCS_START_INDEX Register (address = 88h) [reset = 00h]
            1. Table 41. CCS_START_INDEX Register Field Descriptions
          2. 7.6.4.8.2 CCS_END_INDEX Register (address = 89h) [reset = 00h]
            1. Table 42. CCS_END_INDEX Register Field Descriptions
          3. 7.6.4.8.3 CCS_SEQ_LOOP Register (address = 8Bh) [reset = 00h]
            1. Table 43. CCS_SEQ_LOOP Register Field Descriptions
          4. 7.6.4.8.4 CCS_CHID_INDEX_m Registers (address = 8C, 8E, 90, 92, 94, 96, 98, 9A, 9C, 9E, A0, A2, A4, A6, A8, and AAh) [reset = 00h]
            1. Table 44. CCS_CHID_INDEX_m Register Field Descriptions
          5. 7.6.4.8.5 REPEAT_INDEX_m Registers (address = 8D, 8F, 91, 93, 95, 97, 99, 9B, 9D, 9F, A1, A3, A5, A7, A9, and ABh) [reset = 00h]
            1. Table 45. REPEAT_INDEX_m Register Field Descriptions
      5. 7.6.5 Digital Window Comparator Configuration Registers Map
        1. 7.6.5.1  ALERT_CFG Register (address = 2Eh) [reset = 00h]
          1. Table 47. ALERT_CFG Register Field Descriptions
        2. 7.6.5.2  HI_TRIG_AINx[15:0] Register (address = 4Dh to 30h) [reset = 0000h]
          1. Table 49. HI_TRIG_AINx[15:0] Registers Field Descriptions
        3. 7.6.5.3  LO_TRIG_AINx[15:0] Register (address = 71h to 54h) [reset = 0000h]
          1. Table 51. LO_TRIG_AINx[15:0] Registers Field Descriptions
        4. 7.6.5.4  HYSTERESIS_AINx[7:0] Register (address = 4Fh to 33h) [reset = 00h]
          1. Table 52. HYSTERESIS_AINx[7:0] Register Field Descriptions
        5. 7.6.5.5  ALERT_LO_STATUS Register (address = 78h) [reset = 00h]
          1. Table 53. ALERT_LO_STATUS Register Field Descriptions
        6. 7.6.5.6  ALERT_HI_STATUS Register (address = 79h) [reset = 00h]
          1. Table 54. ALERT_HI_STATUS Register Field Descriptions
        7. 7.6.5.7  ALERT_STATUS Register (address = 7Ah) [reset = 00h]
          1. Table 55. ALERT_STATUS Register Field Descriptions
        8. 7.6.5.8  CURR_ALERT_LO_STATUS Register (address = 7Ch) [reset = 00h]
          1. Table 56. CURR_ALERT_LO_STATUS Register Field Descriptions
        9. 7.6.5.9  CURR_ALERT_HI_STATUS Register (address = 7Dh) [reset = 00h]
          1. Table 57. CURR_ALERT_HI_STATUS Register Field Descriptions
        10. 7.6.5.10 CURR_ALERT_STATUS Register (address = 7Eh) [reset = 00h]
          1. Table 58. CURR_ALERT_STATUS Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multiplexer Input Connection
      2. 8.1.2 Selecting an ADC Input Buffer
    2. 8.2 Typical Applications
      1. 8.2.1 1-MSPS DAQ Circuit With Lowest Distortion and Noise Performance
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 8-Channel Photodiode Detector With Smallest Size and Lowest Number of Components
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 1-MSPS DAQ Circuit for Factory Automation
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Analog Signal Path
      2. 10.1.2 Grounding and PCB Stack-Up
      3. 10.1.3 Decoupling of Power Supplies
      4. 10.1.4 Reference Decoupling
      5. 10.1.5 Reference Buffer Decoupling
      6. 10.1.6 Multiplexer Input Decoupling
      7. 10.1.7 ADC Input Decoupling
      8. 10.1.8 Example Schematic
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RHB Package
32-Pin VQFN
Top View

Pin Functions

PIN FUNCTION DESCRIPTION
NAME NO.
ADC-INM 20 Analog input Negative ADC analog input
ADC-INP 17 Analog input Positive ADC analog input
AIN0 9 Analog input Analog input channel 0
AIN1 10 Analog input Analog input channel 1
AIN2 11 Analog input Analog input channel 2
AIN3 12 Analog input Analog input channel 3
AIN4 13 Analog input Analog input channel 4
AIN5 14 Analog input Analog input channel 5
AIN6 15 Analog input Analog input channel 6
AIN7 16 Analog input Analog input channel 7
AIN-COM 8 Analog input Common analog input
ALERT 22 Digital output Digital ALERT output; active high.
This pin is the output of the logical OR of the enabled channel ALERTs.
AVDD 32 Power supply Analog power-supply pin. Connect a 1-µF capacitor from this pin to GND.
CS 23 Digital input Chip-select input pin; active low.
The device starts converting the active input channel on the rising edge of CS.
The device takes control of the data bus when CS is low.
The SDO-x pins go Hi-Z when CS is high.
DECAP 2 Power supply Connect a 1-µF capacitor to GND for the internal power supply.
DVDD 30 Power supply Interface power-supply pin. Connect a 1-µF capacitor from this pin to GND.
GND 1, 21, 31 Power supply Ground
MUXOUT-M 19 Analog output MUX negative analog output
MUXOUT-P 18 Analog output MUX positive analog output
READY 28 Digital output Multifunction output pin.
When CS is held high, READY reflects the device conversion status. READY is low when a conversion is in process.
When CS is low, the status of READY depends on the output protocol selection.
REFby2 7 Analog output The output voltage on this pin is equal to half the voltage on the REFP pin.
Connect a 1-µF capacitor from this pin to GND.
REFIO 3 Analog input/output Reference voltage input; internal reference is a 4.096-V output.
Connect a 1-µF capacitor from this pin to GND.
REFM 4 Analog input Reference ground potential; short this pin to GND externally.
REFP 5, 6 Analog input/output Reference buffer output, ADC reference input. Short pins 5 and 6 together.
RST 29 Digital input Asynchronous reset input pin.
A low pulse on the RST pin resets the device. All register bits return to their default states.
SCLK 25 Digital input Clock input pin for the serial interface.
All system-synchronous data transfer protocols are timed with respect to the SCLK signal.
SDI 24 Digital input Serial data input pin.
This pin is used to transfer data or commands into the device.
SDO-0 26 Digital output Serial communication pin: data output 0.
SDO-1/ SEQSTS 27 Digital output Multifunction output pin. By default, this pin indicates the channel scanning status in the auto and custom channel sequence modes.
In dual SDO data transfer mode this pin functions as a serial communication pin: data output 1.
Thermal pad Supply Exposed thermal pad; connect to GND.