SBAS817C November   2017  – November 2019 ADS8166 , ADS8167 , ADS8168

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      ADS816x Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Multiplexer
        1. 7.3.1.1 Multiplexer Configurations
        2. 7.3.1.2 Multiplexer With Minimum Crosstalk
        3. 7.3.1.3 Early Switching for Direct Sensor Interface
      2. 7.3.2 Reference
        1. 7.3.2.1 Internal Reference
        2. 7.3.2.2 External Reference
      3. 7.3.3 Reference Buffer
      4. 7.3.4 REFby2 Buffer
      5. 7.3.5 Converter Module
        1. 7.3.5.1 Internal Oscillator
        2. 7.3.5.2 ADC Transfer Function
      6. 7.3.6 Low-Dropout Regulator (LDO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Channel Selection Using Internal Multiplexer
        1. 7.4.1.1 Manual Mode
        2. 7.4.1.2 On-The-Fly Mode
        3. 7.4.1.3 Auto Sequence Mode
        4. 7.4.1.4 Custom Channel Sequencing Mode
      2. 7.4.2 Digital Window Comparator
    5. 7.5 Programming
      1. 7.5.1 Data Transfer Protocols
        1. 7.5.1.1 Enhanced-SPI Interface
          1. 7.5.1.1.1 Protocols for Configuring the Device
          2. 7.5.1.1.2 Protocols for Reading From the Device
            1. 7.5.1.1.2.1 SPI Protocols With a Single SDO
            2. 7.5.1.1.2.2 SPI Protocols With Dual SDO
            3. 7.5.1.1.2.3 Clock Re-Timer Data Transfer
              1. 7.5.1.1.2.3.1 Output Bus Width Options
      2. 7.5.2 Register Read/Write Operation
    6. 7.6 Register Maps
      1. 7.6.1 Interface and Hardware Configuration Registers
        1. 7.6.1.1 REG_ACCESS Register (address = 00h) [reset = 00h]
          1. Table 11. REG_ACCESS Register Field Descriptions
        2. 7.6.1.2 PD_CNTL Register (address = 04h) [reset = 00h]
          1. Table 12. PD_CNTL Register Field Descriptions
        3. 7.6.1.3 SDI_CNTL Register (address = 008h) [reset = 00h]
          1. Table 13. SDI_CNTL Register Field Descriptions
        4. 7.6.1.4 SDO_CNTL1 Register (address = 0Ch) [reset = 00h]
          1. Table 14. SDO_CNTL1 Register Field Descriptions
        5. 7.6.1.5 SDO_CNTL2 Register (address = 0Dh) [reset = 00h]
          1. Table 15. SDO_CNTL2 Register Field Descriptions
        6. 7.6.1.6 SDO_CNTL3 Register (address = 0Eh) [reset = 00h]
          1. Table 16. SDO_CNTL3 Register Field Descriptions
        7. 7.6.1.7 SDO_CNTL4 Register (address = 0Fh) [reset = 00h]
          1. Table 17. SDO_CNTL4 Register Field Descriptions
        8. 7.6.1.8 DATA_CNTL Register (address = 10h) [reset = 00h]
          1. Table 18. DATA_CNTL Register Field Descriptions
        9. 7.6.1.9 PARITY_CNTL Register (address = 11h) [reset = 00h]
          1. Table 19. PARITY_CNTL Register Field Descriptions
      2. 7.6.2 Device Calibration Registers
        1. 7.6.2.1 OFST_CAL Register (address = 18h) [reset = 00h]
          1. Table 21. OFST_CAL Register Field Descriptions
        2. 7.6.2.2 REF_MRG1 Register (address = 19h) [reset = 00h]
          1. Table 22. REF_MRG1 Register Field Descriptions
        3. 7.6.2.3 REF_MRG2 Register (address = 1Ah) [reset = 00h]
          1. Table 24. REF_MRG2 Register Field Descriptions
        4. 7.6.2.4 REFby2_MRG Register (address = 1Bh) [reset = 00h]
          1. Table 25. REFby2_MRG Register Field Descriptions
      3. 7.6.3 Analog Input Configuration Registers
        1. 7.6.3.1 AIN_CFG Register (address = 24h) [reset = 00h]
          1. Table 28. AIN_CFG Register Field Descriptions
        2. 7.6.3.2 COM_CFG Register (address = 27h) [reset = 00h]
          1. Table 29. COM_CFG Register Field Descriptions
      4. 7.6.4 Channel Sequence Configuration Registers Map
        1. 7.6.4.1 DEVICE_CFG Register (address = 1Ch) [reset = 00h]
          1. Table 31. DEVICE_CFG Register Field Descriptions
        2. 7.6.4.2 CHANNEL_ID Register (address = 1Dh) [reset = 00h]
          1. Table 33. CHANNEL_ID Register Field Descriptions
        3. 7.6.4.3 SEQ_START Register (address = 1Eh) [reset = 00h]
          1. Table 35. SEQ_START Register Field Descriptions
        4. 7.6.4.4 SEQ_ABORT Register (address = 1Fh) [reset = 00h]
          1. Table 36. SEQ_ABORT Register Field Descriptions
        5. 7.6.4.5 ON_THE_FLY_CFG Register (address = 2Ah) [reset = 00h]
          1. Table 37. ON_THE_FLY_CFG Register Field Descriptions
        6. 7.6.4.6 AUTO_SEQ_CFG1 Register (address = 80h) [reset = 00h]
          1. Table 38. AUTO_SEQ_CFG1 Register Field Descriptions
        7. 7.6.4.7 AUTO_SEQ_CFG2 Register (address = 82h) [reset = 00h]
          1. Table 39. AUTO_SEQ_CFG2 Register Field Descriptions
        8. 7.6.4.8 Custom Channel Sequencing Mode Registers
          1. 7.6.4.8.1 CCS_START_INDEX Register (address = 88h) [reset = 00h]
            1. Table 41. CCS_START_INDEX Register Field Descriptions
          2. 7.6.4.8.2 CCS_END_INDEX Register (address = 89h) [reset = 00h]
            1. Table 42. CCS_END_INDEX Register Field Descriptions
          3. 7.6.4.8.3 CCS_SEQ_LOOP Register (address = 8Bh) [reset = 00h]
            1. Table 43. CCS_SEQ_LOOP Register Field Descriptions
          4. 7.6.4.8.4 CCS_CHID_INDEX_m Registers (address = 8C, 8E, 90, 92, 94, 96, 98, 9A, 9C, 9E, A0, A2, A4, A6, A8, and AAh) [reset = 00h]
            1. Table 44. CCS_CHID_INDEX_m Register Field Descriptions
          5. 7.6.4.8.5 REPEAT_INDEX_m Registers (address = 8D, 8F, 91, 93, 95, 97, 99, 9B, 9D, 9F, A1, A3, A5, A7, A9, and ABh) [reset = 00h]
            1. Table 45. REPEAT_INDEX_m Register Field Descriptions
      5. 7.6.5 Digital Window Comparator Configuration Registers Map
        1. 7.6.5.1  ALERT_CFG Register (address = 2Eh) [reset = 00h]
          1. Table 47. ALERT_CFG Register Field Descriptions
        2. 7.6.5.2  HI_TRIG_AINx[15:0] Register (address = 4Dh to 30h) [reset = 0000h]
          1. Table 49. HI_TRIG_AINx[15:0] Registers Field Descriptions
        3. 7.6.5.3  LO_TRIG_AINx[15:0] Register (address = 71h to 54h) [reset = 0000h]
          1. Table 51. LO_TRIG_AINx[15:0] Registers Field Descriptions
        4. 7.6.5.4  HYSTERESIS_AINx[7:0] Register (address = 4Fh to 33h) [reset = 00h]
          1. Table 52. HYSTERESIS_AINx[7:0] Register Field Descriptions
        5. 7.6.5.5  ALERT_LO_STATUS Register (address = 78h) [reset = 00h]
          1. Table 53. ALERT_LO_STATUS Register Field Descriptions
        6. 7.6.5.6  ALERT_HI_STATUS Register (address = 79h) [reset = 00h]
          1. Table 54. ALERT_HI_STATUS Register Field Descriptions
        7. 7.6.5.7  ALERT_STATUS Register (address = 7Ah) [reset = 00h]
          1. Table 55. ALERT_STATUS Register Field Descriptions
        8. 7.6.5.8  CURR_ALERT_LO_STATUS Register (address = 7Ch) [reset = 00h]
          1. Table 56. CURR_ALERT_LO_STATUS Register Field Descriptions
        9. 7.6.5.9  CURR_ALERT_HI_STATUS Register (address = 7Dh) [reset = 00h]
          1. Table 57. CURR_ALERT_HI_STATUS Register Field Descriptions
        10. 7.6.5.10 CURR_ALERT_STATUS Register (address = 7Eh) [reset = 00h]
          1. Table 58. CURR_ALERT_STATUS Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multiplexer Input Connection
      2. 8.1.2 Selecting an ADC Input Buffer
    2. 8.2 Typical Applications
      1. 8.2.1 1-MSPS DAQ Circuit With Lowest Distortion and Noise Performance
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 8-Channel Photodiode Detector With Smallest Size and Lowest Number of Components
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 1-MSPS DAQ Circuit for Factory Automation
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Analog Signal Path
      2. 10.1.2 Grounding and PCB Stack-Up
      3. 10.1.3 Decoupling of Power Supplies
      4. 10.1.4 Reference Decoupling
      5. 10.1.5 Reference Buffer Decoupling
      6. 10.1.6 Multiplexer Input Decoupling
      7. 10.1.7 ADC Input Decoupling
      8. 10.1.8 Example Schematic
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at AVDD = 5 V, DVDD = 1.65 V to 5.5 V, REFIO configured as output pin, and maximum throughput (unless otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUTS
CSH ADC Input capacitance 60 pF
CINMUX MUX Input capacitance 13 pF
ILMUX_ON MUX input on-channel leakage current REFM < VIN < REFP –750 ±10 750 nA
DC PERFORMANCE
Resolution 16 Bits
NMC No missing codes 16
INL Integral nonlinearity –0.8 ±0.35 0.8 LSB
DNL Differential nonlinearity –0.5 ±0.2 0.5 LSB
VOS Input offset error –10 ±0.5 10 LSB
Input offset error match –1 ±0.5 1 LSB
dVOS/dT Input offset thermal drift 0.25 µV/°C
GE Gain error Referred to REFIO –0.06 ±0.002 0.06 %FSR
Gain error match Referred to REFIO –0.005 ±0.0025 0.005 %FSR
dGE/dT Gain error thermal drift Referred to REFIO ±1 ppm/°C
TNS Transition noise VIN = VREF/2 0.6 LSB
AC PERFORMANCE
SINAD Signal-to-noise + distortion fIN = 2 kHz 91.6 93.5 dB
SNR Signal-to-noise-ratio fIN = 2 kHz 91.8 93.6 dB
THD Total harmonic distortion fIN = 2 kHz -110 dB
SFDR Spurious-free dynamic range fIN = 2 kHz 112 dB
Isolation crosstalk fIN = 100 kHz -115 dB
REFERENCE BUFFER
VRO Reference buffer offset voltage VRO = VREFP - VREFIO, TA = 25°C –250 250 µV
CREFP Decoupling capacitor on REFP 22 µF
RESR External series resistance 0 1.3 Ω
REFby2 BUFFER
VREFby2 REFby2 output voltage VREFP/2 V
IREFby2 DC Sourcing current from REFby2 2 mA
CREFby2 Decoupling capacitor on REFby2 1 µF
INTERNAL REFERENCE OUTPUT
VREFIO REFIO output voltage(1) TA = 25°C, REFIO configured as output pin 4.091 4.096 4.101 V
dVREFIO/dT Internal reference temperature drift 4 18 ppm/°C
CREFIO Decoupling capacitor on REFIO REFIO configured as output 1 µF
EXTERNAL REFERENCE INPUT
IREFIO REFIO input current REFIO configured as input pin 0.1 1 µA
CREF Internal capacitance on REFIO pin REFIO configured as input pin 10 pF
SAMPLING DYNAMICS
Aperture delay 4 ns
tj-RMS Aperture jitter 2 ps RMS
f-3-dB(small) Small-signal bandwidth Measured at ADC inputs 23 MHz
POWER SUPPLY CURRENTS
IAVDD Analog supply current ADS8168, AVDD = 5 V 5.3 6.4 mA
ADS8167, AVDD = 5 V 3.9 5
ADS8166, AVDD = 5 V 3 4.1
Static, no conversion 2.3
Static, PD_REFBUF = 1 1.6
Static, PD_REF = 1 800 µA
Static, PD_REFBUF, PD_REF and PD_REFby2 = 1 180 µA
IDVDD Digital supply current DVDD = 3 V, CLOAD = 10 pF, no conversion 0.45 µA
(1) Does not include the variation in voltage resulting from solder effects.